JPS6350859B2 - - Google Patents
Info
- Publication number
- JPS6350859B2 JPS6350859B2 JP58149547A JP14954783A JPS6350859B2 JP S6350859 B2 JPS6350859 B2 JP S6350859B2 JP 58149547 A JP58149547 A JP 58149547A JP 14954783 A JP14954783 A JP 14954783A JP S6350859 B2 JPS6350859 B2 JP S6350859B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- block
- wiring layer
- layer
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58149547A JPS5956742A (ja) | 1983-08-18 | 1983-08-18 | 半導体装置の |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58149547A JPS5956742A (ja) | 1983-08-18 | 1983-08-18 | 半導体装置の |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9541876A Division JPS5321584A (en) | 1976-08-12 | 1976-08-12 | Wiring system of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5956742A JPS5956742A (ja) | 1984-04-02 |
| JPS6350859B2 true JPS6350859B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-10-12 |
Family
ID=15477534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58149547A Granted JPS5956742A (ja) | 1983-08-18 | 1983-08-18 | 半導体装置の |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5956742A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07120709B2 (ja) * | 1985-03-22 | 1995-12-20 | 日本電気株式会社 | 半導体集積回路の配線方式 |
-
1983
- 1983-08-18 JP JP58149547A patent/JPS5956742A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5956742A (ja) | 1984-04-02 |
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