JPS6350847Y2 - - Google Patents

Description

[Detailed description of the invention] Industrial application field This invention is based on the following method: After exposing and transferring a pattern for forming semiconductor elements onto a resist film on the surface of a semiconductor wafer,
The present invention relates to a manufacturing apparatus for semiconductor devices used for developing and forming patterns, and in particular to a manufacturing apparatus that facilitates the treatment of waste liquid.

2. Description of the Related Art Semiconductor devices such as ICs are manufactured using semiconductor wafers (hereinafter simply referred to as wafers) as substrates, which are subjected to various processes. There is a step of exposing and transferring a pattern for forming a semiconductor element onto a resist (hereinafter simply referred to as a resist), developing it, and making holes. This step is a step in which a resist is applied to the surface of the wafer, then a mask is placed on the wafer, the wafer is exposed to light, and after the exposure, a development process is performed to remove unnecessary portions of the resist and to form holes along the pattern.

By the way, in order to attach a developer to the surface of a wafer during the development process, conventionally, a large number of wafers are housed in a carrier from the viewpoint of workability, and the wafers are immersed together with the carrier in the developer. Therefore, a large amount of developer was required.

On the other hand, there are two types of developer, negative type and positive type, depending on the resist.Recently, as the degree of integration has increased, positive type resists, which can form fine patterns, are often used, and accordingly, positive type developers has come to be used. This positive developing solution uses a developer containing, for example, tetramethylammonium hydroxide, which is highly toxic and harmful, so it is necessary to reduce the amount used, and improvements to conventional equipment are desired. Ta.

Therefore, as a device for reducing the amount of developer used, as shown in FIG. Such devices have come into use. In this device, a wafer 1 that has been exposed is placed on a rotary table 2 and fixed by vacuum suction, and then an appropriate amount of developer is supplied to the center of the wafer 1.
The rotary table 2 is rotated by the motor 4 at an appropriate speed to diffuse the developer, and the centrifugal force during rotation causes the developer to spread and adhere to the entire surface of the wafer 1. When the color spreads over the entire surface, the rotary table 2 is kept stationary or rotated at low speed for a predetermined period of time to perform development processing. When the development process is completed, the rotary table 2 is rotated at high speed, and the developer liquid blown away by centrifugal force from the periphery of the wafer 1 is collected by descending along the side wall 3a of the processing container 3, and is collected through a discharge port formed in the bottom part 3b. Discharge from 5. After this, a large amount of cleaning water is supplied to the surface of the wafer 1 while the rotary table 2 is kept rotating at high speed, the developer is washed away with the cleaning water, and a mixture of the developer and the cleaning water is blown away by centrifugal force. is lowered along the side wall 3a of the processing container 3, collected, and discharged from the discharge port 5,
Wastewater is treated with a purification device.

Problems to be Solved by the Invention According to the above device, an appropriate amount of developer is supplied onto the wafer 1, and the developer is spread by centrifugal force and supplied to the entire surface of the wafer 1. Therefore, compared to the immersion method, the developing solution is The amount of liquid used is significantly reduced. However, in the above device, the developer and cleaning water discharged after development and during cleaning are both discharged from the outlet 5 of the processing container 3 and purified in the purification device, so a large amount of developer and cleaning water are used. The waste water was mixed and sent to a purification device, making it difficult to treat the wastewater and also difficult to separate and recover the developer. Therefore, it became a large purification device.

Means for Solving the Problems This invention consists of a rotary table that holds a wafer, a first drive motor whose rotation can be controlled to rotate the rotary table, and first and second drive motors that discharge waste liquid to two locations at the bottom. an outer container that forms a discharge port and surrounds the rotary table; and an outer container that is rotatably disposed between the rotary table and the outer container and surrounds the rotary table; A manufacturing apparatus is constituted by an inner container having a discharge port or a third discharge port that coincides with the second discharge port, and a second drive motor that rotates the inner container.

Function When supplying the developer and after development, align the first outlet of the outer container with the third outlet of the inner container,
The waste liquid containing the developer is discharged from the third discharge port via the first discharge port, and when cleaning, the second discharge port of the outer container and the third discharge port of the inner container are aligned, and the cleaning water and The waste liquid containing the developer is discharged from the third discharge port through the first discharge port, and the waste liquid with a high concentration of the developer and the waste liquid with a low concentration are discharged and treated separately. be.

Embodiment FIGS. 1 and 2 are a sectional view and a plan view showing an embodiment of the present invention. In the figures, 10 is a rotary table, which is composed of a mounting table 11 for holding a wafer 1 and a column 12. The mounting table 11 is provided with suitable vacuum chuck means (not shown) for fixing the wafer 1. This rotary table 10 is rotatably supported by a support 12. A first drive motor 13 rotates the rotary table 10, and its output shaft is connected to the column 12 of the rotary table 10. The first drive motor 13 has a rotationally controllable structure, and the rotation speed of the rotary table 10 can be varied by arbitrarily setting the rotation speed. Reference numeral 14 denotes a bottomed cylindrical outer container that surrounds the rotary table 10, and has a first outlet 15 and a second outlet for discharging waste liquid to two locations on a concentric circle of the bottom 14a.
A discharge port 16 is formed, and the side wall 14b is formed to an appropriate height. The first outlet 15 and the second outlet 16 of the outer container 14 are each connected to a purification device of a separate treatment system. Reference numeral 17 denotes a cylindrical rotary tube that covers the column 12 of the rotary table 10, and is rotatably attached to the outer container 14 by penetrating the center of the bottom 14a. Reference numeral 18 denotes an inner container provided between the rotary table 10 and the outer container 14, which has a bottomed cylindrical shape with a smaller diameter than the outer container 14, and has a first outlet 15 and a second outlet 16 of the outer container 14 at the bottom 18a. A third outlet 19 having a smaller diameter than these is formed in correspondence with the above. Further, the inner container 18 has a bottom portion 18a inclined so that the third discharge port 19 is at the lowest position, a side wall 18b extending to a position sufficiently higher than the rotary table 10, and an upper end periphery 18.
b' is tilted toward the center to prevent the waste liquid that hits it from being reflected downward to the inside and splashing out to the outside. The inner container 18 is integrally connected to the rotary cylinder 17 by penetrating the central part of the bottom 18a. A second drive motor 20 rotates the rotary cylinder 17, and its output shaft 20a and the lower part of the rotary cylinder 17 are connected by an appropriate power transmission means 21. Therefore, when the second drive motor 20 operates, the power transmission means 21
The rotary cylinder 17 rotates through the inner container 18.
rotates.

The manufacturing device having the above structure has a second
The drive motor 20 operates to rotate the rotary cylinder 17 via the power transmission means 21, thereby rotating the inner container 18 by a predetermined angle to connect the third outlet 19 of the inner container 18 and the third outlet port 19 of the outer container 14. 1 and the discharge port 15 of No. 1. Thereafter, the operation of the second drive motor 20 is stopped, and the exposed wafer 1 is transferred to the rotary table 1.
0 and fixed on the mounting table 11. Next, an appropriate amount of developer is supplied to the center of the wafer 1, and then the first drive motor 13 is rotated at a low rotation speed, and the rotary table 10 is rotated at an optimum speed for spreading the developer. The developer is spread over the entire surface of the wafer 1 by the centrifugal force generated during rotation. Once the developer has spread over the entire surface of the wafer 1, the rotary table 10 is kept stationary or rotated at low speed for a predetermined period of time to perform the development process. When the development process is completed, the rotary table 10 is rotated at high speed, and the developer blown away from the periphery of the wafer 1 by centrifugal force is transferred to the inner container 1.
It hits the side wall 18b of the outer container 14 and falls downward, becomes waste liquid, flows through the bottom 18a, is discharged from the third discharge port 19 to the first discharge port 15 of the outer container 14, and is further discharged from the first discharge port 15 to the outside. and the developer is collected.

When cleaning the developer on the wafer 1, the second drive motor 20 operates again to clean the rotating cylinder 17 and the inner container 1.
8 by a predetermined angle to connect the third outlet 19 of the inner container 18 and the outer container 1 as shown in FIGS. 3 and 4.
4 and the second discharge port 16 of No. 4. Thereafter, the first drive motor 13 is rotated at a high rotational speed to rotate the rotary table 10 at high speed, thereby generating a strong centrifugal force on the wafer 1. In this state, a large amount of cleaning water is supplied to the wafer 1, and the cleaning liquid is flowed over the wafer 1 by centrifugal force to wash away the developer. The cleaning water and developer that are blown away by centrifugal force from the periphery of the wafer 1 fall against the side wall 18b of the inner container 18, become waste liquid, flow through the bottom 18a, and flow through the third outlet 19 to the third outlet of the outer container 14. The waste water is discharged to the second discharge port 16, further discharged to the outside from the second discharge port 16, and is treated as waste water in a purification device to separate the cleaning water and the developer.

When the cleaning of the wafer 1 is completed, the rotation of the first drive motor 13 is stopped, the wafer 1 is taken out from the mounting table 11 of the rotary table 10, and the above-described operation is repeated to develop the wafer 1. conduct.

It should be noted that the first outlet 15 and the second outlet 16 do not need to be provided at 180° different locations as shown in the figure, but may be adjacent to each other.

Effects of the invention This invention separates the waste liquid generated when the developer is supplied to the wafer, the waste liquid generated after development, and the waste liquid generated when cleaning water is supplied by rotating the inner container, discharges them separately, and purifies them separately. Moreover, since most of the former waste liquid is developer, the developer can be easily removed, and the latter waste liquid is mostly cleaning water, so wastewater treatment can be easily performed. can remove harmful components.
Furthermore, since the waste liquid processing capacity is increased, the developing ability is also increased as a result, and workability is improved. Furthermore, since the developer and washing water can be reliably separated from the waste liquid, running costs can also be reduced.

[Brief explanation of the drawing]

Figure 1 is a sectional view of the manufacturing equipment according to the present invention, Figure 2
3 is a sectional view of the manufacturing apparatus during cleaning, FIG. 4 is a plan view of the manufacturing apparatus during cleaning, and FIG. 5 is a sectional view of the conventional manufacturing apparatus. 1...Wafer, 10...Rotary table, 11
...Placement table, 12... Strut, 13... First drive motor, 14... Outer container, 15... First discharge port, 16... Second discharge port, 17... Rotating tube, 1
8...Inner container, 19...Third outlet, 20...
A second drive motor.

Claims (1)

[Scope of utility model registration request] It has a rotary table that holds a wafer, a first drive motor that rotates the rotary table and can control its rotation, and a first and second outlet for discharging waste liquid at two places at the bottom. A surrounding outer container is rotatably provided between the rotary table and the outer container, surrounds the rotary table, and is provided at a location on the bottom that coincides with the first outlet or the second outlet of the outer container. An inner container forming a third outlet for discharging waste liquid, and a second inner container for rotating the inner container.
1. A semiconductor device manufacturing apparatus comprising: a drive motor;