JP2753492B2 - Developing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a developing device.

(Prior Art) Generally, in a semiconductor manufacturing process, a fine circuit pattern is transferred onto a substrate such as a semiconductor wafer by a photolithographic technique using a photoresist. That is, after applying a photoresist film on a surface of a semiconductor wafer or the like by a resist coating device that applies a photoresist by so-called spin coating, a baking device that performs a heat treatment, and the like, and performing exposure through a mask of a predetermined pattern, Development is performed by a developing device to form a predetermined resist pattern, and a predetermined circuit pattern is formed by using the resist pattern, for example, by etching, forming a thin film, or the like.

In the semiconductor manufacturing process described above, a developing device that develops a photoresist applied to the surface of a substrate such as a semiconductor wafer is conventionally configured as follows, for example.

That is, the developing device is provided with a wafer mounting table that holds the semiconductor wafer by, for example, a vacuum chuck,
A drive mechanism is connected to the wafer mounting table so that the semiconductor wafer held on the wafer mounting table can be rotated. In addition, above the wafer mounting table, a predetermined developing solution,
A nozzle for supplying a processing liquid such as a rinsing liquid is provided. Then, a predetermined developing solution, a rinsing solution or the like is supplied from the nozzle to the semiconductor wafer held on the wafer mounting table to perform a predetermined developing process, and the semiconductor wafer is rotated by a driving mechanism, and the developing solution is rotated. It is configured to remove (dry) a rinsing liquid or the like.

Further, in such a developing device, a so-called cup is provided so as to surround the periphery of the semiconductor wafer and constitute a processing chamber, and the developing solution, the rinsing liquid and the like scattered in the cup with the rotation of the semiconductor wafer are processed. The liquid is configured to be discharged to a drain tank or the like by a discharge line connected to a lower end of the cup.

(Problems to be Solved by the Invention) In the conventional developing device described above, for example, if a semiconductor wafer is eccentrically supported and rotated at a high speed, or if a warped semiconductor wafer is mixed, adsorption becomes unstable, and If the semiconductor wafer is rotated at a high speed in this state, the semiconductor wafer may be damaged. Or, if small articles such as screws are dropped into the cup during maintenance, these semiconductor wafer fragments and solids such as screws enter the discharge line for discharging the processing liquid, and are clogged in the discharge line. May occur.

However, in the conventional developing device, when the above-described clogging occurs, it is difficult to remove solids such as, for example, debris of semiconductor wafers and screws from a processing liquid discharge line. There was a problem of cost.

There is also a problem that mist-like developer or the like is mixed into an exhaust line for exhausting.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a developing device that can easily perform maintenance of a processing liquid discharge line in a shorter time than in the related art.

[Constitution of the Invention] (Means for Solving the Problems) That is, according to the present invention, in a developing apparatus for supplying a processing liquid to a substrate and developing a photoresist applied to the substrate, the processing liquid discharge line In addition, a detachable filter mechanism for restricting inflow of solid matter is provided.

According to a second aspect of the present invention, in the developing device according to the first aspect, the filter mechanism is formed of a mesh-like member formed in an annular shape, and is provided at a bottom portion of a processing chamber that houses the substrate. .

According to a third aspect of the present invention, in the developing device according to the first aspect, at least a part of an exhaust path for supplying a processing liquid to the substrate and exhausting the processing liquid from a processing chamber for developing a photoresist applied to the substrate. A cooling mechanism is provided.

According to a fourth aspect of the present invention, in the developing device according to the first aspect, the processing liquid is supplied to the substrate, and an exhaust path for exhausting from a processing chamber for developing a photoresist applied to the substrate is provided. A gas-liquid separation mechanism is provided in which an inlet-side exhaust pipe communicating with the processing chamber is connected, a drain pipe is connected to a bottom portion, and an outlet-side exhaust pipe is connected to a side surface.

According to a fifth aspect of the present invention, in the developing device according to the fourth aspect, the gas-liquid separation mechanism is configured such that the exhaust gas introduced from the inlet-side exhaust pipe temporarily goes downward and closes a vicinity of a connection portion of the drain pipe. It is configured to rise after passing through and to be led out from the outlet side exhaust pipe.

According to a sixth aspect of the present invention, in the developing device according to the fourth aspect, a cooling mechanism is provided in the inlet-side exhaust pipe and the outlet-side exhaust pipe.

(Operation) In the developing device of the present invention having the above-described configuration, the detachable filter mechanism for restricting the inflow of solids is provided in the processing liquid discharge line. Therefore, for example, solids such as fragments of semiconductor wafers and screws are captured by the filter mechanism, so that the solids can be easily removed in a short time by removing the filter mechanism.

Further, in the developing device according to the third to sixth aspects, a mist-like substance and the like in the exhaust gas can be captured by a gas-liquid separation mechanism and a cooling mechanism provided in the exhaust path, and the mist-like developer and the like can be captured. Can be prevented from entering the exhaust line that exhausts air.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The developing device 1 is provided with a cup 3 surrounding the periphery of the semiconductor wafer 2. The semiconductor wafer 2 is held in the cup 3 by, for example, a vacuum chuck, and the semiconductor wafer 2 is A mounting table 5 configured to be rotatable is provided.

Further, a nozzle for supplying a predetermined processing liquid to the surface of the semiconductor wafer 2, for example, a developing liquid supply nozzle 6 and a rinsing liquid supply nozzle 7 are provided on an upper portion of the mounting table 5. A processing liquid discharge pipe 8 for discharging a processing liquid such as a developer and a rinsing liquid scattered in the cup 3 and an exhaust pipe 9 for exhausting the inside of the cup 3 are connected. A filter, for example, a stainless steel mesh, for preventing the inflow of solid matter is also provided at the inlet of the exhaust pipe 9 in a detachable manner.

Further, a detachable cylindrical filter accommodating portion 10 is interposed in the treatment liquid discharge pipe 8, and a filter 11 made of, for example, a stainless steel mesh or the like is provided in the filter accommodating portion 10. It is provided detachably. A processing liquid discharge pipe 8 is connected to the bottom of the filter housing 10 so as to protrude into the filter housing 10, and a tray 12 formed of, for example, stainless steel or the like is formed around the processing liquid discharge pipe 8. It is provided detachably.

On the other hand, a mist trap 13 formed in a container shape from a material such as stainless steel is inserted in the exhaust pipe 9. That is, the mist trap 13 forms an exhaust gas flow inside as shown by arrows in the drawing by exhausting from the exhaust pipe 9 connected to the side portion, and separates the mist in the exhaust gas to be connected to the lower portion. The mist component is discharged from the drain pipe 14. Further, for example, a cooling water circulation mechanism 15 is provided as a cooling mechanism in the exhaust pipe 9 on the inlet side and the exhaust pipe 9 on the outlet side connected to the mist trap 13. The mist in the gas can be efficiently separated. The discharge pipe 9 on the outlet side, that is, the exhaust pipe 9 for connecting the mist trap 13 to an exhaust device (not shown) is positioned above the side surface of the mist trap 13 at an angle of, for example, 5 degrees with respect to the horizontal direction. It is connected so that it goes to. This is because the mist attached to the exhaust pipe 9 is dropped into the mist trap 13 and discharged from the drain pipe 14.

The developing device 1 having the above configuration includes, for example, a resist coating device that applies a photoresist to a semiconductor wafer by spin coating, a baking device that performs a baking process for volatilizing a solvent from a resist film after resist application, and a mask having a predetermined pattern. It is arranged in a resist processing device and the like together with an exposure device and the like for performing exposure through the device.

Then, the semiconductor wafer 2 that has been subjected to processes such as photoresist coating, baking, and exposure is placed on the mounting table 5, a predetermined developing solution is supplied onto the semiconductor wafer 2 from the developing solution supply nozzle 6, and development is performed for a predetermined time. Is performed, the driving mechanism 4
The developing of the photoresist is performed by rotating the semiconductor wafer 2 to remove the developing solution by centrifugal force and rinsing by supplying a rinsing solution (for example, pure water) from the rinsing solution supply nozzle 7.

At this time, the processing liquid such as the developing liquid and the rinsing liquid used for the processing flows into the filter housing 10 from the bottom of the cup 3 through the processing liquid discharge pipe 8 once. Then, after passing through the filter 11, it falls into the tray 12, and the tray 12
The processing liquid is discharged from inside by a processing liquid discharge pipe 8 connected to the bottom so as to overflow.

Therefore, even when, for example, the semiconductor wafer 2 is damaged by an erroneous operation, or when small articles such as screws are dropped into the cup 3 during maintenance, for example, these solids are removed from the filter 11 and the receiving tray.
Supplemented by 12, these filters 11 and saucer
The 12 can be easily removed from the discharge line by washing.

In the above-described embodiment, the example in which the filter 11 is provided in the filter accommodating portion 10 interposed in the treatment liquid discharge pipe 8 has been described. However, for example, as shown in FIGS. A filter 11a made of an annular stainless mesh or the like may be provided.

[Effects of the Invention] As described above, according to the developing device of the present invention, maintenance of the processing liquid discharge line can be easily performed in a shorter time than in the related art.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a developing device according to one embodiment of the present invention,
FIG. 2 is a diagram showing a configuration of a developing device of another embodiment, and FIG. 3 is a diagram showing a configuration of a filter of the developing device of FIG. 1 ... developing device, 2 ... semiconductor wafer, 3 ... cup,
4 ... Driving mechanism, 5 ... Placement table, 6 ... Developer supply nozzle, 7 ... Rinse liquid supply nozzle, 8 ... Treatment liquid discharge pipe, 9 ... Exhaust pipe, 10 ... Filter housing part, 11 ...... Filter, 12 ... Sink, 13 ... Mist trap, 14 ...
Drain piping, 15… Cooling water circulation mechanism.

Claims (6)

(57) [Claims] 1. A developing device for supplying a processing liquid to a substrate and developing a photoresist applied to the substrate, wherein the developing device is detachably configured to restrict an inflow of a solid matter into a discharge line of the processing liquid. A developing device provided with a filter mechanism. 2. The developing device according to claim 1, wherein said filter mechanism is formed of a mesh-like member formed in an annular shape, and is provided at a bottom of a processing chamber accommodating said substrate. . 3. The developing device according to claim 1, wherein a cooling mechanism is provided in at least a part of an exhaust path for supplying a processing liquid to the substrate and exhausting the processing liquid from a processing chamber for developing a photoresist applied to the substrate. A developing device comprising: 4. The developing apparatus according to claim 1, wherein a processing liquid is supplied to said substrate, and a processing chamber for developing a photoresist applied to said substrate is exhausted from said processing chamber. And a gas-liquid separation mechanism having an inlet-side exhaust pipe connected to the exhaust pipe, a drain pipe connected to the bottom, and an outlet-side exhaust pipe connected to the side face. 5. The developing device according to claim 4, wherein in the gas-liquid separation mechanism, the exhaust gas introduced from the inlet-side exhaust pipe once goes downward and passes near a connection portion of the drain pipe. A developing device that rises later and is drawn out of the outlet-side exhaust pipe. 6. The developing device according to claim 4, wherein a cooling mechanism is provided in said inlet side exhaust pipe and said outlet side exhaust pipe.