JPH0356041Y2 - - Google Patents

Description

[Detailed explanation of the invention] (1) Technical field of the invention The invention focuses on the following steps: In the photoetching process, resist stripping, water washing, and water washing are performed on the surface of each wafer or photomask substrate, which are repeated several times in the previous process.
The present invention relates to a resist processing apparatus characterized by high-speed drying.

(2) Background of the technology Recently, the density of ICs, LSIs, and transistor circuits has become higher, and as a result, the number of times the photo etching process is repeated is increasing. Photo etching is also called photo-etching, and is the first
The step is to coat the cleaned sample surface with photoresist under various conditions. In the second step, the applied photoresist is dried to evaporate the organic solvent. In the third step, a photomask is brought into close contact with the photoresist film and exposed to ultraviolet light under optimal conditions. In the fourth step, the sample surface is developed using a developer, washed with water, and then post-baked to harden the resist and achieve complete adhesion. In the fifth step, the thermally oxidized SiO ₂ film is etched using an etching solution. the last 6th
The photo-etching process is completed by removing the etched resist from the photomask area. The process of the present invention is the last photoetching process mentioned above, and surface cleaning is essential for reusing the sample. This process is related to sample reprocessing, in which the resist on the sample surface is removed using a solvent such as acetone, the sample surface is cleaned with pure water along with any residue from the resist removal, and the sample is dried. .

(3) Conventional technology and problems Conventionally, resist stripping, which is wafer reprocessing in the photoetching process, involves processing dozens of samples in a container containing a solvent such as acetone, and this process is called batch processing. There is. When treating one or several samples in this treatment step, the same amount of solvent such as acetone is required and the same amount of time is required if it is carried out in the same way as batch treatment. Therefore, solvents such as acetone are uneconomical relative to the number of samples to be treated, and the process takes too much time, resulting in poor working efficiency.

(4) Purpose of the invention In view of the above-mentioned drawbacks, the purpose of the present invention is to provide an economically useful method that requires only a small amount of solvent such as acetone when reprocessing only one or several wafers. The purpose of the present invention is to provide high-speed processing that requires less processing time than conventional methods. Another purpose is to provide high-speed processing for cleaning wafers by washing them with pure water in an operation similar to resist stripping.

(5) Structure of the invention According to the invention, the present invention provides a rotatable substrate mounting table on which a substrate coated with a resist is placed, and a rotatable substrate mounting table provided above the substrate mounting table, which does not require heating. The resist is further provided with a means for dropping an organic solvent that dissolves the resist without causing a drop, and the resist is removed by centrifugal force by dropping the organic solvent onto the substrate and rotating the substrate mounting table at high speed. This is achieved by providing a resist processing apparatus having the following characteristics.

(6) Embodiment of the invention Hereinafter, an embodiment of the invention will be described based on the drawings.

In FIGS. 1 and 2, the present embodiment has a cylindrical rotating shaft 2 that is connected to a motor, and an exhaust hole 1 is provided in the center of the upper surface of the rotary shaft 2, and radial exhaust grooves 3 that are connected to this
It has a structure in which a disk-shaped wafer fixing table 4 with The wafer is fixed and held by vacuum suction by drawing a vacuum from the exhaust groove 3 of the wafer fixing table 4 through the hole 1, and the nozzle 6, which drips the solvent from above the center of the wafer, is attached to the wafer fixing table 4. The structure is such that it is located on the center line of

An organic solvent such as acetone that does not require heating is applied to the upper surface of the wafer 5 from the nozzle 6 at
60c.c. Drop onto the resist 7 on the 5th side of the wafer.

Next, when the rotating shaft 2 is rotated at a high speed of, for example, 5,000 to 7,000 rpm, the wafer 5 also rotates, and the resist 7 and the solvent are dispersed toward the outer circumference by centrifugal force.

The same effect can also be obtained by dropping an organic solvent such as acetone that does not require heating while rotating the wafer 5.

Next, as shown in FIG. 3, pure water is discharged onto the wafer 5 from a water discharge pipe 8 provided upward between the center and the outer periphery of the wafer 5, which is being vacuum-absorbed.
The wafer 5 is washed with water while rotating the wafer table 4 at a low speed, and then the water is shaken off from the surface of the wafer 5 by rotating at a high speed. Therefore, five surfaces of the wafer are cleaned.

Next, the above-mentioned wafer 5 is placed in a baking oven to dry the residual water, thereby completing the steps necessary for reprocessing.

(7) Effects of the invention As explained above, the present invention requires less solvent when stripping resist from one or several wafers or photomask substrates compared to batch processing where resist stripping is performed from dozens of wafers. It is economical because only a very small amount is required, and the processing time is short, resulting in good work efficiency.

[Brief explanation of the drawing]

FIG. 1 is a side view of an embodiment of the resist processing apparatus of the present invention, and FIG. 2 is a plan view of the main parts of the embodiment.
FIG. 3 is a side view illustrating the wafer cleaning process in the embodiment of FIG. 1. 2...Rotation axis, 4...Wafer stand, 5...Wafer, 6...Nozzle, 7...Resist, 8...Water pipe.

Claims (1)

[Claims for Utility Model Registration] (1) A rotatable substrate mounting table on which a resist-coated substrate is placed, and a rotatable substrate mounting table provided above the substrate mounting table to melt the resist without the need for heating. a solvent dropping means for dropping an organic solvent; and after the organic solvent is dropped onto the substrate by the solvent dropping means, by rotating the substrate mounting table at high speed, the resist is moved in an outer circumferential direction by centrifugal force. 1. A resist processing apparatus, comprising means for discretely removing the resist. (2) The resist processing apparatus according to claim 1, wherein means for discharging water for cleaning the wafer is provided above the substrate mounting table.