JPS6350146B2 - - Google Patents

Info

Publication number
JPS6350146B2
JPS6350146B2 JP8004280A JP8004280A JPS6350146B2 JP S6350146 B2 JPS6350146 B2 JP S6350146B2 JP 8004280 A JP8004280 A JP 8004280A JP 8004280 A JP8004280 A JP 8004280A JP S6350146 B2 JPS6350146 B2 JP S6350146B2
Authority
JP
Japan
Prior art keywords
speed
polishing head
polishing
section
speed control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8004280A
Other languages
Japanese (ja)
Other versions
JPS578068A (en
Inventor
Toshio Sakata
Kazuaki Mizuno
Takayuki Ooshima
Nobuo Ootsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8004280A priority Critical patent/JPS578068A/en
Publication of JPS578068A publication Critical patent/JPS578068A/en
Publication of JPS6350146B2 publication Critical patent/JPS6350146B2/ja
Granted legal-status Critical Current

Links

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

【発明の詳細な説明】 本発明はコンピユータの外部記憶装置として使
用されるコーデイング磁気デイスクなどのデイス
クの研摩装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for polishing disks such as coding magnetic disks used as external storage devices for computers.

従来この種の研摩装置は、デイスクの研摩幅と
同一あるいは若干長めの研摩ヘツドを用いて砥摩
するか、砥粒を含有したカツプ型砥石により研摩
する方法が用いられている。前者の欠点として
は、研摩幅が長いことによりデイスク表面の微細
な凸凹の追従性が悪く、また研摩ヘツドが重くな
ることもデイスク面変動に対して不利であつた。
後者のカツプ型砥石は研摩性は優れる替りに微小
突起の除去が難しく近年の表面粗さの向上を要求
に答え難くなつてきた。さらにいずれの方法でも
磁気デイスクにおいてその表面粗さの向上と相俟
つてデイスク表面に塗布された磁性媒体の塗布厚
さが非線形となつた場合それを一定の傾きを有す
る膜厚とする整形研摩が行えない欠点もあつた。
Conventionally, this type of polishing apparatus has used a method in which polishing is performed using a polishing head that is the same as or slightly longer than the polishing width of the disk, or by a cup-shaped grindstone containing abrasive grains. The disadvantages of the former are that the long polishing width makes it difficult to follow minute irregularities on the disk surface, and the heavy polishing head is also disadvantageous to fluctuations in the disk surface.
Although the latter type of cup-shaped grindstone has excellent abrasiveness, it is difficult to remove minute protrusions, and it has become difficult to meet the recent demands for improved surface roughness. Furthermore, in any of the methods, when the surface roughness of a magnetic disk is improved and the coating thickness of the magnetic medium applied to the disk surface becomes non-linear, shaping polishing to make the thickness of the magnetic medium have a constant slope is necessary. There were also drawbacks to not being able to do so.

本発明はこれらの欠点を除去するために、研摩
ヘツドをデイスクに圧接して研摩しつつそのデイ
スク円周と直角方向(デイスクの半径方向と表現
する)に移動させると同時にその半径方向移動速
度を任意に制御し所要の研摩プロフアイルを得る
研摩装置を提供することを目的とする。
In order to eliminate these drawbacks, the present invention is designed to move the polishing head in a direction perpendicular to the circumference of the disk (expressed as the radial direction of the disk) while pressing the polishing head against the disk and at the same time increasing the speed of its radial movement. It is an object of the present invention to provide a polishing device that can be controlled arbitrarily to obtain a desired polishing profile.

本発明によれば研摩ヘツドを被研摩デイスクの
半径方向に移動させる研摩ヘツド移動駆動部と、
この研摩ヘツド移動駆動部の移動速度を制御する
速度制御部と、この速度制御部への速度制御信号
が変化したとき所要の変化率で速度を変化させる
速度変化率設定部と、設定した複数個の速度制御
信号をその速度変化率設定部へ順に与える速度設
定出力部と、この速度設定出力部で設定した複数
個の速度制御信号に対応する複数個から成る設定
位置可変な研摩ヘツド位置検出センサーにより前
記研摩ヘツドの位置を検出して、前記研摩ヘツド
位置検出センサーに対応して設定された速度制御
信号の出力トリガーを速度設定出力部へ与える速
度位置検出部とを有するデイスク研摩装置が実現
できる。
According to the invention, there is provided a polishing head movement drive for moving the polishing head in the radial direction of the disk to be polished;
a speed control section that controls the moving speed of the polishing head movement drive section; a speed change rate setting section that changes the speed at a required rate of change when the speed control signal to the speed control section changes; a speed setting output section that sequentially supplies a speed control signal to the speed change rate setting section; and a polishing head position detection sensor whose setting position is variable and is made up of a plurality of sensors corresponding to the plurality of speed control signals set by the speed setting output section. Accordingly, it is possible to realize a disk polishing apparatus having a speed position detection section that detects the position of the polishing head and provides an output trigger of a speed control signal set corresponding to the polishing head position detection sensor to the speed setting output section. .

次に本発明の実施例について図面を用いて詳細
に説明する。
Next, embodiments of the present invention will be described in detail using the drawings.

第1図は一例としての磁気デイスクの研摩状態
を、第2図は一実施例の構成を示すブロツク図
を、第3図は研摩プロフアイルをそれぞれ表わ
す。第1図において、研摩ヘツド1は研摩テープ
2を所定の圧力で磁気デイスク3の表面を加圧し
つつ内周から外周へと移動する状態を示し、破線
で示す研摩ヘツド1′はヘツド移動前の状態を示
している。本図での研摩ヘツド1は研摩テープ2
を磁気デイスク3に加圧する役目を果たしている
が、研摩ヘツド1自身に砥粒を埋め込んで回転を
拘束する方式であつても研摩は可能である。
FIG. 1 shows a polished state of a magnetic disk as an example, FIG. 2 is a block diagram showing the configuration of an embodiment, and FIG. 3 shows a polishing profile. In FIG. 1, the polishing head 1 is shown moving from the inner circumference to the outer circumference while applying the abrasive tape 2 to the surface of the magnetic disk 3 with a predetermined pressure. It shows the condition. In this diagram, the polishing head 1 is the polishing tape 2.
However, polishing is also possible by embedding abrasive grains in the polishing head 1 itself to restrict its rotation.

研摩に先立ち、第3図に示すような不均一な磁
性媒体の膜厚分布4を示す磁気デイスクを均一な
傾斜角と厚みを有する膜5に整形するために、研
摩範囲内での第2図に示す複数個から成る速度変
更位置検出部6の検出位置を決定する。位置の決
定は研摩量が線形であれば等間隔に、非線形であ
れば研摩量の変化の度合が多い場所に密に設定
し、研摩量は時間の関数として扱い複数個から成
る速度設定出力部7に所要速度を設定する。
Prior to polishing, in order to shape a magnetic disk having a non-uniform magnetic medium thickness distribution 4 as shown in FIG. The detection positions of the speed change position detection units 6, which are composed of a plurality of units shown in Fig. 1, are determined. The positions are determined at equal intervals if the amount of polishing is linear, and if it is non-linear, the positions are set densely at locations where the degree of change in the amount of polishing is large. Set the required speed to 7.

研摩開始と同時に速度変更位置検出部6に対応
した速度設定速度部7から速度制御信号が速度変
化率設定部8を経由して速度制御部9へ出力さ
れ、速度制御信号に応じた速度でで研摩ヘツド移
動駆動部10が駆動される。前述の速度変化率設
定部8では速度設定出力部7の速度制御信号の変
化に応じて予め設定された時定数で速度制御信号
に追従する信号を出力するようになつており、速
度変化が大きい場合においても滑かな速度移行が
実現される。なお図中において、11は研摩ヘツ
ド1の磁気デイスク3への加圧機構、12は回転
テーブル、13は回転テーブル駆動用モータ、1
4は磁気デイスク3の回転方向、15は研摩ヘツ
ド1の移動ストロークを示す。
Simultaneously with the start of polishing, a speed control signal is output from the speed setting speed unit 7 corresponding to the speed change position detection unit 6 to the speed control unit 9 via the speed change rate setting unit 8, and the speed is adjusted according to the speed control signal. The polishing head movement drive 10 is activated. The speed change rate setting section 8 described above is configured to output a signal that follows the speed control signal with a preset time constant in response to changes in the speed control signal of the speed setting output section 7, so that the speed change is large. A smooth speed transition is achieved even in the case of In the figure, 11 is a pressurizing mechanism for the magnetic disk 3 of the polishing head 1, 12 is a rotary table, 13 is a motor for driving the rotary table, 1
Reference numeral 4 indicates the rotation direction of the magnetic disk 3, and reference numeral 15 indicates the movement stroke of the polishing head 1.

以上のように構成されているのでデイスクの半
径方向研摩量を自由に設定でき研摩量の制御が容
易に行える。また、磁気デイスクにおいてそのデ
イスクの半径方向の磁性媒体厚さに非線形なむら
が有る場合でも、研摩量の大小を研摩ヘツドの移
動速度の大小に置き換えることにより希望のプロ
フアイルに整形でき、従来問題であつた磁性媒体
の半径方向の非線形さによる研摩不良をも改善す
ることができる。また研摩ヘツドは研摩幅より小
さくできるのでヘツドの軽量化が計られデイスク
面変動に対しての追従性も向上する。
With the above structure, the amount of polishing in the radial direction of the disk can be freely set and the amount of polishing can be easily controlled. Furthermore, even if there is non-linear unevenness in the thickness of the magnetic medium in the radial direction of a magnetic disk, it is possible to shape it into the desired profile by replacing the amount of polishing with the speed of movement of the polishing head, which solves the problem of the conventional method. It is also possible to improve polishing defects caused by radial nonlinearity of the magnetic medium. Furthermore, since the polishing head can be made smaller than the polishing width, the weight of the head can be reduced and the ability to follow changes in the disk surface can be improved.

本実施例では速度変化率設定部8が速度制御部
9の前段に挿入されているが、逆に後段に挿入さ
れても効果は同様である。さらに本実施例では主
として磁性媒体を塗布したコーテイング磁気デイ
スクについて示したが、磁性媒体を塗布する以前
の素板など一般のデイスク表面の研摩に応用して
も同様に板厚の制御を容易に行うことができる。
In this embodiment, the speed change rate setting section 8 is inserted before the speed control section 9, but the same effect can be obtained even if it is inserted after the speed control section 9. Furthermore, although this example mainly shows a coated magnetic disk coated with a magnetic medium, the plate thickness can be easily controlled in the same way even when applied to polishing the surface of a general disk such as a raw plate before applying a magnetic medium. be able to.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は磁気デイスクの研摩状態を示す図、第
2図は一実施例の構成を示すブロツク図、第3図
は研摩プロフアイルを示す図である。 図において、1は研摩ヘツド、2は研摩テー
プ、3は磁気デイスク、4は磁性媒体の膜厚分
布、5は均一な傾斜角と厚みを有する膜、6は速
度変更位置検出部、7は速度設定出力部、8は速
度変化率設定部、9は速度制御部、10は研摩ヘ
ツド移動駆動部、11は研摩ヘツドの加圧機構、
12は回転テーブル、13は回転テーブル駆動用
モータ、14は磁気デイスクの回転方向、15は
研摩ヘツドの移動ストロークを表わす。
FIG. 1 is a diagram showing the polishing state of a magnetic disk, FIG. 2 is a block diagram showing the configuration of an embodiment, and FIG. 3 is a diagram showing a polishing profile. In the figure, 1 is a polishing head, 2 is a polishing tape, 3 is a magnetic disk, 4 is a film thickness distribution of a magnetic medium, 5 is a film having a uniform inclination angle and thickness, 6 is a speed change position detection unit, and 7 is a speed A setting output section, 8 a speed change rate setting section, 9 a speed control section, 10 a polishing head movement drive section, 11 a polishing head pressurizing mechanism,
12 is a rotary table, 13 is a motor for driving the rotary table, 14 is the direction of rotation of the magnetic disk, and 15 is the movement stroke of the polishing head.

Claims (1)

【特許請求の範囲】[Claims] 1 研摩ヘツドを被研摩デイスク面に圧接させそ
のデイスク半径方向に移動させる研摩ヘツド移動
駆動部と、この研摩ヘツド移動駆動部の移動速度
を制御する速度制御部と、この速度制御部への速
度制御信号が変化したとき所要の変化率で速度を
変化させる速度変化率設定部と、設定した複数個
の速度制御信号をその速度変化率設定部へ順に与
える速度設定出力部と、この速度設定出力部で設
定した複数個の速度制御信号に対応する複数個か
ら成る設定位置可変な研摩ヘツド位置検出センサ
ーにより前記研摩ヘツドの位置を検出して、前記
研摩ヘツド位置検出センサーに対応して設定され
た速度制御信号の出力トリガーを速度設定出力部
へ与える速度位置検出部とを有するデイスク研摩
装置。
1. A polishing head movement drive unit that presses the polishing head against the disk surface to be polished and moves the polishing head in the radial direction of the disk, a speed control unit that controls the moving speed of the polishing head movement drive unit, and a speed control unit that controls the speed control unit. A speed change rate setting section that changes the speed at a required rate of change when a signal changes, a speed setting output section that sequentially supplies a plurality of set speed control signals to the speed change rate setting section, and this speed setting output section. The position of the polishing head is detected by a plurality of polishing head position detection sensors whose positions are variable and which correspond to the plurality of speed control signals set in and a speed position detection section for providing an output trigger of a control signal to a speed setting output section.
JP8004280A 1980-06-13 1980-06-13 Disk grinder Granted JPS578068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8004280A JPS578068A (en) 1980-06-13 1980-06-13 Disk grinder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8004280A JPS578068A (en) 1980-06-13 1980-06-13 Disk grinder

Publications (2)

Publication Number Publication Date
JPS578068A JPS578068A (en) 1982-01-16
JPS6350146B2 true JPS6350146B2 (en) 1988-10-06

Family

ID=13707182

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8004280A Granted JPS578068A (en) 1980-06-13 1980-06-13 Disk grinder

Country Status (1)

Country Link
JP (1) JPS578068A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311729U (en) * 1989-06-20 1991-02-06

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601775A (en) * 1983-06-17 1985-01-07 日産自動車株式会社 Diode containing connector and method of producing same
JPS62193765A (en) * 1986-02-18 1987-08-25 Hitachi Electronics Eng Co Ltd Polishing attachment for disc substrate
JPH06306B2 (en) * 1988-02-10 1994-01-05 キヤノン株式会社 Polishing equipment
JP5886602B2 (en) * 2011-03-25 2016-03-16 株式会社荏原製作所 Polishing apparatus and polishing method
JP6101378B2 (en) * 2011-03-25 2017-03-22 株式会社荏原製作所 Polishing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0311729U (en) * 1989-06-20 1991-02-06

Also Published As

Publication number Publication date
JPS578068A (en) 1982-01-16

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