JPH07110968A - Apparatus and method for polishing of tape for optical-disk master disk - Google Patents

Apparatus and method for polishing of tape for optical-disk master disk

Info

Publication number
JPH07110968A
JPH07110968A JP25417493A JP25417493A JPH07110968A JP H07110968 A JPH07110968 A JP H07110968A JP 25417493 A JP25417493 A JP 25417493A JP 25417493 A JP25417493 A JP 25417493A JP H07110968 A JPH07110968 A JP H07110968A
Authority
JP
Japan
Prior art keywords
polishing
tape
optical disk
master
disk master
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25417493A
Other languages
Japanese (ja)
Inventor
Shoichi Nanba
祥一 難波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP25417493A priority Critical patent/JPH07110968A/en
Publication of JPH07110968A publication Critical patent/JPH07110968A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To polish a tape always to a definite face roughness even when the hardness and the temperature in the polishing operation of an optical-disk master disk are changed. CONSTITUTION:The polishing position of an optical-disk master disk 30 is detected by a position detection part 46. The number of revolutions of the optical-disk master disk 30 or the feed speed of a polishing tape is changed by a detection signal in a rotation part 43 according to a polishing position so that the relative speed of the polishing tape and the optical-disk master disk is made definite. In addition, light is shone at the polishing face of the optical-disk master disk 30, its reflected light is detected, a polishing pressure is changed automatically by a detection signal, and the polishing time is controlled. Thereby, an irregularity in the thickness due to the polishing operation of the optical-disk master disk can be eliminated, and a polishing speed can be increased remarkably. In addition, irrespective of the hardness and the temperature in the polishing operation of the optical-disk master disk, the tape can be polished always to a definite polishing face, and the optical-disk master disk whose reliability is high and whose accuracy and quality are always high can be manufactured.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ビデオディスク、ディ
ジタルオーディオディスク、静止画、文書ファイルなど
の光ディスクを作製するための光ディスク原盤の製造方
法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an optical disc master for producing optical discs such as video discs, digital audio discs, still images and document files.

【0002】[0002]

【従来の技術】一般に光ディスクは、その情報密度が極
めて大きいことや、S/N比が大きくノイズが少ないこ
と等から情報媒体として有望視され、ビデオディスクと
して商品化され、ディジタル信号記録および再生する光
ディスクとしても近年研究開発が行なわれている。この
光ディスクを作製する方法として最も多いのがスタンパ
ーと呼ばれる光ディスク原盤を用いて、射出あるいは射
出圧縮等の成形により複製する方法である。
2. Description of the Related Art Generally, an optical disc is promising as an information medium due to its extremely high information density, large S / N ratio and little noise, and is commercialized as a video disc for recording and reproducing digital signals. In recent years, research and development has been carried out as an optical disc. The most common method for producing this optical disk is a method in which an optical disk master called a stamper is used to reproduce by molding such as injection or injection compression.

【0003】以下、図面を参照しながら光ディスクの作
製に必要な光ディスク原盤を作製するための従来の光デ
ィスク原盤用テープ研磨装置ならびにその研磨方法につ
いて説明する。図10および図11(a)〜(i)に従
来の光ディスク原盤および光ディスクの製造方法を示
す。また、図12は従来の光ディスク原盤用テープ研磨
装置のブロック図を示し、図13はこの研磨装置を用い
て研磨した場合の研磨テープの種類の違いによる研磨速
度の違いを示す表であり、図14は従来の光ディスク原
盤の研磨装置での光ディスク原盤のそれぞれの研磨位置
における回転数であり、図15は研磨後の光ディスク原
盤の厚み分布を示す表である。図10において、1はガ
ラス基板、2はレジスト膜、3は記録用レーザ光、4は
記録された信号部、5は導電薄膜、6は電鋳メッキ膜、
はスタンパーと呼ばれる光ディスク原盤、8はディス
ク基板、9は反射あるいは記録等の薄膜、10は薄膜を
保護するための保護膜、11は光ディスクである。ま
た、図10および図11において(a)はレジスト膜形
成工程、(b)は露光記録工程、(c)は現像工程、
(d)は導電薄膜形成工程、(e)は電鋳メッキ工程、
(f)光ディスク原盤の裏面研磨工程および内外周加工
工程、(g)は成形工程、(h)は薄膜形成工程、
(i)は保護膜形成工程である。また、図12で12は
光ディスク原盤、13はテープ取り付け用リール、14
はテープ巻き取り用リール、15はテープ送り用ロー
ラ、16は研磨用コンタクトローラ、17はテープ巻き
取り用ローラ、18はテープ用のリールおよびローラを
固定するためのテープ固定台、19は送りネジ、20は
送り用モータ、21は回転テーブル、22は回転用モー
タである。スタンパーと呼ばれる光ディスク原盤を作
製するには、図10および図11に示すようにまずレジ
スト膜形成工程(a)においてガラス基板1の上にスピ
ン法等によりレジスト膜2を形成し、次に露光記録工程
(b)で記録用のレーザ光3で信号を露光記録し、現像
工程(c)で現像することにより信号部4を形成する。
次に導電膜形成工程(d)でスパッタ法等によりニッケ
ルあるいは銀等の導電薄膜5を50〜100nmの厚みで
形成し、電鋳メッキ工程(e)でその上から電鋳メッキ
することによりニッケルメッキ皮膜6を0.2〜0.4
mmの厚みで形成し、これをガラス基板から剥離し洗浄等
でレジスト膜を取り除いた後、この光ディスク原盤が成
形時の成形機金型に合うように、裏面研磨工程(f)で
裏面を0.1μm以下の面粗度に仕上げるように研磨
し、さらに内外周を金型に合わせて切断加工することに
よりスタンパーと呼ばれる光ディスク原盤が出来上が
る。この光ディスク原盤から光ディスクを作製するに
は、さらにこの光ディスク原盤を用い成形工程(g)
でポリカーボネートあるいはアクリル等の樹脂材料で成
形することにより信号を転写したディスク基板8を作製
し、薄膜形成工程(h)でディスク基板8の信号面状に
反射あるいは記録用薄膜9を形成し、更にその上に保護
膜形成工程(i)で保護膜10を数μm〜数十μmの厚
みで形成することにより光ディスク11が出来上がる。
金型に取り付けるためにこの光ディスク原盤の裏面の研
磨を行うには、図12に示すような光ディスク原盤用テ
ープ研磨装置を用い、まず光ディスク原盤12を研磨面
である裏面を上にして回転テーブル21に載せ、研磨テ
ープをテープ固定台18に取り付けられたテープ取付け
用リール13に取付け、テープ送り用ローラ15を介し
て研磨用コンタクトローラ16に巻き付け、更にテープ
巻き取り用ローラ17を介してテープ巻き取り用リール
14に巻き取るようにしておく。次に、回転用モータ2
2で回転テーブル21を回転することにより光ディスク
原盤12を回転し、テープ固定台18を送り用モータ2
0と送りネジ19で光ディスク原盤12の径方向に移動
しながら研磨テープをテープ巻き取り用ローラ15なら
びにテープ巻き取り用リール13で巻き取りながら研磨
用コンタクトローラ16を光ディスク原盤12に押しつ
けることにより、研磨テープで光ディスク原盤を研磨し
ていくものである。この研磨において、光ディスク原盤
は数百回/分程度の一定の回転数(角速度一定)で回転
さし、研磨テープは数十cm/分程度の一定の速度で送っ
ていくものである。ここに光ディスク原盤12を400
回/分の回転で、研磨テープを50cm/分およびテープ
固定台18を600cm/分の速さので研磨した場合の研
磨時間と研磨量の関係を図13に示す。すなわち研磨テ
ープの研磨目の種類に応じて研磨量すなわち研磨速度が
異なり、研磨するに従い面粗度が良くなるため一定時期
を過ぎると研磨速度が急劇的に遅くなる。また光ディス
ク原盤の回転数は一定のため研磨用コンタクトローラ1
6から見た光ディスク原盤の相対速度は、光ディスク原
盤の研磨位置すなわち半径位置により図14に示すよう
に変わる。このため光ディスク原盤は半径位置により研
磨速度および研磨量が変わり、図15に示すように光デ
ィスク原盤の内外周で5μm程度の差が出来る。すなわ
ち研磨後の光ディスク原盤の厚みが内周部で300μm
とすると外周部では295μm程度となる。次に研磨は
時間管理で行うため研磨面の研磨状態に関係なく、予め
設定した時間になったら自動的に研磨を終了するもので
ある。
A conventional optical disk master tape polishing apparatus and a conventional polishing method for manufacturing an optical disk master necessary for manufacturing an optical disk will be described below with reference to the drawings. 10 and 11 (a) to (i) show a conventional optical disc master and a conventional optical disc manufacturing method. Further, FIG. 12 is a block diagram of a conventional tape polishing apparatus for an optical disk master, and FIG. 13 is a table showing the difference in polishing rate due to the difference in the type of polishing tape when polishing is performed using this polishing apparatus. 14 is the number of rotations at each polishing position of the optical disc master in the conventional optical disc master polishing apparatus, and FIG. 15 is a table showing the thickness distribution of the optical disc master after polishing. In FIG. 10, 1 is a glass substrate, 2 is a resist film, 3 is a recording laser beam, 4 is a recorded signal portion, 5 is a conductive thin film, 6 is an electroformed plating film,
Reference numeral 7 is an optical disk master called a stamper, 8 is a disk substrate, 9 is a thin film for reflection or recording, 10 is a protective film for protecting the thin film, and 11 is an optical disk. 10 and 11, (a) is a resist film forming step, (b) is an exposure recording step, (c) is a developing step,
(D) is a conductive thin film forming step, (e) is an electroforming plating step,
(F) Back surface polishing step and inner / outer peripheral processing step of optical disk master, (g) forming step, (h) thin film forming step,
(I) is a protective film forming step. In FIG. 12, 12 is an optical disk master, 13 is a tape mounting reel, and 14 is a tape mounting reel.
Is a tape take-up reel, 15 is a tape feed roller, 16 is a polishing contact roller, 17 is a tape take-up roller, 18 is a tape fixing base for fixing the tape reel and roller, and 19 is a feed screw. , 20 is a feed motor, 21 is a rotary table, and 22 is a rotation motor. In order to manufacture an optical disk master called a stamper 7 , as shown in FIGS. 10 and 11, first, in the resist film forming step (a), the resist film 2 is formed on the glass substrate 1 by a spin method or the like, and then exposed. In the recording step (b), the signal is exposed and recorded with the recording laser beam 3, and in the developing step (c), the signal portion 4 is formed.
Next, in the conductive film forming step (d), a conductive thin film 5 of nickel or silver is formed to a thickness of 50 to 100 nm by a sputtering method or the like, and in the electroforming plating step (e), electroforming plating is performed on the nickel to form nickel. Plating film 6 0.2-0.4
After being formed with a thickness of mm, the resist film is peeled off from the glass substrate and the resist film is removed by washing or the like, and the back surface is polished in the back surface polishing step (f) so that this optical disk master fits the molding machine mold at the time of molding. An optical disk master 7 called a stamper is completed by polishing to a surface roughness of 1 μm or less and further cutting the inner and outer circumferences according to the mold. To produce an optical disk from the optical disc master 7 further molding process using the optical disc master 7 (g)
Then, a disc substrate 8 on which signals are transferred is formed by molding with a resin material such as polycarbonate or acrylic, and a thin film 9 for reflection or recording is formed on the signal surface of the disc substrate 8 in the thin film forming step (h). The optical disc 11 is completed by forming the protective film 10 with a thickness of several μm to several tens of μm in the protective film forming step (i).
In order to polish the back surface of this optical disk master for mounting on the mold, a tape polishing apparatus for an optical disk master as shown in FIG. 12 is used, and first, the optical disk master 12 is placed on the rotary table 21 with the back surface being the polishing surface facing upward. , The polishing tape is mounted on the tape mounting reel 13 mounted on the tape fixing base 18, wound on the polishing contact roller 16 via the tape feeding roller 15, and further wound on the tape winding roller 17 via the tape winding roller 17. It is arranged to be wound around the take-up reel 14. Next, the rotation motor 2
2 rotates the rotary table 21 to rotate the optical disk master 12, and the tape fixing base 18 to the feeding motor 2
By pressing the polishing contact roller 16 against the optical disk master 12 while winding the polishing tape with the tape winding roller 15 and the tape winding reel 13 while moving in the radial direction of the optical disk master 12 with 0 and the feed screw 19, The master disc of an optical disc is polished with a polishing tape. In this polishing, the optical disc master is rotated at a constant rotation speed (constant angular velocity) of about several hundred revolutions / minute, and the polishing tape is fed at a constant speed of about several tens cm / min. 400 optical disk master 12 here
FIG. 13 shows the relationship between the polishing time and the polishing amount when polishing the polishing tape at a speed of 50 cm / min and the tape fixing base 18 at a speed of 600 cm / min by rotating at a speed of revolutions / minute. That is, the amount of polishing, that is, the polishing rate varies depending on the type of the polishing mesh of the polishing tape, and the surface roughness improves as the polishing is performed, so that the polishing rate dramatically decreases after a certain period of time. Further, since the rotation speed of the optical disk master is constant, the polishing contact roller 1
The relative speed of the optical disk master viewed from 6 changes as shown in FIG. 14 depending on the polishing position, that is, the radial position of the optical disk master. For this reason, the polishing speed and the polishing amount of the optical disk master change depending on the radial position, and as shown in FIG. 15, there is a difference of about 5 μm between the inner and outer circumferences of the optical disk master. That is, the thickness of the optical disc master after polishing is 300 μm at the inner peripheral portion.
Then, it becomes about 295 μm in the outer peripheral portion. Next, since the polishing is performed by time management, the polishing is automatically terminated at a preset time regardless of the polishing state of the polishing surface.

【0004】[0004]

【発明が解決しようとする課題】しかしながら上記のよ
うな構成では、研磨テープと光ディスク原盤の相対的な
速度が研磨位置によって異なるため、光ディスク原盤の
研磨量が半径位置によって異なり光ディスク原盤の厚み
むらが発生する。また、光ディスク原盤の研磨を時間管
理で行うため、光ディスク原盤の硬度や研磨時の温度等
が変わると研磨速度が変わり、研磨後の面粗度や厚みが
研磨毎に変わってしまう。このため光ディスク原盤を用
いて成形を行う場合、成形で得られる光ディスク基板の
厚みむらが発生し、また成形時の成形条件出しにも影響
し、転写不良や歪あるいは複屈折の劣化等が発生しやす
くなる。
However, in the above-mentioned structure, since the relative speed of the polishing tape and the optical disc master differs depending on the polishing position, the polishing amount of the optical disc master varies depending on the radial position, resulting in uneven thickness of the optical disc master. Occur. Further, since the optical disc master is polished by time management, if the hardness of the optical disc master or the temperature during polishing changes, the polishing rate changes, and the surface roughness and thickness after polishing also change for each polishing. Therefore, when molding is performed using the optical disk master, unevenness in the thickness of the optical disk substrate obtained by molding occurs, and it also affects the molding conditions during molding, resulting in transfer defects, distortion, or deterioration of birefringence. It will be easier.

【0005】本発明は、上記従来の問題点に鑑み、光デ
ィスク原盤の裏面を常に均一の厚みで、しかも常に一定
の精度の面粗度で研磨出来るようにすることにより、非
常に信頼性が高く高品質の光ディスク原盤を作製するこ
とが出来る光ディスク原盤用テープ研磨装置ならびにそ
の研磨方法を提供するものである。
In view of the above-mentioned conventional problems, the present invention has a very high reliability by making it possible to polish the back surface of the optical disk master with a uniform thickness and a surface roughness with a constant accuracy. The present invention provides a tape polishing apparatus for an optical disc master and a polishing method for the same, which can produce a high-quality optical disc master.

【0006】[0006]

【課題を解決するための手段】上記課題を解決するため
に本発明の光ディスク原盤用テープ研磨装置ならびにそ
の研磨方法は、光ディスク原盤の研磨位置を検出し研磨
位置に応じて光ディスク原盤の回転数あるいは研磨テー
プの送り速度を変えることにより、研磨テープと光ディ
スク原盤の研磨面が常に一定の速度になるように制御
し、また研磨中に研磨面にレーザ等の光を射てその反射
光を測定することにより研磨面の状態すなわち研磨面の
面粗度の状態を測定し、その値に応じて研磨テープの光
ディスク原盤に押さえつける圧力を変えるようにし、さ
らに測定した反射光の大きさにより研磨時間を制御する
ようにした。
In order to solve the above problems, a tape polishing apparatus for an optical disk master and a method of polishing the same according to the present invention detect a polishing position of an optical disk master and detect the number of rotations of the optical disk master according to the polishing position. By changing the feed rate of the polishing tape, the polishing tape and the polishing surface of the optical disc master are controlled to always have a constant speed, and during polishing, light such as a laser is projected onto the polishing surface and the reflected light is measured. By measuring the state of the polishing surface, that is, the state of the surface roughness of the polishing surface, the pressure of the polishing tape pressed against the optical disc master is changed according to the value, and the polishing time is controlled by the magnitude of the reflected light measured. I decided to do it.

【0007】[0007]

【作用】本発明は上記した構成により、光ディスク原盤
のどの研磨位置でも常に研磨量ならびに研磨速度が一定
にすることが出来るため、研磨による光ディスク原盤の
厚みむらを無くすことが出来、また光ディスク原盤に押
さえつける研磨テープの圧力を研磨面の状態に応じて変
えることにより研磨時間の大幅な短縮が出来、また研磨
面の状態で研磨時間を制御するようにしたため常に一定
の面粗度に仕上げることが出来る。
According to the present invention, the amount of polishing and the polishing speed can be made constant at any polishing position of the optical disk master by the above-mentioned structure, so that the unevenness of the thickness of the optical disk master due to the polishing can be eliminated and the optical disk master can be used. The polishing time can be greatly shortened by changing the pressure of the polishing tape to be pressed according to the state of the polishing surface, and because the polishing time is controlled depending on the state of the polishing surface, it is possible to always achieve a constant surface roughness. .

【0008】[0008]

【実施例】以下、本発明の光ディスク原盤の研磨装置な
らびにその研磨方法の一実施例について、図面を参照し
ながら詳細に説明する。図1は本発明第1の実施例にお
ける光ディスク原盤用テープ研磨装置のブロック図を示
すものであり、図2は本発明の第1の実施例における光
ディスク原盤用テープ研磨装置の研磨ヘッド部の正面図
と側面図であり、図3は本発明の第1の実施例における
光ディスク原盤用テープ研磨装置の研磨テープ部の側面
図であり、図4は本発明の第1の実施例における光ディ
スク原盤の研磨位置に対する回転数を示す表であり、図
5は研磨後の光ディスク原盤の厚み分布を示す表であ
り、図6は光ディスク原盤を研磨した場合の研磨面の面
粗度とその面の反射率の関係を示す表であり、図7は光
ディスク原盤の研磨時間に対する研磨面の面粗度の関係
を示す表であり、図8は本発明の第1の実施例における
光ディスク原盤の研磨面の反射率に対する研磨用コンタ
クトローラの押しつける圧力を示す表であり、図9は本
発明の第1の実施例における研磨時間と研磨量の関係を
示す表である。図1において30は光ディスク原盤であ
り、35はテープ取り付け用リール31とテープ巻き取
り用リール32とテープ送り用ローラ33とテープ巻き
取り用ローラ34から成る研磨テープ部であり、36は
研磨テープ部を固定するためのテープ固定台であり、
はテープ固定台を移動するための送りネジ37と送り
用モータ38から成る研磨テープ送り部であり、43
回転テーブル40と回転用モータ41と回転制御装置4
2から成る回転部であり、46は位置検出用センサー4
4と位置検出装置45から成る位置検出部であり、49
はコンタクトローラユニット47とコンタクトローラの
圧力を制御するためのエアー圧制御装置48から成る研
磨ヘッド部であり、52は反射光量を測定するためのレ
ーザ50と反射光を受けるための受光用センサー51か
ら成る反射光測定部であり、56は反射光量測定器53
と予め設定しておくための反射光量設定器54とそれら
を比較するための比較器55から成る反射光比較部であ
る。また図2において57はコンタクトローラ、58は
ローラ固定台、59はローラヘッドに圧力を加えるため
のエアーシリンダー、60はエアーシリンダーにエアー
を供給するためのエアー供給用配管である。図3におい
て、61は研磨テープを巻き取るための巻き取りリール
用モータ、62は研磨テープを巻き取るためのテープ巻
き取りローラ用モータである。この光ディスク原盤用テ
ープ研磨装置は、研磨テープ部ならびに研磨を行うため
のコンタクトローラユニットを固定しているテープ固定
台36の位置を位置検出部46のリニアエンコーダ等の
位置検出用センサー44で検出し、検出した信号を位置
検出装置45で位置に比例したディジタルあるいはアナ
ログの信号に変換し、この信号を回転部43の回転制御
装置42に送り、この信号により回転制御装置42で回
転用モータを研磨位置に応じた回転数で回転するように
し、光ディスク原盤と研磨テープの相対速度を一定にな
るようにしたものである。あるいは位置検出装置45か
らの信号により研磨位置に応じて研磨巻き取りリール用
モータ62ならびに巻き取りローラ用モータ63の回転
数を変え研磨テープの巻き取り速度を変えることによ
り、光ディスク原盤と研磨テープの相対速度を一定にす
るようにしたものである。また、反射光測定部52のレ
ーザ50のレーザ光を光ディスク原盤30の研磨面に照
射し、その反射光を受光用センサー51で受光し、反射
光比較部56の反射光量測定器53で受光した光量に応
じた信号に変換するようにしたものである。そして、反
射光量設定器54で予め比較するために必要な反射光量
を設定出来るようにしておき、反射光量測定器53で測
定した信号と反射光量設定器54で設定した値を比較器
55で比較し、一致した時点でこの比較器55から回転
テーブルの回転制御装置42と研磨テープの送り用モー
タの制御装置に信号を送り、各々を停止することにより
研磨を自動的に終了するようにしたものである。また、
研磨中に反射光量測定器54で検出した信号をエアー制
御装置48に送り、この信号量に応じてコンタクトロー
ラ57用のエアーシリンダ59に供給するエアーの圧力
を自動的に変えるようにしたものである。これは研磨す
るに従い研磨面の面粗度がよくなり研磨面の摩擦係数が
小さくなるため、それに従って研磨の圧力を上げていく
ようにしたものである。ここで、検出部46で検出した
信号をもとに光ディスク原盤を図4に示すような1m/
秒の線速度一定になるように回転制御装置42で制御
し、研磨テープを50cm/分の一定速度で送り、テープ
固定台18を500cm/分の速さで径方向に移動しなが
らコンタクトローラ15を圧力5kg/cm2 で押さえつ
けて研磨した場合、光ディスク原盤の研磨後の厚みむら
を図5に示すように内外周とも1μm以内にすることが
出来た。また、光ディスク原盤の研磨面の面粗度と反射
率の関係は図6に示す通りであり、2000番手の研磨
テープを用いて研磨した場合の研磨時間と研磨面の面粗
度の関係は図7の通りである。従って、コンタクトロー
ラ57用のエアーシリンダ59に供給するエアーの圧力
を反射光量測定器54で得た信号により、自動的に図8
に示すような圧力に制御して研磨すると、図9に示すよ
うに研磨速度を著しく上げることが出来た。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a polishing apparatus for an optical disk master and a polishing method therefor according to the present invention will be described in detail below with reference to the drawings. 1 is a block diagram of a tape polishing apparatus for an optical disk master according to the first embodiment of the present invention, and FIG. 2 is a front view of a polishing head portion of the tape polishing apparatus for an optical disk master according to the first embodiment of the present invention. 3A and 3B are a side view and a side view of a polishing tape portion of a tape polishing apparatus for an optical disc master according to a first embodiment of the present invention, and FIG. 4 is a side view of an optical disc master according to a first embodiment of the present invention. 5 is a table showing the number of rotations with respect to the polishing position, FIG. 5 is a table showing the thickness distribution of the optical disk master after polishing, and FIG. 6 is a surface roughness of the polished surface and the reflectance of the surface when the optical disk master is polished. 7 is a table showing the relationship of the surface roughness of the polishing surface with respect to the polishing time of the optical disk master, and FIG. 8 is a table showing the reflection of the polishing surface of the optical disk master in the first embodiment of the present invention. Research on rate A table showing the pressure for pressing the use contact roller, FIG. 9 is a table showing the first polishing time and the polishing amount of the relationship in the embodiment of the present invention. In FIG. 1, reference numeral 30 is an optical disk master, 35 is a polishing tape portion including a tape mounting reel 31, a tape winding reel 32, a tape feeding roller 33, and a tape winding roller 34, and 36 is a polishing tape portion. It is a tape fixing base for fixing 3
Reference numeral 9 is a polishing tape feeding unit composed of a feed screw 37 for moving the tape fixing base and a feeding motor 38, and 43 is a rotary table 40, a rotation motor 41, and a rotation control device 4.
2 is a rotating part, and 46 is a position detecting sensor 4
4 and a position detection unit consisting of the position detecting device 45, 49
Is a polishing head portion comprising a contact roller unit 47 and an air pressure controller 48 for controlling the pressure of the contact roller, and 52 is a laser 50 for measuring the amount of reflected light and a light receiving sensor 51 for receiving the reflected light. a reflected light measuring unit consisting, 56 reflected light quantity measuring instrument 53
And a reflected light quantity setting device 54 for setting in advance and a comparator 55 for comparing them. In FIG. 2, reference numeral 57 is a contact roller, 58 is a roller fixing base, 59 is an air cylinder for applying pressure to the roller head, and 60 is an air supply pipe for supplying air to the air cylinder. In FIG. 3, 61 is a take-up reel motor for taking up the polishing tape, and 62 is a tape take-up roller motor for taking up the polishing tape. This optical disk master tape polishing apparatus detects the position of the tape fixing base 36, which fixes the polishing tape portion and the contact roller unit for polishing, with a position detecting sensor 44 such as a linear encoder of the position detecting section 46. , The detected signal is converted by the position detection device 45 into a digital or analog signal proportional to the position, and this signal is sent to the rotation control device 42 of the rotation unit 43 , and the rotation control device 42 polishes the rotation motor by this signal. The rotation speed is set according to the position, and the relative speed between the optical disk master and the polishing tape is kept constant. Alternatively, the rotation speed of the polishing take-up reel motor 62 and the take-up roller motor 63 is changed according to the polishing position in response to a signal from the position detection device 45 to change the winding speed of the polishing tape, thereby changing the optical disc master and the polishing tape. The relative speed is kept constant. Further, the laser light of the laser 50 of the reflected light measuring unit 52 is applied to the polishing surface of the optical disc master 30, the reflected light is received by the light receiving sensor 51, and the reflected light amount measuring device 53 of the reflected light comparing unit 56 receives the reflected light. The signal is converted into a signal according to the amount of light. Then, the reflected light amount setter 54 is set so that the amount of reflected light necessary for comparison can be set in advance, and the signal measured by the reflected light amount measurer 53 and the value set by the reflected light amount setter 54 are compared by the comparator 55. Then, at the time of coincidence, a signal is sent from the comparator 55 to the rotation control device 42 of the rotary table and the control device of the polishing tape feed motor, and the polishing is automatically terminated by stopping each of them. Is. Also,
A signal detected by the reflected light amount measuring device 54 during polishing is sent to the air controller 48, and the pressure of the air supplied to the air cylinder 59 for the contact roller 57 is automatically changed according to this signal amount. is there. This is because the surface roughness of the polishing surface is improved as the polishing is performed and the friction coefficient of the polishing surface is decreased, so that the polishing pressure is increased accordingly. Here, based on the signal detected by the detection unit 46 , the optical disc master is set at 1 m / m as shown in FIG.
The linear velocity per second is controlled by the rotation control device 42, the polishing tape is fed at a constant speed of 50 cm / min, and the contact roller 15 is moved while moving the tape fixing base 18 in the radial direction at a speed of 500 cm / min. In the case of polishing by pressing at a pressure of 5 kg / cm 2 , the thickness unevenness of the optical disk master after polishing could be kept within 1 μm for both the inner and outer circumferences, as shown in FIG. Further, the relationship between the surface roughness of the polished surface of the optical disk master and the reflectance is as shown in FIG. 6, and the relationship between the polishing time and the surface roughness of the polished surface when polishing is performed using a 2000-thick polishing tape is shown in FIG. 7 is as follows. Therefore, the pressure of the air supplied to the air cylinder 59 for the contact roller 57 is automatically obtained from the signal obtained by the reflected light amount measuring device 54 in FIG.
When the polishing was performed while controlling the pressure as shown in Fig. 9, the polishing rate could be remarkably increased as shown in Fig. 9.

【0009】[0009]

【発明の効果】以上のように本発明によれば、研磨位置
に応じて光ディスク原盤の回転数あるいは研磨テープの
速度を変え光ディスク原盤と研磨テープの相対速度を常
に等しくなるようにしことにより、光ディスク原盤の研
磨面全域に対し同じ条件で研磨出来るようになり、従っ
て光ディスク原盤の研磨量を研磨面全域で均一でき研磨
後の厚みむらを無くし、かつ均一な面粗度の状態に仕上
げることが出来るようになった。また、研磨中に光ディ
スク原盤の研磨面の状態を検出し、研磨面の面粗度に応
じて研磨時間を制御するようにしたため、光ディスク原
盤の硬度が変わっても常に一定の研磨面の状態(面粗
度)に研磨出来るようになった。また、研磨中に研磨面
の面粗度に応じて研磨テープの光ディスク原盤に押さえ
つける圧力を変えるようにしたため、研磨の速度を著し
く上げることが出来た。これにより信頼性が高く、常に
一定で高品質の光ディスク原盤を作製することが出来る
ようになった。
As described above, according to the present invention, the number of revolutions of the optical disk master or the speed of the polishing tape is changed according to the polishing position so that the relative speeds of the optical disk master and the polishing tape are always equal to each other. The entire polishing surface of the master can be polished under the same conditions. Therefore, the polishing amount of the optical disk master can be made uniform over the entire polishing surface, and unevenness in thickness after polishing can be eliminated and the surface can be finished in a uniform surface roughness state. It became so. Further, since the state of the polishing surface of the optical disc master is detected during polishing and the polishing time is controlled according to the surface roughness of the polishing surface, the state of the polishing surface is always constant even if the hardness of the optical disc master changes ( It became possible to polish to surface roughness. Further, during polishing, the pressure of the polishing tape pressed against the optical disk master is changed according to the surface roughness of the polishing surface, so that the polishing speed can be significantly increased. As a result, it has become possible to manufacture a high-quality optical disk master that is highly reliable and always constant.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例における光ディスク原盤用テ
ープ研磨装置を示すブロック図
FIG. 1 is a block diagram showing a tape polishing apparatus for an optical disk master according to an embodiment of the present invention.

【図2】本発明の一実施例における光ディスク原盤用テ
ープ研磨装置のコンタクトローラユニットの側面図と正
面図
FIG. 2 is a side view and a front view of a contact roller unit of a tape polishing apparatus for an optical disk master according to an embodiment of the present invention.

【図3】光ディスク原盤用テープ研磨装置の研磨テープ
部の断面図
FIG. 3 is a cross-sectional view of a polishing tape portion of an optical disc master tape polishing device.

【図4】本発明の一実施例における光ディスク原盤の研
磨位置と回転数の関係を示す図
FIG. 4 is a diagram showing a relationship between a polishing position and a rotation speed of an optical disc master according to an embodiment of the present invention.

【図5】本発明の一実施例における光ディスク原盤用テ
ープ研磨装置を用いて研磨した場合の光ディスク原盤の
厚み分布を示す図
FIG. 5 is a view showing a thickness distribution of an optical disc master when the optical disc master tape polishing apparatus in one embodiment of the present invention is used for polishing.

【図6】光ディスク原盤の研磨状態(面粗度)と研磨面
の反射率の関係を示す図
FIG. 6 is a diagram showing a relationship between a polished state (surface roughness) of an optical disc master and a reflectance of the polished surface.

【図7】光ディスク原盤の研磨時間と研磨状態(面粗
度)を示す図
FIG. 7 is a diagram showing a polishing time and a polishing state (surface roughness) of an optical disc master.

【図8】本発明の一実施例における研磨装置の反射率に
対し制御するコンタクトローラの圧力を示す図
FIG. 8 is a diagram showing a pressure of a contact roller controlled with respect to a reflectance of a polishing apparatus according to an embodiment of the present invention.

【図9】本発明の一実施例における研磨方法を用いた場
合の研磨速度を示す図
FIG. 9 is a diagram showing a polishing rate when a polishing method according to an embodiment of the present invention is used.

【図10】光ディスク原盤および光ディスクの一般的な
作製方法を示す断面図
FIG. 10 is a sectional view showing a general method for manufacturing an optical disk master and an optical disk.

【図11】光ディスク原盤および光ディスクの一般的な
作製方法を示す工程図
FIG. 11 is a process diagram showing a general method for manufacturing an optical disc master and an optical disc.

【図12】従来の光ディスク原盤用テープ研磨装置のブ
ロック図
FIG. 12 is a block diagram of a conventional tape polishing apparatus for an optical disc master.

【図13】従来の光ディスク原盤用テープ研磨装置を用
いた場合の研磨時間と研磨量の関係を示す図
FIG. 13 is a diagram showing a relationship between a polishing time and a polishing amount when a conventional optical disk master tape polishing device is used.

【図14】従来の研磨方法における光ディスク原盤の研
磨位置と回転数の関係を示す図
FIG. 14 is a diagram showing a relationship between a polishing position of an optical disc master and a rotation number in a conventional polishing method.

【図15】従来の研磨方法で研磨した場合の研磨後の光
ディスク原盤の厚み分布を示す図
FIG. 15 is a diagram showing a thickness distribution of an optical disc master after polishing in the case of polishing by a conventional polishing method.

【符号の説明】[Explanation of symbols]

30 光ディスク原盤 31 テープ取り付け用リール 32 テープ巻き取り用リール 33 テープ送り用ローラ 34 テープ巻き取り用ローラ35 研磨テープ部 36 テープ固定台 37 送りネジ 38 送り用モータ39 研磨テープ送り部 40 回転テーブル 41 回転用モータ 42 回転制御装置43 回転部 44 位置検出用センサー 45 位置検出装置46 位置検出部47 コンタクトローラユニット 48 エアー制御装置49 研磨ヘッド部 50 レーザ 51 受光用センサー52 反射光測定部 53 反射光量測定器 54 反射光量設定器 55 比較器56 反射光比較部 57 コンタクトローラ 58 ローラ固定台 59 エアーシリンダー 60 エアー供給用シリンダー 61 テープ巻き取りリール用モータ 62 テープ巻き取りローラ用モータ30 Optical disc master 31 Tape mounting reel 32 Tape winding reel 33 Tape feeding roller 34 Tape winding roller 35 Abrasive tape section 36 Tape fixing base 37 Feed screw 38 Feed motor 39 Abrasive tape feeding section 40 Rotary table 41 Rotation Motor 42 rotation control device 43 rotation part 44 position detection sensor 45 position detection device 46 position detection part 47 contact roller unit 48 air control device 49 polishing head part 50 laser 51 light receiving sensor 52 reflected light measurement part 53 reflected light quantity measuring instrument 54 Reflected Light Amount Setting Device 55 Comparator 56 Reflected Light Comparison Unit 57 Contact Roller 58 Roller Fixing Stand 59 Air Cylinder 60 Air Supply Cylinder 61 Tape Winding Reel Motor 62 Tape Winding Roller Motor

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】光ディスク原盤用テープ研磨装置において
研磨テープを送るための研磨テープ部と、研磨状態に応
じて光ディスク原盤に押しつける圧力を変えることが出
来る研磨ヘッド部と、研磨テープ部と研磨ヘッド部を取
り付けるための固定台と、この固定台を移動するための
研磨テープ送り部と、研磨位置を検出するための位置検
出部と、研磨する光ディスク原盤を研磨位置に応じた回
転数で回転させるための回転部と、光ディスク原盤の研
磨面に光を射てその反射光量を測定するための反射光測
定部と、予め設定した反射光量(あるいは反射率)と測
定した反射光量(あるいは反射率)を比較しこれにより
研磨時間を制御するための反射光比較部とを備えたこと
を特徴とする光ディスク原盤用テープ研磨装置。
1. A polishing tape portion for feeding a polishing tape in a tape polishing apparatus for an optical disk master, a polishing head portion capable of changing pressure applied to the optical disk master according to a polishing state, a polishing tape portion and a polishing head portion. A fixed base for attaching the fixed base, a polishing tape feed unit for moving the fixed base, a position detection unit for detecting the polishing position, and an optical disk master to be polished for rotating at a rotational speed according to the polishing position. The rotating part, the reflected light measuring part for emitting light to the polished surface of the optical disc master and measuring the reflected light amount, the preset reflected light amount (or reflectance) and the measured reflected light amount (or reflectance) An optical disk master tape polishing apparatus comprising: a reflected light comparison unit for comparing and controlling the polishing time accordingly.
【請求項2】光ディスク原盤の研磨位置を検出し、検出
した値により光ディスク原盤の研磨位置に応じてた回転
数で光ディスク原盤を回転するか、あるいは研磨テープ
の送り速度を制御することにより、研磨テープと光ディ
スク原盤の研磨面との相対速度が常に一定の速度になる
ように制御しながら研磨することを特徴とする光ディス
ク原盤の研磨方法。
2. The polishing is performed by detecting the polishing position of the optical disc master, and rotating the optical disc master at a rotation speed corresponding to the polishing position of the optical disc master by the detected value, or by controlling the feed rate of the polishing tape. A method for polishing an optical disk master, wherein polishing is performed while controlling the relative speed between the tape and the polishing surface of the optical disk master to be always a constant speed.
【請求項3】光ディスク原盤の研磨面にレーザ等の光を
射てその反射光を測定し、反射してきた光量に応じて光
ディスク原盤に押しつけることにより、研磨面と研磨テ
ープの摩擦係数に応じて研磨テープの圧力を変え研磨す
るようにしたことを特徴とする光ディスク原盤の研磨方
法。
3. A polishing surface of an optical disc master is irradiated with light such as a laser, the reflected light is measured, and the reflected light is pressed against the optical disc master to determine the friction coefficient between the polishing surface and the polishing tape. A method for polishing an optical disk master, wherein the pressure of the polishing tape is changed to perform polishing.
【請求項4】光ディスク原盤の研磨面にレーザ等の光を
射てその反射光を測定し、反射してきた光量が予め設定
した値より等しいか越えた時点で、研磨を終了すること
により研磨面の面粗度に応じて研磨時間を制御するよう
にしたことを特徴とする光ディスク原盤の研磨方法。
4. A polishing surface is finished by irradiating light such as a laser on the polishing surface of an optical disk master, measuring the reflected light, and finishing polishing when the amount of reflected light is equal to or exceeds a preset value. The method for polishing an optical disk master is characterized in that the polishing time is controlled according to the surface roughness.
JP25417493A 1993-10-12 1993-10-12 Apparatus and method for polishing of tape for optical-disk master disk Pending JPH07110968A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25417493A JPH07110968A (en) 1993-10-12 1993-10-12 Apparatus and method for polishing of tape for optical-disk master disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25417493A JPH07110968A (en) 1993-10-12 1993-10-12 Apparatus and method for polishing of tape for optical-disk master disk

Publications (1)

Publication Number Publication Date
JPH07110968A true JPH07110968A (en) 1995-04-25

Family

ID=17261262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25417493A Pending JPH07110968A (en) 1993-10-12 1993-10-12 Apparatus and method for polishing of tape for optical-disk master disk

Country Status (1)

Country Link
JP (1) JPH07110968A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009129240A (en) * 2007-11-26 2009-06-11 Nec Corp Sensor network, service specification device, and method and program for providing service
WO2013015750A1 (en) * 2011-07-25 2013-01-31 Hoya Glass Disk (Thailand) Ltd A method of manufacturing glass substrates for information recording medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009129240A (en) * 2007-11-26 2009-06-11 Nec Corp Sensor network, service specification device, and method and program for providing service
WO2013015750A1 (en) * 2011-07-25 2013-01-31 Hoya Glass Disk (Thailand) Ltd A method of manufacturing glass substrates for information recording medium

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