JPH01140958A - Method of finishing disc and device therefor - Google Patents

Method of finishing disc and device therefor

Info

Publication number
JPH01140958A
JPH01140958A JP29601687A JP29601687A JPH01140958A JP H01140958 A JPH01140958 A JP H01140958A JP 29601687 A JP29601687 A JP 29601687A JP 29601687 A JP29601687 A JP 29601687A JP H01140958 A JPH01140958 A JP H01140958A
Authority
JP
Japan
Prior art keywords
disc
disk
abrasive
polishing
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29601687A
Other languages
Japanese (ja)
Inventor
Takao Nakamura
孝雄 中村
Takaaki Shirokura
白倉 高明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP29601687A priority Critical patent/JPH01140958A/en
Publication of JPH01140958A publication Critical patent/JPH01140958A/en
Priority to US07/933,893 priority patent/US5985402A/en
Priority to US08/673,470 priority patent/US5737159A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To uniformly finish the outer surface of a disc such as a magnetic disc by maintaining the relative speed between a polishing tape and the disc constant, irrespective of a position to be processed, so as to remove micro projection on the outer surface of the disc uniformly and accurately over the entire surface thereof. CONSTITUTION:A pair of polishing tapes 1 in a machining head is made into press- contact with the front and rear surfaces of a disc 3 such as a magnetic disc or the like on rotation by a contact roller 2 while an abrasive material 9 is fed onto the outer surface of the disc 3. Simultaneously, a slide part of the machining head 12 reciprocates the latter radially of the disc 3 so that micro projections on the front and rear surfaces of the disc 3 are polished and removed by the polishing tapes 1. In this arrangement, the position of the slide part of the machining head is always detected by a linear scale 6 so that a control device 6' controls the rotational speed of a disc rotating motor 7 to maintain the relative speed between the polishing tapes 1 and the disc 3 at a machining point is maintained to be constant. As a result, the dynamic pressure by the polishing material 9 therebetween is made to be constant, thereby it is possible to finish the front and rear surfaces of the disc 3, uniformly and accurately in polishing.

Description

【発明の詳細な説明】 [産業上の利用分野コ 本発明は、電算機用磁気ディスク装置のスパッタディス
ク、塗布ディスク等の円板の仕上加工方法およびその装
置に係り、特に、ヘッド浮上特性を向上させるために、
円板上の微細突起を、能率よくまた、均質に除去するた
めの円板仕上方法およびその装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for finishing disks such as sputter disks and coated disks for magnetic disk devices for computers, and in particular, to a method and apparatus for finishing disks such as sputter disks and coated disks for magnetic disk devices for computers. In order to improve
The present invention relates to a disk finishing method and apparatus for efficiently and uniformly removing minute protrusions on a disk.

[従来の技術] 従来技術としては、特開昭60−106029号公報「
磁気ディスクの製造装置」等がある。これを、第5図を
用いて説明する。
[Conventional technology] As a conventional technology, Japanese Patent Application Laid-open No. 106029/1983 "
"Magnetic disk manufacturing equipment," etc. This will be explained using FIG. 5.

第5図は、従来の突起除去装置を示す斜視図である。FIG. 5 is a perspective view showing a conventional protrusion removing device.

この第5図において、A方向に回転する円板3の表面に
、研磨テープ1を加圧子20を介して圧着接縮させ、円
板3の半径方向(B方向)に往復摺動させることによっ
て、円板3表面上の微細突起を除去する装置である。
In FIG. 5, the abrasive tape 1 is crimped onto the surface of the disc 3 rotating in the A direction via a pressurizer 20, and is slid back and forth in the radial direction (B direction) of the disc 3. , is a device for removing minute protrusions on the surface of the disk 3.

なお、研磨テープ1は微小速度で巻取られるようになっ
ている。
Note that the polishing tape 1 is wound up at a very low speed.

[発明が解決しようとする問題点] 前記従来技術では、円板の内、外周において、円板表面
の微細突起を研磨除去して平滑均質な表面に仕上げるた
めの研磨テープの摺動に対して、円板上の加工点の相対
速度の違いによる加圧力の差違のために、円板全表面に
わたって、突起除去によって表面状態を均質に仕上げる
ことは困難であった。
[Problems to be Solved by the Invention] In the above-mentioned prior art, the polishing tape is used to polish and remove minute protrusions on the disk surface on the inner and outer peripheries of the disk to create a smooth and homogeneous surface. Due to the difference in pressure applied due to the difference in the relative speed of the machining points on the disk, it was difficult to achieve a uniform surface condition by removing protrusions over the entire surface of the disk.

本発明の目的は、円板表面と研磨テープとの接縮圧力を
常に一定に保持するようにして。
An object of the present invention is to maintain constant contact pressure between the disk surface and the polishing tape.

円板全表面における微細突起を除去し、均質な表面に仕
上げる方法、およびその実施に直接使用される装置を提
供することである。
It is an object of the present invention to provide a method for removing minute protrusions on the entire surface of a disk and finishing the surface uniformly, and an apparatus directly used for carrying out the method.

[問題点を解決するための手段] 上記問題点を解決するための本発明の円板仕上方法の構
成は、回転する円板の表面へ、研磨剤を供給しながら、
研磨テープを圧着接縮させることにより、前記円板表面
の微細突起を除去するようにした円板仕上方法において
、研磨テープと、この研磨テープが接縮する回転円板上
の加工点との相対速度を、加工点の位置に拘らず一定に
したことである。
[Means for Solving the Problems] The configuration of the disc finishing method of the present invention for solving the above problems includes supplying an abrasive to the surface of a rotating disc, while
In a disk finishing method in which minute protrusions on the surface of the disk are removed by compressing an abrasive tape, the relationship between the abrasive tape and the processing point on the rotating disk to which the abrasive tape is compressed is The speed is kept constant regardless of the position of the processing point.

また、本発明の円板仕上装置の構成は、回転する円板の
表面へ、研磨剤を供給しながら、研磨テープを圧着接縮
させることにより、前記円板上の微細突起を除去するよ
うにしだ円板仕上装置において、円板を取付けることが
できる円板回転軸と、この円板回転軸を駆動する円板回
転モータと、前記円板の両面側の対向する加工点へ、研
磨テープを介してコンタクトローラを圧着接縮させるこ
とができる一対の加工ユニットを有する加工ヘッドと、
この加工ヘッドを前記円板の半径方向へ往復動させるこ
とができる加工ヘッド摺動部と、この加工ヘッド摺動部
の位置を検出するりニアスケールと、このリニアスケー
ルによる検出値に基づいて前記加工点における前記研磨
テープと円板との相対速度が、加工点の位置に拘らず一
定になるように、前記円板回転モータの回転数を制御す
ることができる制御装置とを具備したものである。
Further, the configuration of the disk finishing device of the present invention is such that fine protrusions on the rotating disk are removed by compressing and bonding the abrasive tape to the surface of the rotating disk while supplying an abrasive. In an ellipsoidal plate finishing device, an abrasive tape is applied to a disk rotating shaft to which a disk can be attached, a disk rotating motor that drives this disk rotating shaft, and opposing processing points on both sides of the disk. a processing head having a pair of processing units capable of compressing and contacting a contact roller through the processing head;
A processing head sliding part that can reciprocate the processing head in the radial direction of the disk, a linear scale that detects the position of the processing head sliding part, and a linear scale that detects the position of the processing head based on the detected value by the linear scale. and a control device capable of controlling the rotation speed of the disc rotation motor so that the relative speed between the polishing tape and the disc at the processing point is constant regardless of the position of the processing point. be.

[作用] 本発明の円板上仕上げ方法の作用を、第3図を用いて説
明する。第3図は、本発明の円板仕上方法を説明するた
めの加工部の拡大模式図である。
[Function] The function of the disk top finishing method of the present invention will be explained using FIG. 3. FIG. 3 is an enlarged schematic diagram of a processing section for explaining the disk finishing method of the present invention.

この第3図において、回転する円板3表面に、研磨剤9
を供給しながら、研磨テープ1によって、微細突起10
を除去するにあたり、回転する円板3表面上を相対速度
Vで移動する研磨テープ1に押圧力を作動させる場合を
示している。この場合、円板3表面と研磨テープ1との
間隙をδとすれば、このとき発生する動圧Wと相対速度
Vとの関係は次式で示される。
In FIG. 3, an abrasive 9 is applied to the surface of the rotating disk 3.
While supplying the polishing tape 1, fine protrusions 10 are
The case where a pressing force is applied to the polishing tape 1 moving at a relative speed V on the surface of the rotating disk 3 is shown. In this case, if the gap between the surface of the disk 3 and the polishing tape 1 is δ, the relationship between the dynamic pressure W generated at this time and the relative velocity V is expressed by the following equation.

δ2 ここで、Kは研磨剤の流れ、周囲の条件による定数、η
は研磨剤の粘性係数を示す。また、第3図において、δ
は表面と研磨テープとの間隙を、hは突起の高さを示す
が、δくhは必要条件である。上の(1)式において、
K、ηおよびδが一定であれば、動圧Wは相対速度Vに
正比例することになる。
δ2 Here, K is a constant depending on the abrasive flow and surrounding conditions, η
indicates the viscosity coefficient of the abrasive. Also, in Figure 3, δ
is the gap between the surface and the polishing tape, and h is the height of the protrusion, where δ and h are necessary conditions. In equation (1) above,
If K, η and δ are constant, the dynamic pressure W will be directly proportional to the relative velocity V.

回転′する円板において、研磨テープを圧着接縮させつ
つ、半径方向に往復摺動する時に、円板表面上の加工点
の相対速度は、外周部の方が内周部よりも大きいので、
加工点がうける動圧もまた外周部の方が大きい。
When the abrasive tape slides back and forth in the radial direction on a rotating disc while being compressed, the relative velocity of the processing points on the disc surface is greater on the outer periphery than on the inner periphery.
The dynamic pressure experienced by the processing point is also greater at the outer periphery.

そこで本発明においては、円板の全周部の加工点にがか
る動圧を均等にするために、っぎのような方法によって
これを実施した。
Therefore, in the present invention, in order to equalize the dynamic pressure applied to the machining points around the entire circumference of the disk, the following method was used.

いま、円板中心から加工点までの距gIr、この点の回
転数をN(rpm)とすると、研磨テープの巻取り速度
は、円板の回転速度に比して微少なので、研磨テープの
摺動速度に対して、円板の加工点における回転速度との
相対速度VはV″:2πr−Nと近似できる。
Now, assuming that the distance gIr from the center of the disk to the processing point is N (rpm) and the rotation speed at this point is N (rpm), the winding speed of the abrasive tape is very small compared to the rotation speed of the disk, so the polishing tape is With respect to the dynamic speed, the relative speed V to the rotational speed at the processing point of the disk can be approximated as V'':2πr-N.

ここで、円板中心からの距1tr1?r2の加工点を加
工するときの回転数(rpm)をそれぞれN工およびN
2とし、各点における相対速度Vを等しくすれば、r2
の加工点における回転数N2は、N z = (r 1
/ r z ) X N lとなる。
Here, the distance from the center of the disc is 1tr1? The rotation speed (rpm) when machining the machining point r2 is N machining and N machining, respectively.
2, and if the relative velocity V at each point is made equal, then r2
The rotation speed N2 at the machining point is N z = (r 1
/ r z ) X N l.

すなわち、以上のような方法により、円板表面上の各点
の相対速度を等しくすれば、各点における動圧も一定に
することができる。
That is, by making the relative velocity of each point on the disk surface equal using the method described above, the dynamic pressure at each point can also be made constant.

以上の制御方式を採用することにより、円板表面に点在
する微細突起が均一に除去され、均質な表面が得られる
By employing the above control method, fine protrusions scattered on the disk surface are uniformly removed and a homogeneous surface is obtained.

[実施例] 以下本発明を実施例によって説明する。[Example] The present invention will be explained below with reference to Examples.

第1図は1本発明の円板仕上装置の一実施例を示す主要
部正面図、第2図は、同上の主要部側面図である。
FIG. 1 is a front view of the main parts of an embodiment of the disk finishing apparatus of the present invention, and FIG. 2 is a side view of the main parts of the same.

まず、本実施例の構成を第1図〜第3図を用いて説明す
る。本円板仕上装置は、円板3の両面を同時に研磨し仕
上げることができるものである。すなわち、研磨テープ
1を介して、粘弾性体のコンタクトローラ2を、平行ば
ね4a、4bによって円板3面上へ圧着接触させること
ができる一対の加工ユニットを有する加工ヘッド12と
、この加工ヘッド12を円板3の内、外周部に移動させ
るための加工ヘッド摺動部5と、コンタクトローラの移
動位置を円板の半径寸法で常時検出できるリニアスケー
ル6と、円板3を回転駆動させる円板回転モータ7、円
板と研磨テープとの間に研磨剤9を供給する研磨剤供給
機構(図示せず)、研磨テープ1と円板3との相対速度
を一定に制御する制御装置6′から構成されている。
First, the configuration of this embodiment will be explained using FIGS. 1 to 3. This disk finishing device is capable of simultaneously polishing and finishing both sides of the disk 3. That is, a processing head 12 includes a pair of processing units capable of bringing a contact roller 2 made of a viscoelastic body into pressure contact with the surface of a disk 3 by means of parallel springs 4a and 4b via an abrasive tape 1, and this processing head. 12 to the inner and outer circumference of the disk 3, a linear scale 6 that can constantly detect the movement position of the contact roller based on the radius dimension of the disk, and a linear scale 6 that rotationally drives the disk 3. A disc rotation motor 7, an abrasive supply mechanism (not shown) that supplies an abrasive 9 between the disc and the abrasive tape, and a control device 6 that controls the relative speed between the abrasive tape 1 and the disc 3 to be constant. ’.

つぎに、この円板仕上装置を使用して、本発明の円板仕
上方法の一実施例を説明する。
Next, an embodiment of the disk finishing method of the present invention will be described using this disk finishing apparatus.

はじめに、円板3を、円板回転軸8に設置する。加工ヘ
ッド摺動部5を作動させ、円板の外周部で研磨テープ1
をコンタクトローラ2によって押圧し、研磨テープ2を
微小速度で巻取りながら、同時に研磨剤9を円板上に供
給し、円板3を回転させながら、加工ヘッド摺動部5に
よってコンタクトローラ2および研磨テープ1を円板の
内周方向に移動させる。摺動部5の位置は、リニアスケ
ール6によって常時検出され、円板3上の加工点と研磨
テープ1との相対速度が一定になるように、制御装置6
′を経て、円板回転モータ7の回転数を制御する。研磨
テープ1と円板3の移動による相対速度が一定となるよ
うに制御することにより、介在する研磨剤9による動圧
が等しくなる。したがって、円板全表面にわたり、均一
な押圧力で研磨テープ1が円板3面上に作用するので、
突起除去効果は均等になり、高精度な平滑面に仕上がっ
た円板を得ることができる。
First, the disk 3 is installed on the disk rotating shaft 8. The processing head sliding part 5 is operated, and the polishing tape 1 is applied to the outer periphery of the disk.
is pressed by the contact roller 2, and while the abrasive tape 2 is wound up at a minute speed, the abrasive 9 is simultaneously supplied onto the disk, and while the disk 3 is rotated, the contact roller 2 and The polishing tape 1 is moved toward the inner circumference of the disk. The position of the sliding part 5 is constantly detected by the linear scale 6, and the controller 6 controls the position so that the relative speed between the processing point on the disk 3 and the polishing tape 1 is constant.
', the rotation speed of the disc rotating motor 7 is controlled. By controlling the relative speed of the movement of the polishing tape 1 and the disk 3 to be constant, the dynamic pressure caused by the intervening polishing agent 9 becomes equal. Therefore, since the polishing tape 1 acts on the disk 3 surface with a uniform pressing force over the entire disk surface,
The protrusion removal effect becomes uniform, and a disc with a highly precise smooth surface can be obtained.

本実施例の効果は、円板の両面の全表面にわたり、微細
突起を一度に除去し、きわめて高精度(突起高さが0.
05μm以下)な表面をもつ円板が効率よく得られる。
The effect of this embodiment is that fine protrusions are removed all at once over the entire surface of both sides of the disk, with extremely high accuracy (protrusion height is 0.
05 μm or less) can be efficiently obtained.

なお、本実施例の場合には、研磨テープと円板面との間
隙に、研磨剤として液体を供給したが、液体の代りに不
活性ガスを供給した場合でも、研磨テープと円板との相
対速度を1.200 (m/m1n)と一定にした場合
(加工液の場合は500 (m/m i n) )には
1円板全面にわたって微細突起を均一に低減することが
でき、表面均質な円板が得られている。
In the case of this example, a liquid was supplied as an abrasive into the gap between the polishing tape and the disk surface, but even if an inert gas was supplied instead of the liquid, the relationship between the polishing tape and the disk When the relative velocity is kept constant at 1.200 (m/min) (500 (m/min) in the case of machining fluid), it is possible to uniformly reduce the fine protrusions over the entire surface of one disk. A homogeneous disk is obtained.

第4図は、本発明の円板仕上装置の他の実施例に係る微
細突起を除去する加工部の拡大模式図である。第3図に
おける実施例では、研磨テープを押圧するためにコンタ
クトローラを用いたが、その代りに粘弾性体のプラテン
11の如き材料を用いてもよく、前例と同一条件で試験
した結果1円板全面にわたり、均一に研磨でき、表面均
質な円板が得られた′。
FIG. 4 is an enlarged schematic diagram of a processing section for removing minute protrusions according to another embodiment of the disk finishing apparatus of the present invention. In the embodiment shown in FIG. 3, a contact roller is used to press the abrasive tape, but a material such as a viscoelastic platen 11 may be used instead.As a result of testing under the same conditions as the previous example, The entire surface of the plate could be polished uniformly, and a disk with a homogeneous surface was obtained.

[発明の効果] 本発明によれば、円板の表裏両面の全面にわたり、微細
突起を除去する研磨テープと円板との相対速度を、加工
点の位置に拘らず一定にしたので、突起除去効果が円板
全面において均質となり、突起高さを均等に低減する効
果がある。これによって、磁気ディスク、特に薄膜磁気
ディスクに対して、デスク面上の微細突起をディスク全
面にわたって均一に。
[Effects of the Invention] According to the present invention, the relative speed between the abrasive tape for removing minute protrusions and the disk is constant over the entire surface of both the front and back surfaces of the disk, regardless of the position of the processing point. The effect is uniform over the entire surface of the disk, and the height of the protrusion is reduced evenly. This makes the fine protrusions on the disk surface uniform over the entire surface of the disk, especially for thin-film magnetic disks.

精度よく低減できるので、ヘッドフラッシュの最も大き
な要因が排除され、ヘッドの低浮上安定性が得られ、円
板の信頼性が大幅に向上する。
Since it can be reduced with high precision, the most important factor of head flash is eliminated, the head can achieve low flying stability, and the reliability of the disk can be greatly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は1本発明の円板仕上装置の一実施例の要部正面
図、第2図は、同上の要部側面図、第3図は、本発明の
円板仕上法を説明するための加工部の拡大模式図、第4
図は、本発明の円板仕上装置の他の実施例の微細突起を
除去する加工部の拡大模式図、第5図は、従来の突起除
去装置を示す斜視図である。 〈符号の説明〉 1・・・研磨テープ、2・・・コンタクトローラ、3・
・・円板、4 (a、b)・・・平行板ばね、5・・・
加工ヘッド摺動部、6・・・リニアスケール、6′・・
・制御装置、7・・・円板回転モータ、8・・・円板回
転軸、9・・・研磨剤、10・・・微細突起、11・・
・プラテン、12・・・加工ヘッド、W・・・動圧、δ
・・・円板面と研磨テープとの間隙、h・・・突起の高
Fig. 1 is a front view of the essential parts of an embodiment of the disc finishing apparatus of the present invention, Fig. 2 is a side view of the essential parts of the same, and Fig. 3 is for explaining the disc finishing method of the present invention. Enlarged schematic diagram of the processing section, No. 4
The figure is an enlarged schematic view of a processing section for removing minute protrusions in another embodiment of the disc finishing apparatus of the present invention, and FIG. 5 is a perspective view showing a conventional protrusion removing apparatus. <Explanation of symbols> 1... Polishing tape, 2... Contact roller, 3...
...Disk, 4 (a, b)...Parallel leaf spring, 5...
Processing head sliding part, 6...Linear scale, 6'...
- Control device, 7... Disc rotation motor, 8... Disc rotation shaft, 9... Abrasive, 10... Fine protrusion, 11...
・Platen, 12... Processing head, W... Dynamic pressure, δ
... Gap between disk surface and polishing tape, h ... Height of protrusion

Claims (1)

【特許請求の範囲】 1、回転する円板の表面へ、研磨剤を供給しながら、研
磨テープを圧着接觸させること により、前記円板表面の微細突起を除去す るようにした円板仕上方法において、研磨 テープと、この研磨テープが接觸する回転 円板上の加工点との相対速度を、加工点の 位置に拘らず一定にしたことを特徴とする 円板仕上方法。 2、回転する円板の表面へ、研磨剤を供給しながら、研
磨テープを圧着接觸させること により、前記円板表面の微細突起を除去す るようにした円板仕上装置において、円板 を取付けることができる円板回転軸と、こ の円板回転軸を駆動する円板回転モータと、前記円板の
両面側の対向する加工点へ、研 磨テープを介してコンタクトローラを圧着 接觸させることができる一対の加工ユニッ トを有する加工ヘッドと、この加工ヘッド を前記円板の半径方向へ往復動させること ができる加工ヘッド摺動部と、この加工ヘ ッド摺動部の位置を検出するリニアスケー ルと、このリニアスケールによる検出値に 基づいて前記加工点における前記研磨テー プと円板との相対速度が加工点の位置に拘 らず一定になるように、前記円板回転モー タの回転数を制御することができる制御装 置とを具備したことを特徴とする円板仕上 装置。
[Scope of Claims] 1. A method for finishing a disc in which fine protrusions on the surface of a rotating disc are removed by applying an abrasive tape to the surface of the rotating disc while supplying an abrasive. A disk finishing method characterized in that the relative speed between an abrasive tape and a machining point on a rotating disk that the abrasive tape comes into contact with is constant regardless of the position of the machining point. 2. Attaching a disk in a disk finishing device that removes fine protrusions on the surface of a rotating disk by applying an abrasive tape to the surface of the rotating disk while supplying an abrasive. A disc rotation shaft that can rotate the disc, a disc rotation motor that drives the disc rotation shaft, and a pair that can press and contact contact rollers via abrasive tape to opposing processing points on both sides of the disc. a processing head having a processing unit; a processing head sliding section capable of reciprocating the processing head in the radial direction of the disk; a linear scale for detecting the position of the processing head sliding section; Control capable of controlling the rotation speed of the disc rotation motor so that the relative speed between the polishing tape and the disc at the processing point is constant regardless of the position of the processing point based on a value detected by a scale. A disk finishing device characterized by comprising:
JP29601687A 1986-12-19 1987-11-26 Method of finishing disc and device therefor Pending JPH01140958A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP29601687A JPH01140958A (en) 1987-11-26 1987-11-26 Method of finishing disc and device therefor
US07/933,893 US5985402A (en) 1986-12-19 1992-08-24 Magnetic disk and its manufacturing method
US08/673,470 US5737159A (en) 1987-07-29 1996-07-01 Magnetic disk and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29601687A JPH01140958A (en) 1987-11-26 1987-11-26 Method of finishing disc and device therefor

Publications (1)

Publication Number Publication Date
JPH01140958A true JPH01140958A (en) 1989-06-02

Family

ID=17828027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29601687A Pending JPH01140958A (en) 1986-12-19 1987-11-26 Method of finishing disc and device therefor

Country Status (1)

Country Link
JP (1) JPH01140958A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03142158A (en) * 1989-10-27 1991-06-17 Sumitomo Special Metals Co Ltd Surfacing method for magnetic disk board
WO1993017829A2 (en) * 1992-02-27 1993-09-16 Oliver Design, Inc. System and method for texturing magnetic data storage disks
US6283838B1 (en) * 1999-10-19 2001-09-04 Komag Incorporated Burnishing tape handling apparatus and method
JP2009508606A (en) * 2005-09-24 2009-03-05 ブラウン、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング Electric hair removal device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03142158A (en) * 1989-10-27 1991-06-17 Sumitomo Special Metals Co Ltd Surfacing method for magnetic disk board
WO1993017829A2 (en) * 1992-02-27 1993-09-16 Oliver Design, Inc. System and method for texturing magnetic data storage disks
WO1993017829A3 (en) * 1992-02-27 1993-10-28 Oliver Design Inc System and method for texturing magnetic data storage disks
US5490809A (en) * 1992-02-27 1996-02-13 Oliver Design, Inc. System and method for texturing magnetic data storage disks
US6283838B1 (en) * 1999-10-19 2001-09-04 Komag Incorporated Burnishing tape handling apparatus and method
JP2009508606A (en) * 2005-09-24 2009-03-05 ブラウン、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツング Electric hair removal device

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