JPS62213955A - Polishing device for disc base board - Google Patents

Abstract

PURPOSE:To provide precision grind finishing by coupling a tensioning means with a supply reel, and controlling the tension of a polishing tape produced by said tensioning means on the basis of signals informing the residual amount of the polishing tape in the supply reel. CONSTITUTION:A disc base plate 1 is rotated, and a pressure member 8 to press a polishing tape 4 to this disc base plate is reciprocated in the radial direction of the disc plate 1. The polishing tape 4 is sent from the supply reel 5 to a takeup reel 6, while it is rubbed with the disc base plate 1, and thereby the surface of the plate 1 is polished. Control is made for the load on the supply reel 5 produced by a tension motor 11 as a tensioning means, on the basis of signals from a tape residual amount sensor 12, which senses the residual amount of the polishing tape 4 in the supply reel 15. Thus the polishing operation can be made with the tape 4 given a constant tension at all times regardless of the tape residual amount, that should prevent generation of unevenness in polishing due to stretch and shrinkage of the tape 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field 1] The present invention relates to a disk substrate polishing apparatus used for smoothing the surface of a disk substrate such as a magnetic disk or an optical disk.

[Conventional technology 1 For example, a magnetic disk is used as a disk substrate.

It is manufactured by forming a magnetic coating on the surface of a disk substrate made of aluminum or the like by means such as vapor deposition, or in order to uniformly form this magnetic coating, the surface of the disk substrate is coated before the formation of the magnetic coating. The surface is polished to an extremely smooth finish. In addition, in order to keep the film thickness of the magnetic film constant even after the magnetic film is formed, polishing is performed, or polishing of the disk substrate is performed before or after the formation of the magnetic film. A disk substrate polishing device is used for this purpose.

This disk substrate polishing device is equipped with a rotating device that rotates the disk substrate, and an abrasive tape that polishes the surface of the disk substrate. The abrasive tape is pressed against the surface of the disk substrate by a pressure member that is reciprocally movable in the radial direction of the disk substrate while the abrasive tape is being wound and fed onto a take-up reel by a take-up roller. Abrasive tapes have been known for polishing the surface of a disk substrate by rubbing the surface thereof.

[Problem to be Solved by the Invention 1] Here, when polishing a disk substrate with an abrasive tape, the abrasive tape is not in contact with the disk substrate with a certain tension, or is stretched. There will be a difference in the amount of polishing between the shrunken state and the shrunken state, making it impossible to polish uniformly. By the way, in the above-described prior art disk substrate polishing apparatus, the load on the feed reel that supplies the polishing tape for feeding the polishing tape changes depending on the remaining amount of the polishing tape. Due to this change in load, the tension of the abrasive tape changes, causing expansion and contraction of the abrasive tape, which may result in uneven polishing. Especially the exchange of the feed reel! ! j! In order to reduce the frequency, if the winding diameter of the polishing dezo on the delivery reel is increased,
There was a drawback that the expansion and contraction of the polishing tape due to changes in load became extremely large, resulting in significant polishing unevenness on the disk substrate.

The present invention has been made in view of the above points, and its purpose is to be able to keep the tension constant when feeding the abrasive tape, regardless of the amount of abrasive tape remaining on the feed reel. It is an object of the present invention to provide a polishing device for a disk substrate, which enables accurate polishing and finishing.

[Means for Solving the Problems J] In order to achieve the above-mentioned object, the disk substrate polishing apparatus according to the present invention provides a polishing tape to the delivery reel, which has a load applied to the rotation of the delivery reel. A tension means is connected to apply tension to the abrasive tape by applying a tension to the abrasive tape, and a remaining tape amount detector for detecting the remaining amount of the abrasive tape on the delivery reel is attached, and the remaining tape amount G on the tape remaining amount detector is related to: The present invention is characterized in that the tension of the abrasive tape by the tensioning means is controlled based on a signal.

[Operation 1] The present invention is constructed as described above, and in order to polish a disk substrate using this polishing device, the disk substrate is mounted on a rotating device, and one side or both sides of the disk substrate are polished. The abrasive tape supplied from the delivery reel is pressed by a pressure member. Therefore, the rotating device is driven to rotate the disk substrate, and at the same time, the pressure member that presses the abrasive tape against the disk substrate is reciprocated in the radial direction of the disk substrate. The surface of the disk substrate is polished by rubbing the abrasive tape against the disk substrate while feeding the abrasive tape from the take-up roller delivery reel, which is closer to the take-up reel than the member arrangement position t, toward the take-up side. Perform polishing.

Therefore, the load applied to the feeding of the abrasive tape by the take-up roller will vary depending on the amount of abrasive tape remaining on the delivery reel. That is, when there is a large amount of abrasive tape remaining on the delivery reel, the load on the roller increases by one turn, and the tension of the abrasive tape sent from the delivery reel increases, causing it to become stretched. On the other hand, when the amount of abrasive tape remaining on the delivery reel decreases, the load on the take-up roller decreases, the tension on the abrasive tape decreases, and the abrasive tape ends up being fed in a shrunken state. However, in particular, the polishing apparatus according to the present invention is provided with a tape remaining amount detector for detecting the remaining amount of abrasive tape on the delivery reel, and based on a signal from the tape remaining amount detector, the polishing tape is fed out by the tensioning means. Because we are trying to control the load on the reel,
Regardless of the amount of abrasive tape remaining on the delivery reel, polishing work can be performed with constant tension applied to the abrasive tape, ensuring that uneven polishing of the disk substrate due to expansion and contraction of the abrasive tape will not occur. It will be possible to prevent this from happening.

[Embodiment 1] Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

First, in Figure i1, l indicates a disk substrate, and the disk substrate l is formed of a member such as aluminum in an annular shape, and a magnetic coating is formed on each of its front and back surfaces. It has become.

Before forming a magnetic film on the surface of the disk substrate l, a polishing device is used to polish the disk substrate l.
A polished finish has been applied. This polishing device includes a chuck member 2 that supports the inner peripheral edge of the disk substrate l, and a disk rotation motor 3 as a driving means.
The disk substrate 1 is configured to be able to be rotated by a rotating device consisting of a rotating device, and while the disk substrate 1 is rotating, the surface of the disk substrate 1 is rubbed with an abrasive tape 4 made of lapping tape or the like. It can be polished by hand. The abrasive tape 4 is made to run from a delivery reel 5 toward a take-up sole 6, and the abrasive tape 4 is brought into contact with the surface of the disk substrate 1 during the run of the abrasive tape 4. It has become. And this abrasive tape 4
A pressure member 8 equipped with a pressurizing pad 7 for pressing the abrasive tape 4 onto the disk substrate l is attached to a portion of the disk substrate l that occupies the disk substrate l. Furthermore, a take-up roller 9 for the abrasive tape 4 is installed on the take-up reel 6 side of the pressure head 7 in the travel path of the abrasive tape 4, and the chain take-up roller 9 is driven by a take-up motor 10. Thus, the abrasive tape 4 can be fed from the feed reel 5 side to the take-up reel 6 side.

As shown in FIG. 2, a tension motor 11 as a tensioning means is connected to the feed-out rule 5.
The tension motor 11 applies a load to the feeding of the abrasive tape 4 by the feed reel 5, thereby making it possible to apply a predetermined tension to the abrasive tape 4. Further, the feed reel 5 is provided with a tape remaining amount detector 12 for detecting the remaining amount of the abrasive tape 4 on the feed reel 5. The remaining tape amount detector 12 includes a detection dog 1 equipped with a roller 13 that comes into contact with the abrasive tape 4 wound around the feed-out roll 5.
4, and by connecting the detection barb 14 to the tip of the rotating shaft 15, it rotates about the rotating shaft 15 in accordance with the remaining winding diameter of the abrasive tape 4 on the delivery reel 5. Further, the rotating shaft 15 is configured to be rotated following the detection barb 14. The rotary shaft 15 is rotatably supported by a bearing 16 as a support mechanism at the intermediate portion, and a potentiometer 17 as a rotation angle detector for detecting the rotation angle of the rotary shaft 15 is connected to the base end thereof. . A spring 18 is attached to the detection dog 14, and the spring 18 always urges the detection dog 14 in the direction of contacting the roller 13 attached to its tip or the abrasive tape 4. There is.

This embodiment is constructed as described above, in which the disk substrate 1 is mounted on the chuck member 2, and the disk substrate 1 is mounted on the chuck member 2, and the
The abrasive tape 4 is fed out from the wheel 5, the abrasive tape 4 is brought into contact with the surface of the disk substrate 1, and the abrasive tape 4 is brought into contact with the surface of the disk substrate 1.
is placed so as to be pressed against the disk substrate l by the pressure pad 7 of the pressure member 8.

Therefore, by driving the disk rotation motor 3, the disk substrate l is rotated and the pressure member 8 is reciprocated, and during this time the winding motor lO is operated.
By feeding the abrasive tape 4 from the feed reel 5 side toward the take-up reel 6 side, the disk substrate 1
The surface will be polished by the polishing tape 4.

As mentioned above, in order to polish the surface of the disk substrate l with extremely strict accuracy using the polishing tape 4, it is necessary to feed the polishing tape 4 with constant tension at all times. If the tension of the polishing tape 4 increases and it becomes stretched, or if the tension is insufficient and it is sent into a contracted state, the accuracy of polishing the surface of the disk substrate 1 will be affected. The tension of the abrasive tape 4 changes depending on the remaining amount of the abrasive tape 4 wound around the feed-out roll 5.

Therefore, in this embodiment, the tension of the abrasive tape 4 is kept constant by detecting the remaining amount of the abrasive tape 4 on the feeding reel 5 and controlling the output torque of the tension motor 11 based on this detection signal. I try to keep it. That is, as shown in FIG.
The abrasive tape 4 is wrapped up to the position shown by the solid line! I was sent out by Nagi, and there's only one point left!
When the position shown by line A is reached, the detection dog 14 having the roller 13 that comes into contact with the polishing tape 4 is rotated by an angle .theta. toward the feed-out rule 5 about the rotating shaft 15.

The rotating shaft 15 is configured to rotate following the detection dog 14, and the rotation angle of the rotating shaft 15 is detected by a potentiometer 17. By detecting this, it becomes possible to detect the amount of polishing tape 4 remaining on the feeding reel 5. Therefore, the detection signal from the potentiometer 17 regarding the remaining amount of the abrasive tape 4 is input as a control signal to the tension motor 11 that applies a load to the sending reel 5.
Based on this signal, the output torque of the tension motor 11 is controlled. As a result, the feed-out rule 5
Regardless of the remaining amount of the abrasive tape 4, the abrasive tape 4 can be fed with a constant tension at all times. You will be able to improve your skills.

Further, regardless of the amount of abrasive tape 4 on the feed reel 5, the polishing work of the disk substrate l can be performed with the abrasive tape 4 always under a constant tension, so that the feed-out The winding diameter of the polishing tape 4 of the tape 5 can be increased, and the frequency of its replacement can be reduced.

In the above-mentioned embodiments, the explanation was given as an apparatus for polishing the disk substrate l before forming a magnetic coating, or it was explained as an apparatus for polishing the disk substrate l before forming a magnetic coating 1, or a polishing apparatus for making the film thickness constant after the magnetic coating 1 is formed. Needless to say, it can also be used as a device for polishing disk substrates such as optical disks. Furthermore, the polishing tape 4 may be pressed against not only one side of the disk substrate l but also both sides of the disk substrate l for polishing. Furthermore, the disk substrate (2) is polished by pressing the abrasive tape 4 against the disk substrate I and displacing the abrasive tape 4 in the radial direction of the disk substrate 1. It can also be used when polishing while supplying liquid. Further, the tension motor 11 is used as the tensioning means for applying tension to the abrasive tape 4, but instead of this, for example, a resistance means for applying frictional resistance to the feed reel 5 may be used.
The force with which the resistance means presses the feed-out rule 5 may be controlled based on a signal from a tape remaining amount detector. Furthermore, in addition to the method shown in the above-mentioned embodiments, the tape remaining amount detector can also be formed by, for example, forming a slit groove in the radial direction in the feed-out roll 5 and placing an optical sensor opposite to this slit groove. In addition, even when using the detection barb 14, the detection barb 14
The position may be directly detected.

[Advantageous Effects of the Invention 1] As detailed above, the disk substrate polishing device according to the present invention feeds the abrasive tape sent out from the delivery reel with a predetermined tension, regardless of the amount of polishing tape remaining on the delivery reel. With this structure, the abrasive tape does not expand or contract during the polishing process, and the disk substrate can be polished while keeping the abrasive tape in a constant state, thereby ensuring uniform polishing. This makes it possible to perform precise polishing without creating uneven polishing.

[Brief explanation of drawings]

Figures 1 to 3 show embodiments of the present invention; Figure 1 is a diagram of the overall configuration of the polishing equipment; Figure 2 is a diagram illustrating the configuration of the tension adjustment mechanism for the polishing tape; Figure 3 is a diagram illustrating its operation. It is. l: disk substrate, 2: chuck member, 3: disk rotation motor, 4: polishing tape, 5: delivery reel,
6: Take-up reel, 7: Pressure head, 8: Pressure member, 9
: Take-up reel, 11: Tension motor, 12: Remaining tape amount detector, 13: Roller, 14: Detection barb, 15:
Rotation axis, 17: Potentiometer.

Claims (1)

[Claims] A disk substrate is rotatably supported by a rotating device,
An abrasive tape sent out from a delivery reel is pressed against the disk substrate by a pressure member capable of reciprocating in the radial direction of the disk substrate, and the disk substrate is polished while the abrasive tape is transferred by a take-up roller. A tension means is connected to the delivery reel to apply tension to the abrasive tape by applying a load to the rotation of the delivery reel, and a tape remaining amount for detecting the remaining amount of the abrasive tape on the delivery reel. 1. A polishing apparatus for a disk substrate, characterized in that a detector is attached, and the tension of the polishing tape by the tensioning means is controlled based on a signal regarding the remaining amount of tape from the remaining tape amount detector.