JPH10244455A - Glass substrate smoothing device - Google Patents

Glass substrate smoothing device

Info

Publication number
JPH10244455A
JPH10244455A JP6553297A JP6553297A JPH10244455A JP H10244455 A JPH10244455 A JP H10244455A JP 6553297 A JP6553297 A JP 6553297A JP 6553297 A JP6553297 A JP 6553297A JP H10244455 A JPH10244455 A JP H10244455A
Authority
JP
Japan
Prior art keywords
glass substrate
polishing
push
flexible stage
pushing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6553297A
Other languages
Japanese (ja)
Other versions
JP3726405B2 (en
Inventor
Yasuo Kidouchi
康夫 城戸内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6553297A priority Critical patent/JP3726405B2/en
Publication of JPH10244455A publication Critical patent/JPH10244455A/en
Application granted granted Critical
Publication of JP3726405B2 publication Critical patent/JP3726405B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a glass substrate smoothing device capable of flattening a substrate efficiently by uniformly grinding the entire surfaces of a glass substrate having coat film such as color filter substrate and locally raising the grinding level for those protruded parts caused by waviness or foreign matter. SOLUTION: A glass substrate smoothing device comprises a grinding means 2 which grinds the surfaces of a glass substrate 1, a flexible stage 9 which fixedly supports the glass substrate 1, and a push up means 10 which partially push up the glass substrate 10 from the underside. Also the necessary protruded and nonuniformly coated parts in the glass substrate 1 located on the flexible stage 9 are raised from the underside so as to enable to selectively vary grinding level and sufficiently smoothen the parts in a specified processing time.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、カラーフィルター
基板等の塗布膜を有するガラス基板のうねりや異物によ
る突起を研磨し、平坦にするガラス基板平滑化装置に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass substrate smoothing apparatus for polishing a glass substrate having a coating film such as a color filter substrate or the like due to undulations or foreign matters and flattening the same.

【0002】[0002]

【従来の技術】一般に、カラーフィルター基板等の塗布
膜を有するガラス基板のうねりや異物による突起を研磨
する装置としては、ガラス基板を吸着固定するステージ
と、可撓性で押圧しながら研磨するポリッシャーとで構
成され、アルミナ等の研磨剤を用いて、ポリッシャーと
ガラス基板との一方もしくは双方を回転して、ガラス基
板全体を研磨する装置と、突起の部分にのみ直接研磨テ
ープを用いて研磨する装置が従来より知られている。
2. Description of the Related Art In general, as a device for polishing projections due to undulations or foreign substances on a glass substrate having a coating film such as a color filter substrate, a stage for adsorbing and fixing the glass substrate and a polisher for polishing while pressing with flexibility. The polishing apparatus is configured to rotate one or both of the polisher and the glass substrate using an abrasive such as alumina, and a device for polishing the entire glass substrate, and directly polishing only the projections using a polishing tape. Devices are conventionally known.

【0003】[0003]

【発明が解決しようとする課題】しかし、ガラス基板全
体を研磨する装置は、ガラス基板全体を一様に研磨する
方式であるため、ガラス基板の一部に大きな突起がある
場合、その突起がある部分を充分研磨することができな
い。また、ガラス基板の突起を充分研磨するようにする
と、突起以外の部分が必要以上に研磨され二次的な不良
となることがあった。一方、突起の部分にのみ直接研磨
テープを用いて研磨する装置では、あらかじめ突起を検
査して、その検査によって検出した検出部分を局部的に
研磨するもので、突起の検出数に比例して処理能力が変
化する欠点があった。
However, since the apparatus for polishing the entire glass substrate is a system for uniformly polishing the entire glass substrate, if there is a large projection on a part of the glass substrate, the projection is present. The part cannot be sufficiently polished. In addition, if the projections on the glass substrate are sufficiently polished, portions other than the projections may be polished more than necessary, resulting in secondary defects. On the other hand, an apparatus that uses a polishing tape directly to polish only the projections, inspects the projections in advance, and locally polishes the detected portions detected by the inspection, and treats them in proportion to the number of detected projections. There was a disadvantage that the ability changed.

【0004】[0004]

【課題を解決するための手段】本発明のガラス基板平滑
化装置は、ガラス基板面を研磨する研磨手段と、ガラス
基板を支持する可撓ステージと、ガラス基板を可撓ステ
ージを介して下方から局部的に突き上げる突き上げ手段
を有し、可撓ステージ上のガラス基板に対して、突起や
塗布むら等のガラス基板内の必要部分を下方から持ち上
げて研磨するようにしたものであるから、選択的に研磨
レベルを変えることが可能となり、一定の処理時間で充
分平滑化できるものである。
A glass substrate smoothing apparatus according to the present invention comprises a polishing means for polishing a glass substrate surface, a flexible stage for supporting the glass substrate, and a glass substrate from below via a flexible stage. It has a push-up means for locally pushing up, and a necessary portion in the glass substrate such as a projection or uneven coating is lifted from below and polished with respect to the glass substrate on the flexible stage. Thus, the polishing level can be changed, and the surface can be sufficiently smoothed in a certain processing time.

【0005】[0005]

【発明の実施の形態】本発明の請求項1に記載の発明
は、ガラス基板面を研磨する研磨手段と、ガラス基板を
支持する可撓ステージと、ガラス基板を可撓ステージを
介して下方から部分的に突き上げる突き上げ手段を有す
る装置であるから、可撓ステージ上のワークであるガラ
ス基板に対して、突起や塗布むら等のガラス基板内の必
要部分を下方から押し上げることで、部分的に加工レベ
ルを上げることが可能となり、一定の処理時間で充分平
滑化できるものである。
DETAILED DESCRIPTION OF THE INVENTION According to the first aspect of the present invention, a polishing means for polishing a surface of a glass substrate, a flexible stage for supporting the glass substrate, and a glass substrate from below via the flexible stage. Since the device has push-up means for partially pushing up, a required portion of the glass substrate, such as a projection or uneven coating, is pushed up from below onto the glass substrate, which is a work on the flexible stage, to partially process the glass substrate. The level can be increased, and sufficient smoothing can be performed in a fixed processing time.

【0006】請求項3に記載の発明は、請求項2で特定
したように可撓性で押圧しながら回転するポリッシング
ヘッドと研磨剤を供給する供給部を有する研磨手段と、
XY座標を選択しガラス基板を下方から局部的に突き上
げる突き上げ手段を有するようにしたため、可撓ステー
ジ上のワークであるガラス基板に対して、研磨剤を介し
て、ポリッシングヘッドを押圧して回転させ、ガラス基
板全体を研磨し平滑化させるもので、特に突起や塗布む
ら等がガラス基板内にある場合、その位置を検査機等に
よりXY座標で特定し、その座標位置のみガラス基板を
下方から部分的に突き上げることで、全面を研磨するポ
リッシングヘッドが、その座標位置のみ押圧力を強くし
て、その座標位置のガラス基板表面のみ研磨レベルを高
くし、全体の平滑度を高めるものである。
According to a third aspect of the present invention, there is provided a polishing means having a polishing head which is flexible and rotates while pressing, and a supply section for supplying an abrasive, as specified in the second aspect,
Since the XY coordinates are selected and the pushing means for pushing the glass substrate locally from below is provided, the polishing head is pressed and rotated with respect to the glass substrate which is a work on the flexible stage via an abrasive. In order to polish and smooth the entire glass substrate, especially when there are projections or uneven coating in the glass substrate, the position is specified by an XY coordinate by an inspection machine or the like, and only the coordinate position is part of the glass substrate from below. When the polishing head is polished up, the polishing head for polishing the entire surface increases the pressing force only at the coordinate position, increases the polishing level only at the glass substrate surface at the coordinate position, and increases the overall smoothness.

【0007】請求項4に記載の発明は、可撓性で押圧し
ながら回転するポリッシングヘッドと、そのポリッシン
グヘッドと同期してXY座標を選択し、ガラス基板を下
方から局部的に突き上げる突き上げ手段を有することか
ら、可撓ステージ上のワークであるガラス基板に対し
て、研磨剤を供給して、ポリッシングヘッドを押圧して
回転させ、ガラス基板全体を研磨し平滑化させることが
できる。従って特に突起や塗布むら等がガラス基板内に
ある場合、その位置を検査機等によりXY座標で特定
し、全面を研磨するポリッシングヘッドが、その座標位
置のみガラス基板を下方から局部的に突き上げること
で、その座標位置のみ押圧力を強くして、その座標位置
のガラス基板表面のみ研磨レベルを高くし、全体の平滑
度を高めるものである。
According to a fourth aspect of the present invention, there is provided a polishing head which is flexible and rotates while being pressed, and a push-up means for selecting an XY coordinate in synchronization with the polishing head and for locally pushing up the glass substrate from below. Accordingly, the polishing agent is supplied to the glass substrate, which is a work on the flexible stage, and the polishing head is pressed and rotated to polish and smooth the entire glass substrate. Therefore, especially when projections or uneven coating are present in the glass substrate, the position is specified by XY coordinates using an inspection machine or the like, and the polishing head that polishes the entire surface locally pushes the glass substrate only from the coordinate position from below. Thus, the pressing force is increased only at the coordinate position, the polishing level is increased only at the surface of the glass substrate at the coordinate position, and the overall smoothness is increased.

【0008】[0008]

【実施例】以下、本発明のガラス基板平滑化装置の一実
施例を図1を用いて説明する。図1において、カラーフ
ィルター基板やガラス基板等のワークであるガラス基板
1に対して、その表面を研磨する研磨手段2として可撓
性のポリッシングヘッド3は、X軸,Y軸それぞれにパ
ルスモータ4とLMガイド5により縦横自在に位置制御
できる構成になっている。前記ポリッシングヘッド3は
モータ6により回転し、空気圧シリンダ7でZ軸方向に
可動すると共に、その圧力により、ガラス基板1へポリ
ッシングヘッド3を押しつける圧力を変化させる。その
圧力と回転速度と、砥粒を水に溶かした研磨剤8を供給
する供給部8aからの吐出量を加減することで、研磨レ
ベルを選択できる構成である。一方、可撓性のゴムから
なる可撓ステージ9は、その表面に細い溝が切られ、真
空引きにすることでガラス基板1を支持固定する。前記
可撓ステージ9の下方には、この可撓ステージ9を局部
的に突き上げる突き上げ手段10を設けている。前記突
き上げ手段10は、X軸,Y軸それぞれにパルスモータ
11とLMガイド12により縦横自在に位置制御できる
構成で、Z軸方向は、パルスモータ13の回転がネジ機
構14を介して突き上げヘッド15を突出させ、可撓ス
テージ9を局部的に持ち上げるものである。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the glass substrate smoothing apparatus of the present invention will be described below with reference to FIG. In FIG. 1, a flexible polishing head 3 as a polishing means 2 for polishing a surface of a glass substrate 1, which is a work such as a color filter substrate or a glass substrate, has a pulse motor 4 for each of the X axis and the Y axis. And the LM guide 5 so that the position can be controlled vertically and horizontally. The polishing head 3 is rotated by a motor 6 and is movable in the Z-axis direction by a pneumatic cylinder 7. The pressure changes the pressure for pressing the polishing head 3 against the glass substrate 1. The polishing level can be selected by adjusting the pressure, the rotation speed, and the discharge amount from the supply unit 8a that supplies the abrasive 8 in which the abrasive grains are dissolved in water. On the other hand, the flexible stage 9 made of flexible rubber has a thin groove formed on the surface thereof, and the glass substrate 1 is supported and fixed by vacuuming. Below the flexible stage 9, a push-up means 10 for locally pushing up the flexible stage 9 is provided. The push-up means 10 has a structure in which the position of the pulse motor 13 can be controlled vertically and horizontally in the X-axis and Y-axis by a pulse motor 11 and an LM guide 12. Are projected, and the flexible stage 9 is locally lifted.

【0009】以上の構成でガラス基板1は、可撓ステー
ジ9に真空吸着され、ガラス基板1の全面をXY座標位
置を制御しながら、ポリッシングヘッド3が空気圧シリ
ンダ7で押しつけながら回転し、研磨剤8を供給して研
磨する。
With the above structure, the glass substrate 1 is vacuum-adsorbed to the flexible stage 9 and the polishing head 3 rotates while pressing the entire surface of the glass substrate 1 with the pneumatic cylinder 7 while controlling the XY coordinate position, and the abrasive 8 is supplied and polished.

【0010】一方、図2に示すようにガラス基板1は突
き上げヘッド15が可撓ステージ9の下方から押し上げ
るとガラス基板1を局部的に突出し、そこだけ研磨圧力
が高くなり、研磨剤8の量が増加する。すなわち、ガラ
ス基板1内に突起や塗布むら等がある場合、その位置を
検査機等によりXY座標で特定し、その位置に突き上げ
ヘッド15を合わせ、ガラス基板1を下方から局部的に
突き上げることで、全面を研磨するポリッシングヘッド
3が、その座標位置のみ押圧力が強くなり、その座標位
置のガラス基板1表面のみ研磨レベルを高くし、全体の
平滑度を高めるものである。また、突き上げ手段10は
XY座標に対して、任意の位置を選択できることより、
突起が複数箇所ある場合等、ポリッシングヘッド3のX
Y座標位置と同位置に突き上げ手段10を合わせ、突き
上げヘッド15を突き上げることで、突起のある箇所の
み研磨レベルを上げ、全体の平滑度を高めるものであ
る。また、ガラス基板1は板厚が様々で、研磨して平滑
化する材料も異なる場合等、突き上げヘッド15の突き
上げ量はパルスモータ13とネジ機構14で任意に制御
でき、最適な研磨量を設定できるものである。
On the other hand, as shown in FIG. 2, when the push-up head 15 pushes up the glass substrate 1 from below the flexible stage 9, the glass substrate 1 is locally projected, and the polishing pressure is increased accordingly, and the amount of the abrasive 8 is increased. Increase. That is, when there are projections or uneven coating in the glass substrate 1, the position is specified by an XY coordinate using an inspection machine or the like, the thrust head 15 is aligned with the position, and the glass substrate 1 is thrust locally from below. In the polishing head 3 for polishing the entire surface, the pressing force is increased only at the coordinate position, the polishing level is increased only at the surface of the glass substrate 1 at the coordinate position, and the overall smoothness is improved. Further, since the push-up means 10 can select an arbitrary position with respect to the XY coordinates,
For example, when there are a plurality of protrusions,
By aligning the push-up means 10 at the same position as the Y coordinate position and pushing up the push-up head 15, the polishing level is increased only at the portion where the protrusion is present, and the overall smoothness is increased. Further, when the glass substrate 1 has various thicknesses and different materials to be polished and smoothed, for example, the pushing-up amount of the pushing-up head 15 can be arbitrarily controlled by the pulse motor 13 and the screw mechanism 14, and an optimal polishing amount is set. You can do it.

【0011】[0011]

【発明の効果】以上のように本発明のガラス基板平滑化
装置によれば、あらかじめガラス基板の研磨すべきサイ
ズや突起等、部分的に強く研磨したい場所等の座標位置
を特定し、それに合わせて、突き上げ手段とポリッシン
グヘッドの研磨手段を制御し、かつ突き上げヘッドの突
き上げ量はパルスモータとネジ機構で任意に制御でき、
最適な研磨量で効率よく研磨でき、ガラス基板の平滑度
を高める効果がある。
As described above, according to the glass substrate smoothing apparatus of the present invention, the coordinate position of the place where the glass substrate is to be polished, such as the size or protrusion to be polished, is specified in advance, and the coordinate position is adjusted. The pushing means and the polishing means of the polishing head are controlled, and the pushing amount of the pushing head can be arbitrarily controlled by a pulse motor and a screw mechanism.
Polishing can be performed efficiently with an optimum polishing amount, and the effect of increasing the smoothness of the glass substrate is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のガラス基板平滑化装置の一実施例を示
す構成図
FIG. 1 is a configuration diagram showing one embodiment of a glass substrate smoothing device of the present invention.

【図2】同実施例の研磨部分の拡大側面図FIG. 2 is an enlarged side view of a polished portion of the embodiment.

【符号の説明】[Explanation of symbols]

1 ガラス基板 2 研磨手段 3 ポリッシングヘッド 4,11,13 パルスモータ 5,12 LMガイド 7 空気圧シリンダ 8 研磨剤 9 可撓ステージ 10 突き上げ手段 15 突き上げヘッド DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Polishing means 3 Polishing head 4,11,13 Pulse motor 5,12 LM guide 7 Pneumatic cylinder 8 Abrasive 9 Flexible stage 10 Thrusting means 15 Thrusting head

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 研磨するガラス基板を支持する可撓ステ
ージと、前記可撓ステージの下方から可撓ステージを局
部的に突き上げてガラス基板の研磨すべき部分を突き上
げる突き上げ手段と、前記突き上げ手段によって前記可
撓ステージを介して押し上げられるガラス基板の研磨す
べき部分を研磨する研磨手段とを具備したことを特徴と
するガラス基板平滑化装置。
1. A flexible stage for supporting a glass substrate to be polished, push-up means for locally pushing up the flexible stage from below the flexible stage to push up a portion of the glass substrate to be polished, and A polishing means for polishing a portion of the glass substrate to be polished which is pushed up through the flexible stage.
【請求項2】 研磨手段は、可撓性を有していてガラス
基板面を押圧しながら回転するポリッシングヘッドと、
研磨部分に研磨剤を供給する供給部を有することを特徴
とする請求項1記載のガラス基板平滑化装置。
2. A polishing head, comprising: a polishing head having flexibility and rotating while pressing a glass substrate surface;
2. The glass substrate smoothing device according to claim 1, further comprising a supply unit for supplying an abrasive to the polishing portion.
【請求項3】 研磨手段と突き上げ手段とはXY座標を
選択し相対向して位置することができるようにしたこと
を特徴とする請求項1または2記載のガラス基板平滑化
装置。
3. The glass substrate smoothing apparatus according to claim 1, wherein the polishing means and the push-up means can select XY coordinates and can be located opposite to each other.
【請求項4】 研磨手段のポリッシングヘッドの押圧回
転動作と突き上げ手段の突き上げヘッドの突き上げ動作
とを同期するようにしたことを特徴とする請求項1ない
し3のいずれかに記載するガラス基板平滑化装置。
4. The glass substrate smoothing device according to claim 1, wherein the pressing and rotating operation of the polishing head of the polishing means and the pushing-up operation of the pushing-up head of the pushing-up means are synchronized. apparatus.
JP6553297A 1997-03-03 1997-03-03 Glass substrate smoothing apparatus and substrate manufacturing method Expired - Fee Related JP3726405B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6553297A JP3726405B2 (en) 1997-03-03 1997-03-03 Glass substrate smoothing apparatus and substrate manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6553297A JP3726405B2 (en) 1997-03-03 1997-03-03 Glass substrate smoothing apparatus and substrate manufacturing method

Publications (2)

Publication Number Publication Date
JPH10244455A true JPH10244455A (en) 1998-09-14
JP3726405B2 JP3726405B2 (en) 2005-12-14

Family

ID=13289727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6553297A Expired - Fee Related JP3726405B2 (en) 1997-03-03 1997-03-03 Glass substrate smoothing apparatus and substrate manufacturing method

Country Status (1)

Country Link
JP (1) JP3726405B2 (en)

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KR100581757B1 (en) 2004-08-19 2006-05-22 주식회사 신안에스엔피 Polishing Apparatus and Polishing System for Glass
JP2008522839A (en) * 2004-12-06 2008-07-03 ヴェトロックス・アーゲー Equipment for polishing hard surfaces, especially glass surfaces
KR101281939B1 (en) * 2004-12-06 2013-07-05 베트록스 아게 Device for polishing hard surface, especially glass surfaces
JP2011083888A (en) * 2009-09-17 2011-04-28 Asahi Glass Co Ltd Glass plate local polishing apparatus and method, and glass product manufacturing apparatus and method
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CN112372412A (en) * 2020-09-29 2021-02-19 冯蕾 Intelligent manufacturing device for cleaning scratches on glass surface

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