JPS6347158B2 - - Google Patents
Info
- Publication number
- JPS6347158B2 JPS6347158B2 JP56137931A JP13793181A JPS6347158B2 JP S6347158 B2 JPS6347158 B2 JP S6347158B2 JP 56137931 A JP56137931 A JP 56137931A JP 13793181 A JP13793181 A JP 13793181A JP S6347158 B2 JPS6347158 B2 JP S6347158B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- hole
- copper foil
- layer
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- 239000010949 copper Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000005553 drilling Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000000945 filler Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13793181A JPS5839099A (ja) | 1981-08-31 | 1981-08-31 | 多層印刷回路基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13793181A JPS5839099A (ja) | 1981-08-31 | 1981-08-31 | 多層印刷回路基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5839099A JPS5839099A (ja) | 1983-03-07 |
JPS6347158B2 true JPS6347158B2 (US07922777-20110412-C00004.png) | 1988-09-20 |
Family
ID=15210029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13793181A Granted JPS5839099A (ja) | 1981-08-31 | 1981-08-31 | 多層印刷回路基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5839099A (US07922777-20110412-C00004.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6247197A (ja) * | 1985-08-26 | 1987-02-28 | 日立コンデンサ株式会社 | 多層配線板の製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5110329A (ja) * | 1974-07-05 | 1976-01-27 | Hitachi Ltd | Teidenatsuhenatsuki |
JPS5241868A (en) * | 1975-09-29 | 1977-03-31 | Tokyo Purinto Kougiyou Kk | Method of producing multiilayer printed circuit board |
JPS5426472A (en) * | 1977-07-30 | 1979-02-28 | Matsushita Electric Works Ltd | Method of manufacturing multiilayer printed wiring board |
JPS5638038A (en) * | 1979-08-01 | 1981-04-13 | Toray Ind Inc | Photosensitive polyimide precursor |
-
1981
- 1981-08-31 JP JP13793181A patent/JPS5839099A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5110329A (ja) * | 1974-07-05 | 1976-01-27 | Hitachi Ltd | Teidenatsuhenatsuki |
JPS5241868A (en) * | 1975-09-29 | 1977-03-31 | Tokyo Purinto Kougiyou Kk | Method of producing multiilayer printed circuit board |
JPS5426472A (en) * | 1977-07-30 | 1979-02-28 | Matsushita Electric Works Ltd | Method of manufacturing multiilayer printed wiring board |
JPS5638038A (en) * | 1979-08-01 | 1981-04-13 | Toray Ind Inc | Photosensitive polyimide precursor |
Also Published As
Publication number | Publication date |
---|---|
JPS5839099A (ja) | 1983-03-07 |
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