JPS634714B2 - - Google Patents

Info

Publication number
JPS634714B2
JPS634714B2 JP55187283A JP18728380A JPS634714B2 JP S634714 B2 JPS634714 B2 JP S634714B2 JP 55187283 A JP55187283 A JP 55187283A JP 18728380 A JP18728380 A JP 18728380A JP S634714 B2 JPS634714 B2 JP S634714B2
Authority
JP
Japan
Prior art keywords
sealing cap
semiconductor chip
package
concave portion
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55187283A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57112055A (en
Inventor
Tetsushi Wakabayashi
Kyoshi Muratake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55187283A priority Critical patent/JPS57112055A/ja
Publication of JPS57112055A publication Critical patent/JPS57112055A/ja
Publication of JPS634714B2 publication Critical patent/JPS634714B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/22—
    • H10W90/734—
    • H10W90/756—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55187283A 1980-12-29 1980-12-29 Integrated circuit package Granted JPS57112055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55187283A JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55187283A JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Publications (2)

Publication Number Publication Date
JPS57112055A JPS57112055A (en) 1982-07-12
JPS634714B2 true JPS634714B2 (enExample) 1988-01-30

Family

ID=16203279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55187283A Granted JPS57112055A (en) 1980-12-29 1980-12-29 Integrated circuit package

Country Status (1)

Country Link
JP (1) JPS57112055A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62114253A (ja) * 1985-11-13 1987-05-26 Nec Corp 集積回路の放熱構造
US4924353A (en) * 1985-12-20 1990-05-08 Hughes Aircraft Company Connector system for coupling to an integrated circuit chip
JP2599233B2 (ja) * 1991-11-18 1997-04-09 富士通株式会社 半導体装置
JPH08124633A (ja) * 1994-10-24 1996-05-17 Nec Corp コネクタ
US5909056A (en) * 1997-06-03 1999-06-01 Lsi Logic Corporation High performance heat spreader for flip chip packages
JP2004140289A (ja) * 2002-10-21 2004-05-13 Funai Electric Co Ltd 電子部品の放熱構造およびこれを備えたディスクドライブ装置
JP5309732B2 (ja) * 2008-07-02 2013-10-09 日本精工株式会社 電動パワーステアリング装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531494B2 (enExample) * 1971-09-13 1980-08-19

Also Published As

Publication number Publication date
JPS57112055A (en) 1982-07-12

Similar Documents

Publication Publication Date Title
US4827376A (en) Heat dissipating interconnect tape for use in tape automated bonding
KR100723454B1 (ko) 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
US5528456A (en) Package with improved heat transfer structure for semiconductor device
US6404049B1 (en) Semiconductor device, manufacturing method thereof and mounting board
US6429513B1 (en) Active heat sink for cooling a semiconductor chip
US5598031A (en) Electrically and thermally enhanced package using a separate silicon substrate
KR100342589B1 (ko) 반도체 전력 모듈 및 그 제조 방법
JP3084230B2 (ja) ボール・グリッド・アレイ・パッケージ
US5521429A (en) Surface-mount flat package semiconductor device
US6650006B2 (en) Semiconductor package with stacked chips
US20050056918A1 (en) Power module package having improved heat dissipating capability
US7005734B2 (en) Double-sided cooling isolated packaged power semiconductor device
KR100902766B1 (ko) 절연성 세라믹 히트 싱크를 갖는 디스크리트 패키지
KR20080064771A (ko) 열방출 능력이 개선된 전력용 모듈 패키지 및 그 제조 방법
JPH05304247A (ja) 樹脂封止型半導体装置
JPS634714B2 (enExample)
JPH0422162A (ja) リードフレームおよびそれを用いた半導体集積回路装置
CA2017080C (en) Semiconductor device package structure
JPH06104355A (ja) 冷却液封入型半導体装置
CA2070743A1 (en) Semiconductor chip module and method for manufacturing the same
JPS62281453A (ja) チツプキヤリアモジユ−ル
JPH0797616B2 (ja) 半導体装置の製造方法
KR200161904Y1 (ko) 방열판 반도체 패키지
JPH04348061A (ja) 半導体装置用パッケージ
JPS61150251A (ja) 半導体装置