JPS6339968Y2 - - Google Patents
Info
- Publication number
- JPS6339968Y2 JPS6339968Y2 JP6587282U JP6587282U JPS6339968Y2 JP S6339968 Y2 JPS6339968 Y2 JP S6339968Y2 JP 6587282 U JP6587282 U JP 6587282U JP 6587282 U JP6587282 U JP 6587282U JP S6339968 Y2 JPS6339968 Y2 JP S6339968Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- silver
- semiconductor device
- semiconductor
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 28
- 229910052709 silver Inorganic materials 0.000 claims description 19
- 239000004332 silver Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 238000007747 plating Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003378 silver Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6587282U JPS58168134U (ja) | 1982-05-06 | 1982-05-06 | 加圧接触型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6587282U JPS58168134U (ja) | 1982-05-06 | 1982-05-06 | 加圧接触型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58168134U JPS58168134U (ja) | 1983-11-09 |
| JPS6339968Y2 true JPS6339968Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-10-19 |
Family
ID=30075796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6587282U Granted JPS58168134U (ja) | 1982-05-06 | 1982-05-06 | 加圧接触型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58168134U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1982
- 1982-05-06 JP JP6587282U patent/JPS58168134U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58168134U (ja) | 1983-11-09 |