JPS6339967U - - Google Patents

Info

Publication number
JPS6339967U
JPS6339967U JP13408986U JP13408986U JPS6339967U JP S6339967 U JPS6339967 U JP S6339967U JP 13408986 U JP13408986 U JP 13408986U JP 13408986 U JP13408986 U JP 13408986U JP S6339967 U JPS6339967 U JP S6339967U
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser element
electrically
package
mounted electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13408986U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13408986U priority Critical patent/JPS6339967U/ja
Publication of JPS6339967U publication Critical patent/JPS6339967U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Description

【図面の簡単な説明】
第1図は本考案の半導体レーザ装置の一実施例
を示す概略構成図、第2図は他の実施例を示す概
略構成図、第3図a,bは配線図、第4図は従来
の半導体レーザ装置の概略構成図である。 1……ステム、2……半導体レーザ素子、3…
…フオトダイオード素子、4……コンデンサ、5
……フエライトビーズ、7……チツプインダクタ
ンス素子。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体レーザ素子が実装されたパツケージ内に
    、前記半導体レーザ素子と電気的に並列にキヤパ
    シタンス素子が実装されるとともに、前記半導体
    レーザ素子と電気的に直列にインダクタンス素子
    が実装されたことを特徴とする半導体レーザ装置
JP13408986U 1986-09-01 1986-09-01 Pending JPS6339967U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13408986U JPS6339967U (ja) 1986-09-01 1986-09-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13408986U JPS6339967U (ja) 1986-09-01 1986-09-01

Publications (1)

Publication Number Publication Date
JPS6339967U true JPS6339967U (ja) 1988-03-15

Family

ID=31035005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13408986U Pending JPS6339967U (ja) 1986-09-01 1986-09-01

Country Status (1)

Country Link
JP (1) JPS6339967U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064484A (ja) * 2003-07-28 2005-03-10 Sumitomo Electric Ind Ltd 発光モジュール

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038894A (ja) * 1983-08-11 1985-02-28 Nec Corp レ−ザダイオ−ド

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6038894A (ja) * 1983-08-11 1985-02-28 Nec Corp レ−ザダイオ−ド

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064484A (ja) * 2003-07-28 2005-03-10 Sumitomo Electric Ind Ltd 発光モジュール

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