JPS6339850U - - Google Patents

Info

Publication number
JPS6339850U
JPS6339850U JP1986132060U JP13206086U JPS6339850U JP S6339850 U JPS6339850 U JP S6339850U JP 1986132060 U JP1986132060 U JP 1986132060U JP 13206086 U JP13206086 U JP 13206086U JP S6339850 U JPS6339850 U JP S6339850U
Authority
JP
Japan
Prior art keywords
diode
laminated
protective
breakdown voltage
semiconductor chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986132060U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0524105Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986132060U priority Critical patent/JPH0524105Y2/ja
Publication of JPS6339850U publication Critical patent/JPS6339850U/ja
Application granted granted Critical
Publication of JPH0524105Y2 publication Critical patent/JPH0524105Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Rectifiers (AREA)
JP1986132060U 1986-08-30 1986-08-30 Expired - Lifetime JPH0524105Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986132060U JPH0524105Y2 (enExample) 1986-08-30 1986-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986132060U JPH0524105Y2 (enExample) 1986-08-30 1986-08-30

Publications (2)

Publication Number Publication Date
JPS6339850U true JPS6339850U (enExample) 1988-03-15
JPH0524105Y2 JPH0524105Y2 (enExample) 1993-06-18

Family

ID=31031098

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986132060U Expired - Lifetime JPH0524105Y2 (enExample) 1986-08-30 1986-08-30

Country Status (1)

Country Link
JP (1) JPH0524105Y2 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145557A (ja) * 1983-02-09 1984-08-21 Hitachi Ltd 半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59145557A (ja) * 1983-02-09 1984-08-21 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPH0524105Y2 (enExample) 1993-06-18

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