JPS6337185B2 - - Google Patents
Info
- Publication number
- JPS6337185B2 JPS6337185B2 JP58082686A JP8268683A JPS6337185B2 JP S6337185 B2 JPS6337185 B2 JP S6337185B2 JP 58082686 A JP58082686 A JP 58082686A JP 8268683 A JP8268683 A JP 8268683A JP S6337185 B2 JPS6337185 B2 JP S6337185B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vacuum
- substrate holder
- plate
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 106
- 238000004544 sputter deposition Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 2
- 239000007789 gas Substances 0.000 description 10
- 210000000078 claw Anatomy 0.000 description 9
- 239000010409 thin film Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8268683A JPS59208067A (ja) | 1983-05-13 | 1983-05-13 | 連続スパッタ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8268683A JPS59208067A (ja) | 1983-05-13 | 1983-05-13 | 連続スパッタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59208067A JPS59208067A (ja) | 1984-11-26 |
JPS6337185B2 true JPS6337185B2 (de) | 1988-07-25 |
Family
ID=13781299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8268683A Granted JPS59208067A (ja) | 1983-05-13 | 1983-05-13 | 連続スパッタ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59208067A (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6425600A (en) * | 1987-07-22 | 1989-01-27 | Matsushita Electric Ind Co Ltd | Shielding device |
JPH01169919A (ja) * | 1987-12-25 | 1989-07-05 | Hitachi Ltd | 成膜装置 |
JPH0341844U (de) * | 1989-09-04 | 1991-04-22 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5399081A (en) * | 1977-02-10 | 1978-08-30 | Mitsubishi Electric Corp | Sputtering apparatus |
-
1983
- 1983-05-13 JP JP8268683A patent/JPS59208067A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5399081A (en) * | 1977-02-10 | 1978-08-30 | Mitsubishi Electric Corp | Sputtering apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS59208067A (ja) | 1984-11-26 |
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