JPS6335104B2 - - Google Patents
Info
- Publication number
- JPS6335104B2 JPS6335104B2 JP13715183A JP13715183A JPS6335104B2 JP S6335104 B2 JPS6335104 B2 JP S6335104B2 JP 13715183 A JP13715183 A JP 13715183A JP 13715183 A JP13715183 A JP 13715183A JP S6335104 B2 JPS6335104 B2 JP S6335104B2
- Authority
- JP
- Japan
- Prior art keywords
- flat hollow
- ring
- plates
- hollow bodies
- hollow body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 28
- 238000001816 cooling Methods 0.000 claims description 26
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 239000003507 refrigerant Substances 0.000 description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 20
- 229910052782 aluminium Inorganic materials 0.000 description 14
- 238000005219 brazing Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 11
- 230000005855 radiation Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13715183A JPS6028253A (ja) | 1983-07-27 | 1983-07-27 | 半導体素子冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13715183A JPS6028253A (ja) | 1983-07-27 | 1983-07-27 | 半導体素子冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6028253A JPS6028253A (ja) | 1985-02-13 |
| JPS6335104B2 true JPS6335104B2 (enrdf_load_stackoverflow) | 1988-07-13 |
Family
ID=15192007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13715183A Granted JPS6028253A (ja) | 1983-07-27 | 1983-07-27 | 半導体素子冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6028253A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013215913A1 (de) * | 2013-08-12 | 2015-02-12 | Siemens Aktiengesellschaft | Hochspannungsdiodengleichrichter |
| DE102019132955B4 (de) * | 2019-12-04 | 2022-03-31 | Hanon Systems | Wärmeübertrager mit integriertem Trockner und Platte für einen Plattenwärmeübertrager |
-
1983
- 1983-07-27 JP JP13715183A patent/JPS6028253A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6028253A (ja) | 1985-02-13 |
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