CN111818756A - 带有集成的两相散热器的热交换器 - Google Patents

带有集成的两相散热器的热交换器 Download PDF

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CN111818756A
CN111818756A CN202010279295.6A CN202010279295A CN111818756A CN 111818756 A CN111818756 A CN 111818756A CN 202010279295 A CN202010279295 A CN 202010279295A CN 111818756 A CN111818756 A CN 111818756A
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heat exchanger
evaporator
substrate
heat
condenser
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CN111818756B (zh
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M.博尔托拉托
B.阿戈斯蒂尼
D.托雷辛
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ABB Schweiz AG
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936Liquid coolant with phase change
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract

本发明涉及一种带有集成的两相散热器的热交换器。热交换器(100)包括基板(104),其具有第一侧(110)和与第一侧(110)相对的第二侧(112),其中,第一侧(110)构造用于被连结至热虹吸管(102),并且其中,基板(104)包括两相散热结构(106)。

Description

带有集成的两相散热器的热交换器
技术领域
本发明涉及一种热交换器,其包括带有两相散热结构的基板。
背景技术
在功率电子设备中,被动热交换器很常见。热交换器通常包括闭合结构,例如通道,其被抽空并且部分填充有冷却流体。来自热源(例如安装在基板上的电子功率装置)的热能被基板接收,基板与热交换器相接触。热交换器包括蒸发区,在此处冷却剂被蒸发,并且热能通过蒸汽被运送至该结构的较冷部分,在此处冷却剂一方面冷凝且回流并且在此处另一方面热能散发。存在不同类型的热交换器。
热虹吸管和基于脉动热管(pulsating heat pipe)的热交换器是简单且可靠的解决方案,在采取水冷却之前,其将空气作为冷却介质应用到功率电子设备中。尽管与翅片式热沉相比有显著改进,但是当增加装置的总功率和热损失时,基板上的散热变成限制性因素。在标称热负荷下,基板上的最大温度差可达10-15K。热源的面积与基板面积相比越小,该温差越高。在某个点,当功率增加到超过标称条件时,达到临界热通量。在热交换器的工作极限下,由于开始干涸(dry-out),最大基板温差可上升最多至40K。这表明临界条件仅在蒸发器的对应于基板上热源的位置的区域中建立。改善基板上的散热将导致更高效地利用热虹吸管或脉动热管工作原理。
发明内容
因此,需要更高效的热交换器以提供成本有效的解决方案。
该问题由独立权利要求的主题来解决。实施例由从属权利要求、接下来的说明和附图来提供。
所描述的实施例类似地涉及热交换器和用于生产热交换器的方法。协同效应可由实施例的不同组合产生,尽管它们可能未被详细描述。
技术术语通过它们的通用含义来使用。如果特定的含义被赋予某些术语,术语的定义将在使用这些术语的下文中给出。
根据第一方面,提供一种热交换器,其包括基板,基板具有第一侧和与第一侧相对的第二侧。第一侧构造用于被连结至热虹吸管,也就是说,热虹吸管可被连结至第一侧。第二侧构造用于安装电子部件并且基板包括两相散热结构。也就是说,一个或多个部件可安装在第二侧上。因此,基板从热源吸收热并且热虹吸管(其在该情况中是基部对空气(base-to-air)热虹吸管)附连至基板。基部对空气热虹吸管以通常的方式填充有冷却流体,其在本公开中被称为“初级流体”。术语热虹吸管、还有脉动热管或其他类型的热管可广义地来理解。热虹吸管和脉动热管基于无芯热管。热虹吸管与脉动热管之间的主要区别在于,脉动热管如果无重力辅助(例如当水平定向时)也工作。类似于热虹吸管,基板的结构允许以冷却流体填充基板的内部,使得该结构在使用时包括代表第一相的液体次级流体和代表第二相的蒸发的次级流体。由于两相结构,热量几乎均匀地散布在基板的第一侧,导致由热虹吸管有效地散热并且避免在基板的第一侧和第二侧上在热源处过高的温度。
根据一实施例,热交换器还包括热虹吸管。
根据一实施例,基板还包括:侧间隔条(side spacing bar)和金属盖,以获得至少一个腔;以及在腔内的支撑元件。金属盖形成基板的第二侧。其可包括用于功率装置的机械连接的孔。腔和支撑元件可形成室或通道,如在接下来的实施例中所述。
根据一实施例,基板被机械加工成实现至少一个容积;并且其中,盖是平的并且与机械加工的容积相连结。
根据一实施例,两相散热结构是蒸汽室,其包括蒸发器和冷凝器,其中,蒸发器邻近意图用于安装电气部件的区域,而冷凝器邻近不意图用于安装电子部件的区域。
根据一实施例,该至少一个冷凝器和至少一个蒸发器由搅拌摩擦焊接产生的毛细通道来形成。
蒸汽室是一种平面热管,其可在两个维度上散热并且适合用于被施加至相对小的蒸发器面积的高功率和热通量。蒸发的流体散布整个室,形成等温散热器并且在冷凝器的表面上冷凝。因此,热量均匀地分布在与冷凝器接触的内基板表面上并且因此也以与热虹吸管(其散发热量)接触的外基板表面。为了确保液相的适当循环,蒸汽室设置有芯结构。
在蒸发器(也就是说蒸汽室的部分,在此处流体在蒸汽室内蒸发)处,芯结构可使用不同的结构或材料来形成。与次级流体接触的盖的内表面可包括附加的芯结构以增强在密封的容器内的两相传热机制。
根据一实施例,蒸汽室的蒸发器包括置入基板中的多孔蒸发器芯、网芯(meshwick)、凹槽或这些的组合。芯结构例如可通过由金属粉末烧结或通过金属添加式制造例如3D打印来实现,在基板的腔中和在金属盖的内表面上。金属盖的内表面可以是多孔的并且在组装之后与腔中的金属添加物有一些接触点。
液相从冷凝器至蒸发器的流也可通过插入偏置条翅片(offset strip fin)或穿孔翅片来实现。在多孔的、带凹槽的或成网的蒸发器之间的选择取决于倾斜角度和热通量。
根据一实施例,两相散热结构是脉动热管,其包括至少一个蒸发器区域和至少一个冷凝器区域,其中,冷凝器邻近不意图用于安装电子部件的区域。
根据一实施例,该至少一个冷凝器区域和该至少一个蒸发器区域由搅拌摩擦焊接产生的毛细通道来形成。例如,如果基板材料是铝,搅拌摩擦焊过程是用于在基板中产生通道的经济且高效的方法。
根据一实施例,该至少一个冷凝器区域和该至少一个蒸发器区域被机械加工形成并且包括封闭盖。这些部分可根据其最终组成来布置并且在一次(one-shot)炉钎焊过程中联结在一起。
根据一实施例,该至少一个冷凝器区域和该至少一个蒸发器区域由多端口挤压管(其在其端部处连接)形成。多端口挤压管由挤压的矩形扁管组成,沿着管的长度带有多个小通道。其具有大的内表面面积,使得其实现高效的热传递并且因此热量在基板中高效地扩散。
根据一实施例,散热结构是毛细环路热管,其包括毛细蒸发器,毛细蒸发器置入基板中,其中,毛细蒸发器位于用于热源的该至少一个位置下面并且该至少一个冷凝器通道远离用于热源的该至少一个位置。毛细环路热管在蒸发器中产生的蒸汽在环路的一部分中流至冷凝器通道并且在冷凝通道中冷凝的液体在环路的另一部分中流回至蒸发器,从而在基板中获得有效的散热。举例来说,毛细环路热管可由在其端部处适当地连接的多端口挤压管制成。
根据第二方面,一种制造如上所述的包括基板和热虹吸管的热交换器的方法。
例如,该方法为基板中的工作流体提供至少一个蒸发器区域和至少一个冷凝区域。此外,设置侧面间隔条以获得至少一个腔和在腔中设置支撑元件。该至少一个蒸发器区域和至少一个冷凝区域根据脉动热管构造来布置。蒸发器区域和该至少一个冷凝区域例如使用搅拌摩擦焊接过程来形成。备选地,蒸发器区域和该至少一个冷凝区域可利用机械加工来形成并且该方法还可包括:提供封闭盖用于封闭蒸发器区域和该至少一个冷凝区域。作为另一备选方案,蒸发器区域和至少一个冷凝区域利用多端口挤压管来形成。热交换器的所有部分可在执行一次钎焊过程中相联结。根据一示例,该方法还包括:
将工作流体充入蒸发器区域和该至少一个冷凝区域中。该方法的其他特征可从参照上述热交换器的实施例得悉。
参考附图和接下来的说明,本发明的这些和其他特征、方面和优点将变得更好理解。
附图说明
图1根据一实施例示出了热交换器的结构图,
图2根据一实施例示出了在热交换器的基板中的蒸汽室的结构图。
图3根据一实施例示出了带有偏置条翅片和支撑元件的基板的第一结构。
图4根据一实施例示出了铝泡沫夹层结构。
图5根据一实施例示出了基板的多端口挤压管结构。
图6根据一实施例示出了基板的带有曲折通道的结构。
具体实施方式
图1根据一实施例示出了热交换器100,其带有基板104、热虹吸管102和两相散热结构106。热量由电子装置108来产生并且被传递至两相散热结构106,其使热量在装置108在基板104的第二侧112处被安装的点周围均匀地散发至基板104的第一侧110(热虹吸管102布置在其处)。
因此,基板104不是实心板,而是具有形成2D散热结构的集成的密封的容器。散热结构填充有次级冷却流体。与基部对空气热虹吸管类似,基板中的次级冷却流体采用两相,即气相和液相。次级流体在功率装置所安装的区域中的表面的内侧上蒸发,而其在与初级流体管接触的表面的内侧上冷凝。这引起在初级流体管上均匀的温度分布并且允许整个初级流体区域有效地参与排热。因此,热阻显著降低。
用于冷却电子装置的基于环路热虹吸管或脉动热管的热交换器包括用于与金属块(metallic bulk)基板热接触的初级工作流体的至少一个管。该至少一个管与基板接触的部分充当流体的蒸发器。在基板的外表面上安装电子装置。当在给定的热通量下在对应于电气装置位置的蒸发器部分中达到临界条件、而蒸发器的周围区域更冷时,出现工作极限。这是由于金属基板中传导性传热的限制。
具有较高功率的电气装置可安装在相同的基板上,在该基板上集成有在两相饱和条件下包含次级工作流体的密封的容器。对于相同几何形状的热交换器,该结构允许在整个蒸发器上更均匀的热扩散,导致更低的热阻和更高的排热效率。
因此,所提出的基板被机械加工成实现至少一容积用于次级流体。一些附加元件被插入该容积中,诸如:
允许和增强次级两相流体的蒸汽和液相的被动循环的结构;支撑元件,其也可使能够通过适当的机械连接(例如内螺纹联接)安装功率装置。
平的盖与机械加工的容积相连结以形成所提及的密封的容器。盖可包括用于功率装置的机械连接的孔。与次级流体接触的盖的内表面可包括附加结构(例如凹槽或其他芯结构)以增强在密封的容器内两相传热机制。该容器被设计成包括至少一个装填管,需要其以引入次级流体。为了维持良好的性能,集成在基板中的两相散热器的设计可灵活地适应于热交换器的定向。所提出的解决方案设想成采用成本有效的制造过程,在其中热交换器的所有部分最终在一次钎焊过程中相联结。这确保出色的热接触。
所构思的解决方案是2D散热器,其基于两相传热机制并且通过高效且灵活的过程来制造。
图2示出了集成在基板104中的蒸汽室200。蒸汽室可包括芯202,其在底侧在蒸发器上而在顶侧在冷凝器上延伸。冷凝的流体通过芯202被抽回至蒸发器,而蒸汽在空的空间中流动。
图3-图6示出了两相散热结构106的示例。在图3中所示的第一示例中,基板302、306被机械加工或设置有侧间隔条308以获得至少一个腔,支撑元件310和增强的表面几何结构304位于其处。这些几何结构304可以是偏置条翅片或穿孔翅片。翅片304具有用于布置支撑元件304的孔310。
整个热交换器100可利用板和条制造技术来获得。在一次钎焊之后,充填初级和次级流体。考虑次级流体,蒸汽流发生在空的空间中,而液体流沿着翅片的框架流动。优选地,蒸发器和冷凝器设置有芯结构以有利于液体流。
在其他示例中,备选地可利用以下来替换翅片304:
利用如在图4中所示的铝泡沫夹层结构302、403、404、306,优选地,利用一些用于蒸汽流的空的空间或者利用一个或多个在一侧上设置有铝板403的铝泡沫结构404。在后一情况中,在组装之后,泡沫结构404具有一些接触点,使得液体流路径被限定并且自由容积可用于蒸汽流动。
在另一示例中,翅片404以一结构来代替,该结构在基板302、306的腔中和在金属盖302的内表面中都通过金属添加制造来实现。优选地,后一结构是多孔的并且这两个结构在组装之后具有一些接触点;
在又一示例中,如在图5中所示,利用由平行的小通道或若干层平行通道制成的结构504来代替翅片。各层可由若干多端口挤压管组成。所有通道的端部连接在一歧管中。
在另一示例中,用于次级流体的容积是设计成开环或闭环构造的带有毛细管尺寸的曲折的通道604,如在图6中所示。该通道可通过在基板104上使用端铣或焊接搅拌摩擦技术来获得。在该情况中,所置入的两相散热器作为脉动热管工作,并且冷凝发生在基板104的周围部分中。
从对附图、该公开和所附权利要求的研究中,本领域技术人员在实践所要求保护的发明时可理解和施行所公开的实施例的其他变型。在权利要求中,词语“包括”不排除其他元件或步骤并且不定冠词“一”不排除复数。单独的处理器或其他单元可实现权利要求中所述的若干项目或步骤的功能。在相互不同的从属权利要求中所引用的特定措施的事实并不表示这些措施的组合不能被有利地使用。权利要求中的任何附图标记不应被解释为限制权利要求的范围。

Claims (13)

1.一种热交换器(100),其包括基板(104),所述基板(104)具有第一侧(110)和与所述第一侧(110)相对的第二侧(112),其中,
所述第一侧(110)连结至热虹吸管(102),
所述第二侧(112)安装一个或多个电子部件;并且其中,
所述基板(104)包括两相散热结构(106)。
2.根据权利要求1所述的热交换器(100),其还包括热虹吸管(102)。
3. 根据权利要求1或2所述的热交换器(100),其中,所述基板(104)包括:
所述基板(104)的侧间隔条(308)和金属盖(302),以获得至少一个腔;和
在所述腔内的支撑元件(304);并且其中
所述金属盖(302)形成所述基板(104)的第二侧(112)。
4.根据前述权利要求中任一项所述的热交换器(100),其中,所述基板(104)被机械加工成实现至少一个容积;并且其中,所述盖是平的并且与机械加工的所述容积相连结。
5.根据前述权利要求中任一项所述的热交换器(100),
其中,所述两相散热结构(106)是蒸汽室(200),其包括蒸发器和冷凝器,其中,所述蒸发器邻近意图用于安装电气部件的区域,而所述冷凝器邻近不意图用于安装电子部件的区域。
6.根据权利要求5所述的热交换器(100),其中,至少一个所述冷凝器和至少一个蒸发器由搅拌摩擦焊接产生的毛细通道来形成。
7.根据前述权利要求中任一项所述的热交换器(100),其中,所述基板(104)包括置入所述基板(104)中的多孔蒸发器、网式蒸发器、凹槽或它们的组合。
8.根据前述权利要求中任一项所述的热交换器(100),其中,所述两相散热结构(106)是脉动热管,其包括至少一个蒸发器和至少一个冷凝器,其中,至少一个所述冷凝器邻近不意图用于安装电子部件的区域。
9.根据权利要求5至8中任一项所述的热交换器(100),其中,至少一个冷凝器和至少一个蒸发器由搅拌摩擦焊接产生的毛细通道来形成。
10.根据权利要求5至9中任一项所述的热交换器(100),其中,至少一个冷凝器和至少一个蒸发器是机器加工产生的并且包括封闭盖(302)。
11.根据权利要求5至10中任一项所述的热交换器(100),其中,至少一个冷凝器和至少一个蒸发器由多端口挤压管(504)来形成,所述多端口挤压管在其端部处连接。
12.根据前述权利要求中任一项所述的热交换器(100),其中,所述两相散热结构(106)是毛细环路热管,其包括毛细蒸发器,所述毛细蒸发器置入所述基板(104)中,其中,所述毛细蒸发器邻近意图用于安装电子部件的区域。
13.一种生产根据权利要求1至12中任一项所述的热交换器的方法。
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