JPS6334277Y2 - - Google Patents
Info
- Publication number
- JPS6334277Y2 JPS6334277Y2 JP1983113008U JP11300883U JPS6334277Y2 JP S6334277 Y2 JPS6334277 Y2 JP S6334277Y2 JP 1983113008 U JP1983113008 U JP 1983113008U JP 11300883 U JP11300883 U JP 11300883U JP S6334277 Y2 JPS6334277 Y2 JP S6334277Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive resin
- cap
- wiring conductor
- thick film
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 15
- 239000004840 adhesive resin Substances 0.000 claims description 12
- 229920006223 adhesive resin Polymers 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000005357 flat glass Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300883U JPS6020146U (ja) | 1983-07-20 | 1983-07-20 | 混成集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11300883U JPS6020146U (ja) | 1983-07-20 | 1983-07-20 | 混成集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6020146U JPS6020146U (ja) | 1985-02-12 |
| JPS6334277Y2 true JPS6334277Y2 (US06826419-20041130-M00005.png) | 1988-09-12 |
Family
ID=30261764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11300883U Granted JPS6020146U (ja) | 1983-07-20 | 1983-07-20 | 混成集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020146U (US06826419-20041130-M00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6191787B2 (ja) | 2015-01-08 | 2017-09-06 | 株式会社村田製作所 | 圧電振動部品の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122870A (en) * | 1978-03-17 | 1979-09-22 | Tokyo Shibaura Electric Co | Thick film circuit board |
| JPS5735354A (en) * | 1980-08-13 | 1982-02-25 | Fujitsu Ltd | Sealing method for semiconductor housing container |
-
1983
- 1983-07-20 JP JP11300883U patent/JPS6020146U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122870A (en) * | 1978-03-17 | 1979-09-22 | Tokyo Shibaura Electric Co | Thick film circuit board |
| JPS5735354A (en) * | 1980-08-13 | 1982-02-25 | Fujitsu Ltd | Sealing method for semiconductor housing container |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6020146U (ja) | 1985-02-12 |
