JPS6334273Y2 - - Google Patents
Info
- Publication number
- JPS6334273Y2 JPS6334273Y2 JP1983063698U JP6369883U JPS6334273Y2 JP S6334273 Y2 JPS6334273 Y2 JP S6334273Y2 JP 1983063698 U JP1983063698 U JP 1983063698U JP 6369883 U JP6369883 U JP 6369883U JP S6334273 Y2 JPS6334273 Y2 JP S6334273Y2
- Authority
- JP
- Japan
- Prior art keywords
- container
- precision pattern
- present
- glass
- packing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 18
- 239000004744 fabric Substances 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 4
- 229910001413 alkali metal ion Inorganic materials 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 12
- 238000012856 packing Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000005361 soda-lime glass Substances 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983063698U JPS59169037U (ja) | 1983-04-27 | 1983-04-27 | 容器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983063698U JPS59169037U (ja) | 1983-04-27 | 1983-04-27 | 容器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59169037U JPS59169037U (ja) | 1984-11-12 |
| JPS6334273Y2 true JPS6334273Y2 (is) | 1988-09-12 |
Family
ID=30193880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983063698U Granted JPS59169037U (ja) | 1983-04-27 | 1983-04-27 | 容器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59169037U (is) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0537480Y2 (is) * | 1987-03-05 | 1993-09-22 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3400809A (en) * | 1967-05-22 | 1968-09-10 | Product Packaging Corp | Light tight package |
| JPS5518053A (en) * | 1978-07-26 | 1980-02-07 | Mitsubishi Metal Corp | Packing of method semiconductor wafer |
| JPS5853133B2 (ja) * | 1978-03-27 | 1983-11-28 | 日本鋼管株式会社 | 鉄骨コンクリ−ト構造物における柱脚の固定基礎形成方法 |
| JPS6334273U (is) * | 1986-04-07 | 1988-03-05 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5845249Y2 (ja) * | 1975-12-12 | 1983-10-14 | コツコウセイシ カブシキガイシヤ | カンソウザイヨウホウソウザイ |
| JPS57148165U (is) * | 1981-03-14 | 1982-09-17 | ||
| JPS5853133U (ja) * | 1981-10-07 | 1983-04-11 | アルバツク成膜株式会社 | ガラス基板等の保管装置 |
-
1983
- 1983-04-27 JP JP1983063698U patent/JPS59169037U/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3400809A (en) * | 1967-05-22 | 1968-09-10 | Product Packaging Corp | Light tight package |
| JPS5853133B2 (ja) * | 1978-03-27 | 1983-11-28 | 日本鋼管株式会社 | 鉄骨コンクリ−ト構造物における柱脚の固定基礎形成方法 |
| JPS5518053A (en) * | 1978-07-26 | 1980-02-07 | Mitsubishi Metal Corp | Packing of method semiconductor wafer |
| JPS6334273U (is) * | 1986-04-07 | 1988-03-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59169037U (ja) | 1984-11-12 |
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