JPS6334019B2 - - Google Patents

Info

Publication number
JPS6334019B2
JPS6334019B2 JP15595582A JP15595582A JPS6334019B2 JP S6334019 B2 JPS6334019 B2 JP S6334019B2 JP 15595582 A JP15595582 A JP 15595582A JP 15595582 A JP15595582 A JP 15595582A JP S6334019 B2 JPS6334019 B2 JP S6334019B2
Authority
JP
Japan
Prior art keywords
paper
unsaturated polyester
resin
copper
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15595582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5945148A (ja
Inventor
Ryuzo Nakatsuka
Takeshi Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP15595582A priority Critical patent/JPS5945148A/ja
Publication of JPS5945148A publication Critical patent/JPS5945148A/ja
Publication of JPS6334019B2 publication Critical patent/JPS6334019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP15595582A 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法 Granted JPS5945148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15595582A JPS5945148A (ja) 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15595582A JPS5945148A (ja) 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS5945148A JPS5945148A (ja) 1984-03-13
JPS6334019B2 true JPS6334019B2 (https=) 1988-07-07

Family

ID=15617179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15595582A Granted JPS5945148A (ja) 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS5945148A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06503056A (ja) * 1991-04-26 1994-04-07 マクアダム，クリスティーン　エー． 装飾パネルを有する花用容器および方法
JPWO2020144861A1 (ja) * 2019-01-11 2021-11-18 昭和電工マテリアルズ株式会社 金属張り積層板の製造方法、金属張り積層板、プリント配線板及び半導体パッケージ、並びにコアレス基板形成用支持体及び半導体再配線層形成用支持体

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61227049A (ja) * 1985-04-01 1986-10-09 鐘淵化学工業株式会社 難燃性電気用積層板
JP2020070386A (ja) * 2018-11-01 2020-05-07 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06503056A (ja) * 1991-04-26 1994-04-07 マクアダム，クリスティーン　エー． 装飾パネルを有する花用容器および方法
JPWO2020144861A1 (ja) * 2019-01-11 2021-11-18 昭和電工マテリアルズ株式会社 金属張り積層板の製造方法、金属張り積層板、プリント配線板及び半導体パッケージ、並びにコアレス基板形成用支持体及び半導体再配線層形成用支持体

Also Published As

Publication number Publication date
JPS5945148A (ja) 1984-03-13

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