JPS5945148A - 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法 - Google Patents

不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Info

Publication number
JPS5945148A
JPS5945148A JP15595582A JP15595582A JPS5945148A JP S5945148 A JPS5945148 A JP S5945148A JP 15595582 A JP15595582 A JP 15595582A JP 15595582 A JP15595582 A JP 15595582A JP S5945148 A JPS5945148 A JP S5945148A
Authority
JP
Japan
Prior art keywords
resin
paper
unsaturated polyester
base material
polyester resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15595582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334019B2 (https=
Inventor
中塚　隆三
吉岡　斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP15595582A priority Critical patent/JPS5945148A/ja
Publication of JPS5945148A publication Critical patent/JPS5945148A/ja
Publication of JPS6334019B2 publication Critical patent/JPS6334019B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
JP15595582A 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法 Granted JPS5945148A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15595582A JPS5945148A (ja) 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15595582A JPS5945148A (ja) 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS5945148A true JPS5945148A (ja) 1984-03-13
JPS6334019B2 JPS6334019B2 (https=) 1988-07-07

Family

ID=15617179

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15595582A Granted JPS5945148A (ja) 1982-09-09 1982-09-09 不飽和ポリエステル樹脂−紙−銅張積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS5945148A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61227049A (ja) * 1985-04-01 1986-10-09 鐘淵化学工業株式会社 難燃性電気用積層板
JP2020070386A (ja) * 2018-11-01 2020-05-07 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5137207A (en) * 1991-04-26 1992-08-11 Mcadam Christine A Floral container with multiple decorative panels and method of forming same
CN120439623A (zh) * 2019-01-11 2025-08-08 株式会社力森诺科 覆金属层叠板的制造方法、覆金属层叠板、印刷布线板及半导体封装体、以及无芯基板形成用支承体及半导体再布线层形成用支承体

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61227049A (ja) * 1985-04-01 1986-10-09 鐘淵化学工業株式会社 難燃性電気用積層板
JP2020070386A (ja) * 2018-11-01 2020-05-07 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法
CN111148350A (zh) * 2018-11-01 2020-05-12 株式会社迪思科 芯材的制造方法和覆铜层叠板的制造方法

Also Published As

Publication number Publication date
JPS6334019B2 (https=) 1988-07-07

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