JPS6332262B2 - - Google Patents

Info

Publication number
JPS6332262B2
JPS6332262B2 JP56052048A JP5204881A JPS6332262B2 JP S6332262 B2 JPS6332262 B2 JP S6332262B2 JP 56052048 A JP56052048 A JP 56052048A JP 5204881 A JP5204881 A JP 5204881A JP S6332262 B2 JPS6332262 B2 JP S6332262B2
Authority
JP
Japan
Prior art keywords
qip
semiconductor device
type semiconductor
protective frame
cylindrical body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56052048A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57166050A (en
Inventor
Tetsuo Akisawa
Hiroshi Iwami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP56052048A priority Critical patent/JPS57166050A/ja
Priority to US06/356,767 priority patent/US4483441A/en
Priority to DE19823209756 priority patent/DE3209756A1/de
Publication of JPS57166050A publication Critical patent/JPS57166050A/ja
Publication of JPS6332262B2 publication Critical patent/JPS6332262B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP56052048A 1981-03-26 1981-04-07 Packing body for shipment of semiconductor device Granted JPS57166050A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP56052048A JPS57166050A (en) 1981-04-07 1981-04-07 Packing body for shipment of semiconductor device
US06/356,767 US4483441A (en) 1981-03-26 1982-03-10 Flat-type semiconductor device and packing thereof
DE19823209756 DE3209756A1 (de) 1981-03-26 1982-03-17 Chip- oder plattenfoermige halbleitervorrichtung und ihre verpackung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56052048A JPS57166050A (en) 1981-04-07 1981-04-07 Packing body for shipment of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57166050A JPS57166050A (en) 1982-10-13
JPS6332262B2 true JPS6332262B2 (enrdf_load_stackoverflow) 1988-06-29

Family

ID=12903927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56052048A Granted JPS57166050A (en) 1981-03-26 1981-04-07 Packing body for shipment of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57166050A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4703920A (en) * 1986-08-25 1987-11-03 Amp Incorporated Manufacturing method for integrated circuit chip carriers and work holder for use in the method
JP4811064B2 (ja) * 2006-03-15 2011-11-09 日本ゼオン株式会社 コンテナ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5380969A (en) * 1976-12-27 1978-07-17 Hitachi Ltd Manufacture of resin shield type semiconductor device and lead frame used for the said process
JPS6032747B2 (ja) * 1980-08-27 1985-07-30 株式会社クラレ 布帛の難燃処理方法

Also Published As

Publication number Publication date
JPS57166050A (en) 1982-10-13

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