JPS6332254B2 - - Google Patents

Info

Publication number
JPS6332254B2
JPS6332254B2 JP56076113A JP7611381A JPS6332254B2 JP S6332254 B2 JPS6332254 B2 JP S6332254B2 JP 56076113 A JP56076113 A JP 56076113A JP 7611381 A JP7611381 A JP 7611381A JP S6332254 B2 JPS6332254 B2 JP S6332254B2
Authority
JP
Japan
Prior art keywords
bonding
magazine
lead frame
lead frames
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56076113A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57192038A (en
Inventor
Yoshihiro Kazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP56076113A priority Critical patent/JPS57192038A/ja
Publication of JPS57192038A publication Critical patent/JPS57192038A/ja
Publication of JPS6332254B2 publication Critical patent/JPS6332254B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07521—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W90/737—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP56076113A 1981-05-20 1981-05-20 Bonding device Granted JPS57192038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56076113A JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56076113A JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Publications (2)

Publication Number Publication Date
JPS57192038A JPS57192038A (en) 1982-11-26
JPS6332254B2 true JPS6332254B2 (show.php) 1988-06-29

Family

ID=13595837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56076113A Granted JPS57192038A (en) 1981-05-20 1981-05-20 Bonding device

Country Status (1)

Country Link
JP (1) JPS57192038A (show.php)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148912U (show.php) * 1988-04-05 1989-10-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01148912U (show.php) * 1988-04-05 1989-10-16

Also Published As

Publication number Publication date
JPS57192038A (en) 1982-11-26

Similar Documents

Publication Publication Date Title
EP0675581B1 (en) Bonding apparatus for semiconductor electronic devices
KR960005549B1 (ko) 볼 본딩 방법 및 그 장치
US4422568A (en) Method of making constant bonding wire tail lengths
US3747198A (en) Tailless wedge bonding of gold wire to palladium-silver cermets
GB8826488D0 (en) Quality control for wire bonding
US5197652A (en) Wire bonding method and apparatus with lead pressing means
GB2116101A (en) Wire bonding apparatus
JPS6332254B2 (show.php)
JP2001102610A (ja) 半田バンプ付きリード線、太陽電池用リード線取付け装置及び太陽電池の製造方法
US5975835A (en) Lead frame conveying method and conveying apparatus
JPS62276840A (ja) ボンデイング装置
US5951283A (en) Substrate transporting device
JP3242486B2 (ja) 半導体モールド装置
JPS6155248B2 (show.php)
KR100368626B1 (ko) 와이어본딩방법 및 장치
KR100273881B1 (ko) 와이어본딩방법
JPH0617291Y2 (ja) ワイヤ−ボンディング装置
JP2973989B2 (ja) 外観検査機能付きワイヤボンディング装置
JPS5925377B2 (ja) ワイヤボンデイング方法
JPS62112331A (ja) ダイボンデイング装置
JPH035660B2 (show.php)
JPH01318238A (ja) ワイヤボンディング装置
JPS58220435A (ja) ワイヤボンデイング方法
JPS589331A (ja) 半導体装置のワイヤボンデイング装置
JP2696712B2 (ja) インナーリードボンディング装置