JPS63314789A - Glass base-plate with heat emitting body - Google Patents
Glass base-plate with heat emitting bodyInfo
- Publication number
- JPS63314789A JPS63314789A JP15198687A JP15198687A JPS63314789A JP S63314789 A JPS63314789 A JP S63314789A JP 15198687 A JP15198687 A JP 15198687A JP 15198687 A JP15198687 A JP 15198687A JP S63314789 A JPS63314789 A JP S63314789A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- platinum
- component
- heating element
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 85
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 66
- 229910052737 gold Inorganic materials 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 15
- 230000008018 melting Effects 0.000 claims abstract description 15
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 79
- 238000010438 heat treatment Methods 0.000 claims description 41
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 29
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 17
- 239000010931 gold Substances 0.000 claims description 17
- 239000011247 coating layer Substances 0.000 claims description 6
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 5
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 239000000155 melt Substances 0.000 abstract description 4
- 238000013019 agitation Methods 0.000 abstract 1
- 239000005355 lead glass Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ガラスに付着するカーボン等の汚れを除去し
得る発熱体を有するガラス基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a glass substrate having a heating element capable of removing stains such as carbon adhering to glass.
従来の発熱体を有するガラス基板は、発熱体としての銀
、ニッケルークロム等の膜をガラス基板に焼付け、窓ガ
ラスおよび反射鏡等の曇りを除去するものに使用されて
いた。そのためこれらの発熱温度は１５０°Ｃ程度の低
温度で十分であった。Conventional glass substrates having heating elements have been used to remove fog from window glasses, reflective mirrors, etc. by baking a film of silver, nickel-chromium, etc. as a heating element onto the glass substrate. Therefore, a low temperature of about 150°C was sufficient for these exothermic temperatures.
また、油、カーボン等の汚れを除去するため５００°Ｃ
以上の高温度に発熱する高温焼却炉等に使用される発熱
体を有するガラス基板としては、従来リング状のヒータ
をガラス基板に隣接しており、低温用の発熱体を有する
ガラス基板の如く、直接ガラスに発熱体としての白金等
の膜を焼付け、発熱体を有するガラス基板としたものは
なかった。Also, in order to remove dirt such as oil and carbon, it is heated to 500°C.
Conventionally, a ring-shaped heater is placed adjacent to the glass substrate as a glass substrate having a heating element used in a high-temperature incinerator or the like that generates heat at a high temperature, such as a glass substrate having a heating element for low temperature. There has never been a glass substrate with a heating element formed by directly baking a film of platinum or the like as a heating element onto glass.
高温用の発熱体を有するガラス基板を低温用の如く直接
焼付けることによって形成する場合、次のような問題が
生じていた。When a glass substrate having a heating element for high temperature use is directly baked to form a glass substrate for use at low temperature, the following problems have occurred.
例えば、発熱体を有するガラス基板として耐熱衝撃性を
考慮したガラス基板である石英ガラス基板上に白金膜等
の高温用発熱材を形成した場合、熱膨張係数が石英ガラ
ス基板と白金膜とでは大きく異なり、仮に石英ガラス基
板と白金膜とを焼付けたとしても、高温時における白金
膜の石英ガラス基板からの剥れという問題が生じる。さ
らにまた、石英ガラス基板は１２００°Ｃから溶融が始
まってしまうため、白金が単体で存在する従来の白金ペ
ーストの焼結温度である約１３５０℃まで温度を上げる
ことができず、石英ガラス基板への白金ペーストの完全
な焼付けが不可能であった。For example, when a high-temperature heat generating material such as a platinum film is formed on a quartz glass substrate, which is a glass substrate with a heating element that takes thermal shock resistance into consideration, the thermal expansion coefficient of the quartz glass substrate and the platinum film are large. On the other hand, even if the quartz glass substrate and the platinum film are baked, a problem arises in that the platinum film peels off from the quartz glass substrate at high temperatures. Furthermore, since quartz glass substrates start melting at 1200°C, it is not possible to raise the temperature to approximately 1350°C, which is the sintering temperature of conventional platinum pastes in which platinum is present alone. Complete baking of the platinum paste was not possible.
本発明は以上の問題点に鑑みたものであり、高温の状況
下においても長期間、しかも安定に発熱する発熱体を有
するガラス基板を提供するものである。The present invention has been made in view of the above problems, and provides a glass substrate having a heat generating element that stably generates heat for a long period of time even under high temperature conditions.
そこで本発明では、白金ペーストとして、粒状の白金と
、この白金を焼付けするガラス基板の融点と同じかまた
は低い融点をもち、白金を互いに結合させる第１成分と
、白金の熱膨張係数とガラス基板の熱膨張係数との範囲
内にある熱膨張係数をもち、かつガラス基板の融点と同
じかまたは低い融点をもち、白金とガラス基板とを結合
させる第２成分とから形成するという技術的手段を採用
する。Therefore, in the present invention, the platinum paste includes granular platinum, a first component that has a melting point that is the same as or lower than the melting point of the glass substrate on which the platinum is baked, and that binds the platinum together, a coefficient of thermal expansion of the platinum, and a glass substrate. and a second component that combines platinum and the glass substrate, and has a thermal expansion coefficient that is within the range of the thermal expansion coefficient of platinum and a melting point that is the same as or lower than the melting point of the glass substrate. adopt.
上記技術的手段を採用することにより、ガラス基板を溶
融することなしで、第１成分が溶融し、この第１成分に
より白金を互いに結合させ第１成分との合金とすること
ができる。さらに、焼付時に溶融する第２成分によって
、白金と第１成分よりなる白金膜とガラス基板とを結合
させ、第２成分が熱膨張率の差を緩和する中間層を形成
するので、高温の状況下においても長期間しかも安定に
発熱する発熱体を有するガラス基板を提供することがで
きる。By employing the above technical means, the first component is melted without melting the glass substrate, and the first component can bond platinum to each other to form an alloy with the first component. Furthermore, the second component, which melts during baking, bonds the platinum film made of platinum and the first component to the glass substrate, and the second component forms an intermediate layer that alleviates the difference in thermal expansion coefficients, so that it can be used even under high-temperature conditions. It is possible to provide a glass substrate having a heating element that stably generates heat for a long period of time even at the bottom thereof.
以下に、本発明の実施例を詳細に説明する。 Examples of the present invention will be described in detail below.
第１図（ａ）、Φ）は、高温焼却炉の観測窓に使用され
、カーボンが付着した時、発熱体により瞬時に除去する
発熱体を有するガラス基板である。FIG. 1(a), Φ) is a glass substrate that is used as an observation window of a high-temperature incinerator and has a heating element that instantly removes carbon when it adheres to it.
１はガラス基板である石英ガラス基板である。1 is a quartz glass substrate which is a glass substrate.
またこの石英ガラス基板には白金系の発熱体２が所定の
印刷パターンによって印刷焼付されている。Further, a platinum-based heating element 2 is printed and baked on this quartz glass substrate in a predetermined printing pattern.
次に、この発熱体を有するガラス基板の製作方法を説明
する。Next, a method for manufacturing a glass substrate having this heating element will be explained.
はじめに、石英ガラス基板ｌに塗布するペーストを製作
する。このペーストは、７０〜８０ｗｔ％の白金粒子と
、５〜１０ｗｔ％の第１成分である金と、３〜１０ｗｔ
％の第２成分であるガラスフリットよりなる原料を十分
撹拌、混合することによって成る。First, a paste to be applied to a quartz glass substrate l is prepared. This paste contains 70-80 wt% platinum particles, 5-10 wt% gold as the first component, and 3-10 wt% gold.
% of the second component, glass frit, is sufficiently stirred and mixed.
ここで、第１成分である金の含有量を５ｗｔ％より少な
くし、その分、白金の含有量を増した場合、このペース
トの焼結温度が上昇し、石英ガラス基板に塗布し、同時
に焼結させることが困難となってしまう。また、金の含
有量を１０ｗｔ％より多くし、その分、白金の含有量を
減らした場合、白金膜としての特性を失ってしまう。よ
って金の含有量は５〜１０ｗｔ％が最適である。Here, if the content of gold, which is the first component, is reduced to less than 5 wt% and the content of platinum is increased accordingly, the sintering temperature of this paste will increase, and it will be applied to a quartz glass substrate and sintered at the same time. It becomes difficult to tie the knot. Furthermore, if the gold content is increased to more than 10 wt% and the platinum content is reduced by that amount, the properties of the platinum film will be lost. Therefore, the optimum gold content is 5 to 10 wt%.
また、第２成分であるガラスフリットの含有量が１０ｗ
Ｌ％より多いと、白金と金よりなる白金膜の比抵抗が上
昇し、焼付後の発熱体２が所定の抵抗値を持たないとい
う不具合が生じてしまう。In addition, the content of the second component, glass frit, is 10w.
If it exceeds L%, the specific resistance of the platinum film made of platinum and gold increases, resulting in a problem that the heating element 2 after baking does not have a predetermined resistance value.
またこのガラスフリットの含有量を３ｗｔ％より少なく
すると、白金と金よりなる白金膜と石英ガラス基板とを
結合させることができなくなる。そのため第２成分であ
るガラスフリットの含有量は３〜１０ｗｔ％が最適であ
る。Furthermore, if the content of the glass frit is less than 3 wt%, it becomes impossible to bond the platinum film made of platinum and gold to the quartz glass substrate. Therefore, the content of the second component, glass frit, is optimally 3 to 10 wt%.
以上のようにして成る白金を主原料としたペーストを、
石英ガラス基板１に印刷し、その後、１２００℃にて焼
付を行い、このペーストを白金系発熱体とし発熱体を有
するガラス基板を製作した。The paste made as described above with platinum as the main raw material,
The paste was printed on a quartz glass substrate 1, and then baked at 1200° C., and the paste was used as a platinum heating element to produce a glass substrate having a heating element.
本実施例に使用される白金ペーストには、白金の他に、
金およびガラスフリットを混入させたことにより、次の
ような効果を得ることができる。In addition to platinum, the platinum paste used in this example includes:
By mixing gold and glass frit, the following effects can be obtained.
金の白金粒子中への撹拌混合は、焼結時におい ′
て、石英ガラス基板の溶融温度以下の温度にて金が容易
に溶融し、白金粒子を互いに金を介して強固に結合させ
白金と金よりなる合金を形成する。Stirring and mixing of gold into platinum particles during sintering
The gold easily melts at a temperature below the melting temperature of the quartz glass substrate, and the platinum particles are firmly bonded to each other via the gold to form an alloy of platinum and gold.
またこの合金よりなる白金膜は、金の含有量がペースト
全体で５〜１０ｗｔ％と少なく、白金単体の膜の性質と
同等のものである。Further, the platinum film made of this alloy has a low gold content of 5 to 10 wt% in the entire paste, and has properties equivalent to those of a film made of pure platinum.
さらに、ガラスフリットをペーストに撹拌混入 １す
ることにより、上記の白金膜と、石英ガラス基板１との
熱膨張係数の差による剥離を防止する。Furthermore, by stirring the glass frit into the paste, peeling due to the difference in thermal expansion coefficient between the platinum film and the quartz glass substrate 1 is prevented.
詳細に記載すると、このガラスフリットを白金膜中に撹
拌混入することによって、１２００℃の焼付時には、ガ
ラスフリットが溶融し、ガラス相を形成する。このガラ
ス相は、白金膜と機械的に結合し、また石英ガラス基板
１とは化学的に結合している。そのため、白金膜と石英
ガラス基板１とはガラス相を介して強固に結合される。Specifically, by stirring and mixing this glass frit into a platinum film, the glass frit melts and forms a glass phase during baking at 1200°C. This glass phase is mechanically bonded to the platinum film and chemically bonded to the quartz glass substrate 1. Therefore, the platinum film and the quartz glass substrate 1 are firmly bonded via the glass phase.
さらにまた、このガラス相は、白金膜の熱膨張係数と石
英ガラス基板１の熱膨張係数との範囲内にある熱膨張係
数を持っているために、白金膜と石英ガラス基板１との
熱膨張係数の差を緩和させる中間層的な役目をしており
、発熱ガラス使用時の、白金膜の剥離、クラックの発生
を防止し、安定した発熱ガラスを提供している。Furthermore, since this glass phase has a thermal expansion coefficient within the range of the thermal expansion coefficient of the platinum film and the thermal expansion coefficient of the quartz glass substrate 1, the thermal expansion coefficient of the platinum film and the quartz glass substrate 1 increases. It acts as an intermediate layer to alleviate the difference in coefficients, and prevents the platinum film from peeling off and cracking when using heat-generating glass, providing stable heat-generating glass.
第２図（ａ）、（ハ）は、本発明の第２実施例を示す。FIGS. 2(a) and 2(c) show a second embodiment of the present invention.
第２実施例では、第１実施例で得られた発熱体を有する
ガラス基板の発熱体２．に、酸化珪素よりなる保護膜３
を設けた。In the second example, a heating element 2 of a glass substrate having the heating element obtained in the first example was used. , a protective film 3 made of silicon oxide
has been established.
この保護膜３は、前記第１実施例の発熱体を有するガラ
ス基板の発熱体２全体に、スパッタリングによって発熱
体２の厚さより厚（なるように設けた。この保護膜３を
発熱体を有するガラス基板に設けることにより、白金膜
よりなる発熱体２は、全体を酸化珪素で狭まれた構造と
なるため、発熱体を有するガラス基板の発熱時には、白
金膜の両面においてほぼ同様な酸化珪素の変形が行われ
る。This protective film 3 was provided on the entire heating element 2 of the glass substrate having the heating element of the first embodiment by sputtering so as to be thicker than the heating element 2. By providing it on a glass substrate, the heating element 2 made of a platinum film has a structure entirely surrounded by silicon oxide, so when the glass substrate with the heating element generates heat, almost the same silicon oxide is formed on both sides of the platinum film. Transformation takes place.
そのため白金膜とコーティング層、および白金膜と石英
ガラス基板１との間の歪みを非常に小さくすることがで
き、高温時においても、非常に安定した発熱体を有する
ガラス基板を得ることができる。Therefore, distortion between the platinum film and the coating layer and between the platinum film and the quartz glass substrate 1 can be made very small, and a glass substrate having a very stable heating element can be obtained even at high temperatures.
第３実施例として、前記第１および第２実施例によって
得られた発熱体を有するガラス基板と、従来の発熱体を
有するガラス基板とを比較検討した。As a third example, a glass substrate having a heating element obtained in the first and second examples was compared with a glass substrate having a conventional heating element.
比較検討方法としては、それぞれの発熱体２への通電の
断続によって発熱体を有するガラス基板を室温と７００
°Ｃの範囲内に繰り返し発熱、冷却させ、１回の発熱、
冷却を１サイクルとする。そして、この各サイクル時で
の抵抗変化量を測定し、上記のサイクル数と抵抗変化量
との関係を調べ、その結果を第３図に示す。As a comparative study method, the glass substrate with the heating element is heated to room temperature and 700°C by intermittent electricity supply to each heating element 2
Repeated heat generation and cooling within the range of °C, one heat generation,
Cooling is one cycle. Then, the amount of resistance change during each cycle was measured, and the relationship between the number of cycles and the amount of resistance change was investigated, and the results are shown in FIG.
ここで、従来の発熱体を有するガラス基板では、ガラス
フリットおよび金を混入しない白金単独のペーストを石
英ガラス基板に印刷し、１２００″Ｃで焼付けた。Here, for a conventional glass substrate having a heating element, a paste containing only platinum without mixing glass frit and gold was printed on a quartz glass substrate and baked at 1200''C.
白金単独のペーストは１３５０°Ｃで焼結され、強固で
良好な膜となるが、従来の発熱体を有するガラス基板で
は、石英ガラスの耐熱温度のため、１２００°Ｃの焼付
けで行われなければならず、焼結不十分な発熱体を有す
るガラス基板となっている。そしてそのため第３図より
明らかなように、サイクル数を増すごとに、抵抗が大き
く増大し、１０００回を越えたサイクル数では、断線し
てしまった。しかし第１実施例では、サイクル数が３０
００回においても、抵抗の変化量が１．５Ωと非常に少
なく、かつ断線も発生しなかった。さらにまた第２実施
例での発熱体を有するガラス基板においては、サイクル
数が３０００回において、抵抗変化量が０．８Ωであり
、第２実施例において設けたコーティング層の効果を見
出すことができた。A paste made of platinum alone is sintered at 1350°C to form a strong and good film, but with a conventional glass substrate with a heating element, it must be baked at 1200°C due to the heat resistance temperature of quartz glass. The result is a glass substrate with a heating element that is not sufficiently sintered. As a result, as is clear from FIG. 3, the resistance increased greatly as the number of cycles increased, and the wire broke when the number of cycles exceeded 1,000. However, in the first embodiment, the number of cycles is 30.
Even in 00 cycles, the amount of change in resistance was very small at 1.5Ω, and no wire breakage occurred. Furthermore, in the glass substrate having the heating element in the second example, the resistance change amount was 0.8Ω after 3000 cycles, and the effect of the coating layer provided in the second example could be found. Ta.
前記実施例中のペーストには、第１成分として金を用い
たが、第１成分は金に限るものでなく白金と合金をつく
り、かつ融点がガラス基板の融点よりも低いかまたは同
じであればよく、例えば銀でも前記実施例と同様な効果
を得ることができる。Although gold was used as the first component in the paste in the above examples, the first component is not limited to gold, and may be any material that forms an alloy with platinum and has a melting point lower than or equal to the melting point of the glass substrate. For example, silver can also be used to obtain the same effect as in the above embodiment.
前記実施例中のペーストには、第２成分として、ガラス
フリットを用いたが、熱膨張率係数が、ガラス基板の熱
膨張係数と白金の熱膨張係数の中間であればよく、例え
ばアルミナ−シリカ系のセラミックスフリットでも前記
実施例と同様な効果を得ることができる。Although glass frit was used as the second component in the paste in the above examples, it is sufficient if the coefficient of thermal expansion is between that of the glass substrate and that of platinum, such as alumina-silica. The same effect as in the above embodiment can be obtained using a ceramic frit of the above-mentioned type.
前記実施例でのコーティング層は、酸化珪素をスパッタ
リングによりコーティングしたが、酸化珪素ガラスのペ
ーストをガラス基板に印刷、焼付により形成しても前記
実施例と同様な効果を得ることができる。Although the coating layer in the above embodiment was coated with silicon oxide by sputtering, the same effect as in the above embodiment can also be obtained by forming a paste of silicon oxide glass on a glass substrate by printing and baking.
また、前記実施例では、ガラス基板として石英ガラス基
板を用いたが、ガラス基板はこれに限るものではなく、
例えは、高珪酸ガラスを用いても同様の効果を得ること
ができる。Further, in the above embodiment, a quartz glass substrate was used as the glass substrate, but the glass substrate is not limited to this.
For example, the same effect can be obtained by using high silicate glass.
本発明は高温焼却炉の窓用に限るものでなく例えば、内
燃機関等の燃焼状態を観察、検知する窓用としてもよい
。The present invention is not limited to use in windows of high-temperature incinerators, but may also be used, for example, in windows for observing and detecting combustion conditions in internal combustion engines and the like.
本発明を採用することによって、ガラス基板の融点と同
じかまたは低い温度にて、白金を互いに結合させ、また
第２成分により白金とガラス基板とを結合させることが
できるので、高温においても、白金とガラス基板との熱
膨張係数の差を第２成分が緩和させ、長期間、安定に発
熱する発熱体を有するガラス基板を得ることができた。By adopting the present invention, platinum can be bonded to each other at a temperature that is the same as or lower than the melting point of the glass substrate, and platinum and the glass substrate can be bonded by the second component. The second component alleviated the difference in thermal expansion coefficient between the glass substrate and the glass substrate, making it possible to obtain a glass substrate having a heating element that stably generates heat for a long period of time.
第１図（ａ）、 （ｂ）は本発明の第１実施例を示す正
面図および側面図、第２図（ａ）、 （ｂ）は第２実施
例を示す正面図および側面図、第３図は発熱、冷却サイ
クルと抵抗変化量との関係を示す関係図である。
１・・・ガラス基板、２・・・発熱体、３・・・コーテ
ィング層。FIGS. 1(a) and (b) are a front view and a side view showing a first embodiment of the present invention, and FIGS. 2(a) and (b) are a front view and a side view showing a second embodiment of the present invention. FIG. 3 is a relationship diagram showing the relationship between heat generation, cooling cycles, and the amount of resistance change. DESCRIPTION OF SYMBOLS 1...Glass substrate, 2...Heating element, 3...Coating layer.
Claims (7)
によって形成された発熱体を有するガラス基板において
、前記白金ペーストが、 粒状の白金と、 前記ガラス基板の融点と同じかまたは低い融点をもち、
前記白金を互いに結合させる第１成分と、前記白金の熱
膨張係数と前記ガラス基板の熱膨張係数との範囲内にあ
る熱膨張係数をもち、かつ前記ガラス基板の融点と同じ
かまたは低い融点をもち、前記白金と前記ガラス基板と
を結合させる第２成分とからなることを特徴とする発熱
体を有するガラス基板。(1) In a glass substrate having a heating element formed by printing and baking a platinum paste on a glass substrate, the platinum paste has granular platinum and a melting point that is the same as or lower than the melting point of the glass substrate,
a first component that binds the platinum to each other; a thermal expansion coefficient that is within the range of the thermal expansion coefficient of the platinum and the thermal expansion coefficient of the glass substrate, and a melting point that is the same as or lower than the melting point of the glass substrate; 1. A glass substrate having a heat generating element, comprising a second component for bonding the platinum and the glass substrate.
方であることを特徴とする特許請求の範囲第１項記載の
発熱体を有するガラス基板。(2) A glass substrate having a heating element according to claim 1, wherein the first component is at least one of gold and silver.
リットのどちらか一方よりなることを特徴とする特許請
求の範囲第１項乃至第２項記載の発熱体を有するガラス
基板。(3) A glass substrate having a heating element according to any one of claims 1 to 2, wherein the second component is made of either glass frit or ceramic frit.
７０〜８０ｗｔ％の白金と、５〜１０ｗｔ％の第１成分
と、３〜１０ｗｔ％の第２成分よりなることを特徴とす
る特許請求の範囲第１項乃至第３項記載の発熱体を有す
るガラス基板。(4) When the paste is 100 wt% as a whole,
It has a heating element according to claims 1 to 3, characterized in that it consists of 70 to 80 wt% platinum, 5 to 10 wt% of a first component, and 3 to 10 wt% of a second component. glass substrate.
徴とする特許請求の範囲第１項乃至第４項記載の発熱体
を有するガラス基板。(5) A glass substrate having a heating element according to any one of claims 1 to 4, wherein the glass substrate is made of quartz glass.
形成したことを特徴とする特許請求の範囲第１項乃至第
５項記載の発熱体を有するガラス基板。(6) A glass substrate having a heating element according to any one of claims 1 to 5, characterized in that a coating layer is formed on the baked platinum paste.
りなることを特徴とする特許請求の範囲第６項記載の発
熱体を有するガラス基板。(7) A glass substrate having a heating element according to claim 6, wherein the coating layer is made of silicon oxide (SiO_2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15198687A JPS63314789A (en) | 1987-06-18 | 1987-06-18 | Glass base-plate with heat emitting body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15198687A JPS63314789A (en) | 1987-06-18 | 1987-06-18 | Glass base-plate with heat emitting body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63314789A true JPS63314789A (en) | 1988-12-22 |
Family
ID=15530562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15198687A Pending JPS63314789A (en) | 1987-06-18 | 1987-06-18 | Glass base-plate with heat emitting body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63314789A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009101919A1 (en) * | 2008-02-13 | 2009-08-20 | Nippon Sheet Glass Company, Limited | Window pane with sintered conductive ceramic |
-
1987
- 1987-06-18 JP JP15198687A patent/JPS63314789A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009101919A1 (en) * | 2008-02-13 | 2009-08-20 | Nippon Sheet Glass Company, Limited | Window pane with sintered conductive ceramic |
| CN101970371A (en) * | 2008-02-13 | 2011-02-09 | 日本板硝子株式会社 | Window pane with sintered conductive ceramic |
| JP4976508B2 (en) * | 2008-02-13 | 2012-07-18 | 日本板硝子株式会社 | Window glass with conductive ceramic sintered body |
| US8741436B2 (en) | 2008-02-13 | 2014-06-03 | Nippon Sheet Glass Company, Limited | Window glass with conductive ceramic fired body |
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