JPS6329838B2 - - Google Patents
Info
- Publication number
- JPS6329838B2 JPS6329838B2 JP7046880A JP7046880A JPS6329838B2 JP S6329838 B2 JPS6329838 B2 JP S6329838B2 JP 7046880 A JP7046880 A JP 7046880A JP 7046880 A JP7046880 A JP 7046880A JP S6329838 B2 JPS6329838 B2 JP S6329838B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- layer
- adhesive
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 33
- 239000012790 adhesive layer Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- -1 aluminum and copper Chemical class 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7046880A JPS55160490A (en) | 1980-05-26 | 1980-05-26 | Method of fabricating through hole type printed circuti board by electrophotographic process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7046880A JPS55160490A (en) | 1980-05-26 | 1980-05-26 | Method of fabricating through hole type printed circuti board by electrophotographic process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55160490A JPS55160490A (en) | 1980-12-13 |
| JPS6329838B2 true JPS6329838B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-06-15 |
Family
ID=13432374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7046880A Granted JPS55160490A (en) | 1980-05-26 | 1980-05-26 | Method of fabricating through hole type printed circuti board by electrophotographic process |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55160490A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308385C (zh) * | 2003-07-30 | 2007-04-04 | 住友橡胶工业株式会社 | 轮胎面用橡胶组合物及使用这种橡胶组合物的充气轮胎 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57194593A (en) * | 1981-05-26 | 1982-11-30 | Tsuyoshi Ikeda | Method of producing printed circuit board |
| US4661431A (en) * | 1984-09-27 | 1987-04-28 | Olin Hunt Specialty Products, Inc. | Method of imaging resist patterns of high resolution on the surface of a conductor |
-
1980
- 1980-05-26 JP JP7046880A patent/JPS55160490A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308385C (zh) * | 2003-07-30 | 2007-04-04 | 住友橡胶工业株式会社 | 轮胎面用橡胶组合物及使用这种橡胶组合物的充气轮胎 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55160490A (en) | 1980-12-13 |