JPS63296295A - チップ部品の接着剤固定用熱硬化炉 - Google Patents

チップ部品の接着剤固定用熱硬化炉

Info

Publication number
JPS63296295A
JPS63296295A JP62132787A JP13278787A JPS63296295A JP S63296295 A JPS63296295 A JP S63296295A JP 62132787 A JP62132787 A JP 62132787A JP 13278787 A JP13278787 A JP 13278787A JP S63296295 A JPS63296295 A JP S63296295A
Authority
JP
Japan
Prior art keywords
printed board
hot air
endless chain
furnace
hood
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62132787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0410239B2 (enrdf_load_stackoverflow
Inventor
Takashi Hattori
隆司 服部
Kenji Imoto
井元　賢治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OSAKA ASAHI KAGAKU KK
Original Assignee
OSAKA ASAHI KAGAKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OSAKA ASAHI KAGAKU KK filed Critical OSAKA ASAHI KAGAKU KK
Priority to JP62132787A priority Critical patent/JPS63296295A/ja
Publication of JPS63296295A publication Critical patent/JPS63296295A/ja
Publication of JPH0410239B2 publication Critical patent/JPH0410239B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP62132787A 1987-05-27 1987-05-27 チップ部品の接着剤固定用熱硬化炉 Granted JPS63296295A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62132787A JPS63296295A (ja) 1987-05-27 1987-05-27 チップ部品の接着剤固定用熱硬化炉

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62132787A JPS63296295A (ja) 1987-05-27 1987-05-27 チップ部品の接着剤固定用熱硬化炉

Publications (2)

Publication Number Publication Date
JPS63296295A true JPS63296295A (ja) 1988-12-02
JPH0410239B2 JPH0410239B2 (enrdf_load_stackoverflow) 1992-02-24

Family

ID=15089535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62132787A Granted JPS63296295A (ja) 1987-05-27 1987-05-27 チップ部品の接着剤固定用熱硬化炉

Country Status (1)

Country Link
JP (1) JPS63296295A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108518978A (zh) * 2018-03-23 2018-09-11 郁平 一种生产超厚岩棉板的固化炉

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108518978A (zh) * 2018-03-23 2018-09-11 郁平 一种生产超厚岩棉板的固化炉

Also Published As

Publication number Publication date
JPH0410239B2 (enrdf_load_stackoverflow) 1992-02-24

Similar Documents

Publication Publication Date Title
EP0279604B1 (en) Focused convection reflow soldering method and apparatus
US6123247A (en) Electronic unit soldering apparatus
US5230460A (en) High volume convection preheater for wave soldering
JPH06268B2 (ja) リフロー半田付け方法及び装置
KR20010102202A (ko) 조밀형 리플로우 및 세정 장치
JPH03124369A (ja) リフローはんだ付け装置
JP3585750B2 (ja) リフローはんだ付け装置
JPS63296295A (ja) チップ部品の接着剤固定用熱硬化炉
JPS6138985B2 (enrdf_load_stackoverflow)
JPH055581B2 (enrdf_load_stackoverflow)
JP6998666B2 (ja) リフロー装置
JPH02303674A (ja) 加熱方法及びその装置
JPH02137691A (ja) リフロー装置
JP3454621B2 (ja) 不活性ガス雰囲気炉
JP2502826B2 (ja) プリント基板のリフロ−はんだ付け方法
JP3186215B2 (ja) チッソリフロー装置
JPH10284831A (ja) リフローはんだ付け装置の熱風吹出板
JPS61285793A (ja) リフロー炉における半田付回路板の加熱方法
JP3045132B2 (ja) リフロー装置
JP2001308511A (ja) リフローはんだ付け方法およびその装置
JPH02396A (ja) 半田付け回路板の加熱方法
JP2502827B2 (ja) リフロ−はんだ付け装置
JPH062289Y2 (ja) プリント基板の反り矯正装置
JPH0380581B2 (enrdf_load_stackoverflow)
JP3171179B2 (ja) リフロー装置とリフロー装置内の温度制御方法