JPH0410239B2 - - Google Patents
Info
- Publication number
- JPH0410239B2 JPH0410239B2 JP62132787A JP13278787A JPH0410239B2 JP H0410239 B2 JPH0410239 B2 JP H0410239B2 JP 62132787 A JP62132787 A JP 62132787A JP 13278787 A JP13278787 A JP 13278787A JP H0410239 B2 JPH0410239 B2 JP H0410239B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- hood
- endless chain
- furnace
- hot air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62132787A JPS63296295A (ja) | 1987-05-27 | 1987-05-27 | チップ部品の接着剤固定用熱硬化炉 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62132787A JPS63296295A (ja) | 1987-05-27 | 1987-05-27 | チップ部品の接着剤固定用熱硬化炉 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63296295A JPS63296295A (ja) | 1988-12-02 |
JPH0410239B2 true JPH0410239B2 (enrdf_load_stackoverflow) | 1992-02-24 |
Family
ID=15089535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62132787A Granted JPS63296295A (ja) | 1987-05-27 | 1987-05-27 | チップ部品の接着剤固定用熱硬化炉 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63296295A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108518978A (zh) * | 2018-03-23 | 2018-09-11 | 郁平 | 一种生产超厚岩棉板的固化炉 |
-
1987
- 1987-05-27 JP JP62132787A patent/JPS63296295A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63296295A (ja) | 1988-12-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6123247A (en) | Electronic unit soldering apparatus | |
EP0279604A2 (en) | Focused convection reflow soldering method and apparatus | |
EP0363136B1 (en) | Soldering apparatus of a reflow type | |
JP2002134905A (ja) | リフロー半田付け装置 | |
JPH0410239B2 (enrdf_load_stackoverflow) | ||
JPH055581B2 (enrdf_load_stackoverflow) | ||
JPS6138985B2 (enrdf_load_stackoverflow) | ||
JPH0749151B2 (ja) | ハンダ付けリフロー炉 | |
JP7587958B2 (ja) | 搬送加熱装置 | |
JPS61285793A (ja) | リフロー炉における半田付回路板の加熱方法 | |
US6499994B1 (en) | Heating apparatus in reflow system | |
JPH10284831A (ja) | リフローはんだ付け装置の熱風吹出板 | |
JP2777433B2 (ja) | はんだ付け方法 | |
JP2740168B2 (ja) | 硬化炉 | |
JP4229580B2 (ja) | リフロー半田付け装置 | |
KR100627948B1 (ko) | 리플로우 장치의 가열 장치 | |
JPH09237965A (ja) | リフロー炉 | |
JP3045132B2 (ja) | リフロー装置 | |
JP2001308511A (ja) | リフローはんだ付け方法およびその装置 | |
JP2009200072A (ja) | リフローはんだ付け装置及びそれを使用するリフローはんだ付け方法 | |
JP2625931B2 (ja) | 加熱炉 | |
JP3171179B2 (ja) | リフロー装置とリフロー装置内の温度制御方法 | |
JP2576776Y2 (ja) | 加熱炉 | |
JPH03216272A (ja) | リフロー炉 | |
JP2007012874A (ja) | 基板加熱方法、基板加熱装置および熱風式リフロー装置 |