JPS6329414B2 - - Google Patents
Info
- Publication number
- JPS6329414B2 JPS6329414B2 JP54065156A JP6515679A JPS6329414B2 JP S6329414 B2 JPS6329414 B2 JP S6329414B2 JP 54065156 A JP54065156 A JP 54065156A JP 6515679 A JP6515679 A JP 6515679A JP S6329414 B2 JPS6329414 B2 JP S6329414B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuits
- holes
- conductive pattern
- mass
- metal substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6515679A JPS55157245A (en) | 1979-05-25 | 1979-05-25 | Mass producing method of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6515679A JPS55157245A (en) | 1979-05-25 | 1979-05-25 | Mass producing method of integrated circuit |
Related Child Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60097161A Division JPS60242632A (ja) | 1985-05-07 | 1985-05-07 | 集積回路の多量製造方法 |
| JP60097159A Division JPS60242630A (ja) | 1985-05-07 | 1985-05-07 | 集積回路の多量製造方法 |
| JP60097160A Division JPS60242631A (ja) | 1985-05-07 | 1985-05-07 | 集積回路の多量製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55157245A JPS55157245A (en) | 1980-12-06 |
| JPS6329414B2 true JPS6329414B2 (cs) | 1988-06-14 |
Family
ID=13278728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6515679A Granted JPS55157245A (en) | 1979-05-25 | 1979-05-25 | Mass producing method of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55157245A (cs) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60242630A (ja) * | 1985-05-07 | 1985-12-02 | Sanyo Electric Co Ltd | 集積回路の多量製造方法 |
| JPS60242632A (ja) * | 1985-05-07 | 1985-12-02 | Sanyo Electric Co Ltd | 集積回路の多量製造方法 |
| JPS60242631A (ja) * | 1985-05-07 | 1985-12-02 | Sanyo Electric Co Ltd | 集積回路の多量製造方法 |
| EP1398622A1 (fr) * | 2002-09-03 | 2004-03-17 | SCHLUMBERGER Systèmes | Méthode d'éclairage |
-
1979
- 1979-05-25 JP JP6515679A patent/JPS55157245A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55157245A (en) | 1980-12-06 |
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