JPS63289896A - 高密度多層基板の製造法 - Google Patents
高密度多層基板の製造法Info
- Publication number
- JPS63289896A JPS63289896A JP12248687A JP12248687A JPS63289896A JP S63289896 A JPS63289896 A JP S63289896A JP 12248687 A JP12248687 A JP 12248687A JP 12248687 A JP12248687 A JP 12248687A JP S63289896 A JPS63289896 A JP S63289896A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- conductor
- weight
- less
- tio2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 title abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 239000004020 conductor Substances 0.000 claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 10
- 239000005751 Copper oxide Substances 0.000 claims abstract description 9
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 10
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract description 8
- 239000002245 particle Substances 0.000 abstract description 8
- 239000000919 ceramic Substances 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- 229910017770 Cu—Ag Inorganic materials 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 239000007791 liquid phase Substances 0.000 abstract description 2
- 239000000470 constituent Substances 0.000 abstract 4
- 229910000108 silver(I,III) oxide Inorganic materials 0.000 abstract 3
- 229910000048 titanium hydride Inorganic materials 0.000 abstract 3
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(III) oxide Inorganic materials O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000001465 metallisation Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12248687A JPS63289896A (ja) | 1987-05-21 | 1987-05-21 | 高密度多層基板の製造法 |
| US07/133,817 US4871608A (en) | 1986-12-10 | 1987-12-10 | High-density wiring multilayered substrate |
| US07/196,408 US4837408A (en) | 1987-05-21 | 1988-05-20 | High density multilayer wiring board and the manufacturing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12248687A JPS63289896A (ja) | 1987-05-21 | 1987-05-21 | 高密度多層基板の製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63289896A true JPS63289896A (ja) | 1988-11-28 |
| JPH0552078B2 JPH0552078B2 (enrdf_load_stackoverflow) | 1993-08-04 |
Family
ID=14837039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12248687A Granted JPS63289896A (ja) | 1986-12-10 | 1987-05-21 | 高密度多層基板の製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63289896A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5120473A (en) * | 1987-10-12 | 1992-06-09 | Ngk Spark Plug Co., Ltd. | Metallizing composition for use with ceramics |
-
1987
- 1987-05-21 JP JP12248687A patent/JPS63289896A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5120473A (en) * | 1987-10-12 | 1992-06-09 | Ngk Spark Plug Co., Ltd. | Metallizing composition for use with ceramics |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0552078B2 (enrdf_load_stackoverflow) | 1993-08-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100798263B1 (ko) | 마이크로파 어플리케이션에서의 ｌｔｃｃ 테이프를 위한후막 전도체 페이스트 조성물 | |
| JPH11504159A (ja) | セラミック回路板支持基板用ガラスボンディング層 | |
| JPH0361359B2 (enrdf_load_stackoverflow) | ||
| JP3528037B2 (ja) | ガラスセラミック基板の製造方法 | |
| US4837408A (en) | High density multilayer wiring board and the manufacturing thereof | |
| JPS608229B2 (ja) | 多層セラミック基板 | |
| JPS6248097A (ja) | 多層回路基板の製造法 | |
| EP1178713B1 (en) | Multilayered board and method for fabricating the same | |
| JPS63289896A (ja) | 高密度多層基板の製造法 | |
| KR100744855B1 (ko) | 높은 열적 사이클 전도체 시스템 | |
| JP2011029534A (ja) | 多層配線基板 | |
| JP5265256B2 (ja) | セラミック配線基板 | |
| JPS61108192A (ja) | 低温焼結多層セラミツク基板 | |
| JPH0155594B2 (enrdf_load_stackoverflow) | ||
| JPS63209150A (ja) | 低誘電率絶縁体基板 | |
| JPH01201090A (ja) | セラミック用メタライズ組成物 | |
| JP2001143527A (ja) | 導電ペースト及びそれを用いたセラミック配線基板 | |
| JP2011233685A (ja) | 多層配線基板およびその製造方法 | |
| JP3934811B2 (ja) | 高熱膨張ガラスセラミック焼結体およびその製造方法、配線基板ならびにその実装構造 | |
| JPS61278195A (ja) | 多層回路基板及びその製造方法 | |
| JPS60167489A (ja) | セラミツク回路基板の製造方法 | |
| JPS6318356B2 (enrdf_load_stackoverflow) | ||
| JPH0588557B2 (enrdf_load_stackoverflow) | ||
| JPS63147395A (ja) | 高密度配線多層基板の製造法 | |
| JP2002015620A (ja) | 導体組成物およびこれを用いた配線基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |