JPS63276297A - Copper clad substrate - Google Patents
Copper clad substrateInfo
- Publication number
- JPS63276297A JPS63276297A JP62112821A JP11282187A JPS63276297A JP S63276297 A JPS63276297 A JP S63276297A JP 62112821 A JP62112821 A JP 62112821A JP 11282187 A JP11282187 A JP 11282187A JP S63276297 A JPS63276297 A JP S63276297A
- Authority
- JP
- Japan
- Prior art keywords
- board
- superconductive
- copper
- clad substrate
- copper clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 title claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 title abstract 5
- 239000010949 copper Substances 0.000 title abstract 5
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 14
- 230000005291 magnetic effect Effects 0.000 abstract description 9
- 230000005389 magnetism Effects 0.000 abstract description 5
- 230000005303 antiferromagnetism Effects 0.000 abstract description 3
- 239000000126 substance Substances 0.000 abstract description 3
- 239000003302 ferromagnetic material Substances 0.000 description 4
- 239000002887 superconductor Substances 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、磁気遮閉効果を有する銅張基板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a copper-clad substrate having a magnetic shielding effect.
第４図は、例えば、カタログ（松下電工発行のテクニカ
ルレポート「硼性特性にすぐれた鉄ペースプリント配線
板」）に示されているような、いわゆる鉄基板として一
般に市販されている従来の硼気遮閉効果を有する銅張基
板の断面図であり、図において、（１）は鉄板、（２）
は絶縁層、（３）は銅箔でそれぞれ接合されている。Figure 4 shows, for example, a conventional borium-based printed wiring board that is generally commercially available as a so-called iron substrate, as shown in the catalog (technical report published by Matsushita Electric Works, ``Iron-based printed wiring board with excellent borosilicity properties''). It is a cross-sectional view of a copper-clad board having a shielding effect, and in the figure, (1) is an iron plate, and (2)
(3) is bonded with an insulating layer, and (3) is bonded with a copper foil.
第４図に示す銅張基板は鉄板（１）が強磁性体であるた
め、鉄板（１）を境として磁気遮閉ができる。なお、銅
箔（３）は回路として使用し、銅張基板には電子部品が
取り付けられる〇
〔発明が解決しようとする問題点〕
従来の磁気遮閉効果を有する銅張基板は以上のように構
成されているので、基板の近くに強磁性体があると、そ
こまで磁気が及び磁気遮閉効果が薄れるという問題点が
あった。In the copper-clad board shown in FIG. 4, since the iron plate (1) is a ferromagnetic material, magnetic shielding can be achieved using the iron plate (1) as a boundary. The copper foil (3) is used as a circuit, and electronic components are attached to the copper-clad board. [Problem to be solved by the invention] The conventional copper-clad board with magnetic shielding effect is as described above. Therefore, if there is a ferromagnetic substance near the substrate, there is a problem in that the magnetism extends to that area and reduces the magnetic shielding effect.
この発明は上記のような問題点を解決するためになされ
たもので、磁気遮閉効果をより高めた銅張基板を得るこ
とを目的とする◇
〔問題点を解決するための手段〕
この発明に係る銅張基板は、超電導板と、この超電導板
に絶縁層を介して接合された銅箔とを備えたものである
。This invention was made to solve the above-mentioned problems, and its purpose is to obtain a copper-clad board with a higher magnetic shielding effect.◇ [Means for solving the problems] This invention The copper-clad substrate according to the invention includes a superconducting plate and a copper foil bonded to the superconducting plate via an insulating layer.
この発明における基板としての超電導板は、反強磁性を
示すので、強力な磁気遮閉効果が得られる。Since the superconducting plate used as the substrate in this invention exhibits antiferromagnetism, a strong magnetic shielding effect can be obtained.
以下、この発明の一実施例を図について説明する。第１
図において（４）は超電導板、（２）は絶縁層、（３）
は銅箔でそれぞれ接合されている。An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (4) is a superconducting plate, (2) is an insulating layer, and (3)
are each bonded with copper foil.
次に作用について説明する。Next, the effect will be explained.
超１ｉ導板（１）は超ｉ！導現象を示すとき、同時に反
強磁性も示す。従って磁気は超電導板（１）を通過でき
ない。故に、超電導板（１）に接近して強磁性体があっ
ても超電導板（１）を境に反対側からの磁気はこの強磁
性体に及はない。Super 1i conductor plate (1) is super i! When a magnet exhibits a guiding phenomenon, it also exhibits antiferromagnetism. Therefore, magnetism cannot pass through the superconducting plate (1). Therefore, even if there is a ferromagnetic material close to the superconducting plate (1), the magnetism from the opposite side of the superconducting plate (1) will not affect this ferromagnetic material.
なお、比較的高温で用いられる超電導体としては、酸化
物系（例えば、（Ｙｓ ”ａ ）ｓ ’ｕ２０７ ）
や有機系のものが知られており、銅張基板周辺の温度
を超電導板（１）の臨界温度以下に保って用いられる。Note that oxide-based superconductors (for example, (Ys ``a ) s 'u207 ) are used as superconductors used at relatively high temperatures.
and organic ones are known, and are used by keeping the temperature around the copper-clad substrate below the critical temperature of the superconducting plate (1).
なお、上記実施例の他に第２図および第３図のような実
施例も考えられる。第２図では第１図の超電導板（４）
の絶縁Ｍ（２）と反対側に強磁性体としての鉄板（１）
を接合した。また、第３図では、第２図の超電導板（４
）と鉄板（１）を入れ替えた。このことにより銅張基板
の砒気遮閉効果は二重になる。In addition to the embodiments described above, embodiments such as those shown in FIGS. 2 and 3 are also conceivable. In Figure 2, the superconducting plate (4) in Figure 1 is shown.
Insulation M (2) and iron plate (1) as a ferromagnetic material on the opposite side
were joined. In addition, in Fig. 3, the superconducting plate (4
) and iron plate (1) were replaced. This doubles the arsenic shielding effect of the copper-clad substrate.
以上のように、この発明によれは超電導板と、この超ｖ
Ｌ導板に絶縁層を介して接合された銅箔とを備えたので
、磁気遮閉効果の優れた銅張基板が得られる。As described above, according to the present invention, the superconducting plate and the super-v
Since the copper foil is bonded to the L conductive plate via the insulating layer, a copper-clad board with excellent magnetic shielding effect can be obtained.
第１図はこの発明の一実施例による銅張基板を示す断面
図、第２図、第３図はそれぞれこの発明の他の実施例に
よる銅張基板を示す断面図、第４図は従来の銅張基板を
示す断面図である。
図にお−て、（１）は鉄板（２）は絶縁層、（３）は銅
箔、（４）は超電導板である。
なお、各図中同一符号は同一または相当部分を示す。FIG. 1 is a sectional view showing a copper-clad board according to one embodiment of the present invention, FIGS. 2 and 3 are sectional views showing copper-clad boards according to other embodiments of the invention, and FIG. 4 is a sectional view showing a conventional copper-clad board. FIG. 3 is a cross-sectional view showing a copper-clad board. In the figure, (1) is an iron plate (2) is an insulating layer, (3) is a copper foil, and (4) is a superconducting plate. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
された銅箔とを備えた銅張基板。（２）超電導板に接合
された強磁性板を有する特許請求の範囲第１項記載の銅
張基板。 （３）強磁性板は鉄板である特許請求の範囲第２項記載
の銅張基板。[Scope of Claims] (1) A copper-clad substrate comprising a superconducting plate and a copper foil bonded to the superconducting plate via an insulating layer. (2) The copper-clad substrate according to claim 1, which has a ferromagnetic plate bonded to a superconducting plate. (3) The copper-clad substrate according to claim 2, wherein the ferromagnetic plate is an iron plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62112821A JPS63276297A (en) | 1987-05-07 | 1987-05-07 | Copper clad substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62112821A JPS63276297A (en) | 1987-05-07 | 1987-05-07 | Copper clad substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63276297A true JPS63276297A (en) | 1988-11-14 |
Family
ID=14596376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62112821A Pending JPS63276297A (en) | 1987-05-07 | 1987-05-07 | Copper clad substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63276297A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02275779A (en) * | 1989-04-17 | 1990-11-09 | Ngk Insulators Ltd | Superconducting ceramic composite material |
| JPH0368199A (en) * | 1989-08-07 | 1991-03-25 | Dowa Mining Co Ltd | Superconductive magnetic shield material |
-
1987
- 1987-05-07 JP JP62112821A patent/JPS63276297A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02275779A (en) * | 1989-04-17 | 1990-11-09 | Ngk Insulators Ltd | Superconducting ceramic composite material |
| JPH0368199A (en) * | 1989-08-07 | 1991-03-25 | Dowa Mining Co Ltd | Superconductive magnetic shield material |
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