JPH0287600A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0287600A JPH0287600A JP23950788A JP23950788A JPH0287600A JP H0287600 A JPH0287600 A JP H0287600A JP 23950788 A JP23950788 A JP 23950788A JP 23950788 A JP23950788 A JP 23950788A JP H0287600 A JPH0287600 A JP H0287600A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- solder
- conductor pattern
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 230000035699 permeability Effects 0.000 claims abstract description 9
- 239000000696 magnetic material Substances 0.000 claims abstract description 6
- 238000009413 insulation Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 239000006247 magnetic powder Substances 0.000 abstract description 3
- 229920003002 synthetic resin Polymers 0.000 abstract description 3
- 239000000057 synthetic resin Substances 0.000 abstract description 3
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、絶縁板に導体パターン層が設けられたプリ
ント配線板に関し、特に電磁シールド手段にかかわる。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed wiring board in which a conductive pattern layer is provided on an insulating plate, and particularly to electromagnetic shielding means.
第２図は従来のプリント配線板の一部縦断面図で、４層
板の場合を示す。図において、１は強化繊維布などの基
材にエポキシなど合成樹脂を含浸処理して形成された内
層の絶縁板で、両面に銅箔などによる内層の導体パター
ン層２．３が設けられている。４及び５は絶縁板１と同
様の材質からなる外層の絶縁板で、エポキシ樹脂又はそ
のプリプレグ層などによる接着層８により絶縁板１の両
面に一体に接合されている。？３縁ｊｆｉ４．５の外面
には銅箔などによる外層の導体パターン層６，７が設け
られている。９はスルーホールで、銅などの導電金属め
つき９ａが施され、導体パターン層６と７とを接続して
いる。導体パターン層６及び７が施された絶縁板４及び
５の外面にはエポキシ樹脂によるソルダレジスト膜１０
が施され、ＩＯなど実装部品が装着され、フローはんだ
工程にかけられる。FIG. 2 is a partial longitudinal cross-sectional view of a conventional printed wiring board, showing the case of a four-layer board. In the figure, 1 is an inner layer insulating plate formed by impregnating a base material such as reinforced fiber cloth with synthetic resin such as epoxy, and inner conductor pattern layers 2 and 3 made of copper foil or the like are provided on both sides. . Reference numerals 4 and 5 are outer insulating plates made of the same material as the insulating plate 1, and are integrally bonded to both surfaces of the insulating plate 1 by an adhesive layer 8 made of epoxy resin or its prepreg layer. ? On the outer surface of the three edges jfi4.5, outer conductor pattern layers 6 and 7 made of copper foil or the like are provided. A through hole 9 is plated with a conductive metal such as copper 9a, and connects the conductor pattern layers 6 and 7. A solder resist film 10 made of epoxy resin is applied to the outer surfaces of the insulating plates 4 and 5 on which the conductor pattern layers 6 and 7 are applied.
is applied, mounted components such as IO are mounted, and subjected to a flow soldering process.
上記のような従来のプリント配線板では、外部からの電
磁雑音により、ＩＣなどの実装部品への影響を受けてい
た。また、実装されたＩＣなどの部品から発生する電磁
雑音により、外部への影響を与えていた。In conventional printed wiring boards as described above, mounted components such as ICs are affected by external electromagnetic noise. In addition, electromagnetic noise generated from mounted ICs and other components had an impact on the outside.
これらの影響を防ぐため、従来、部品が実装されたプリ
ント配線板全体を金属板などで囲うことがなされていた
。まだ、プリント配線板上の特に重要な回路部分を遮蔽
する必要がある場合、プリント配線板上の接地線を信号
線近くに配線するなどの回路パターンで工夫がなされて
いた。In order to prevent these effects, conventionally, the entire printed wiring board on which components are mounted is surrounded by a metal plate or the like. Still, when it was necessary to shield particularly important circuit parts on a printed wiring board, devised circuit patterns were used, such as wiring the ground wire on the printed wiring board close to the signal line.
しかしながら、前者の手段では、プリント配線板とは別
に金属板などの囲い板が必要であシ、後者の手段では、
回路パターン設計上特別な配慮を要し、設計の自由度が
阻害され、手間がかかるという問題点があった。However, the former method requires a surrounding plate such as a metal plate in addition to the printed wiring board, and the latter method requires
There are problems in that special consideration is required in circuit pattern design, the degree of freedom in design is inhibited, and it is time-consuming.
この発明は、このような問題点を解決するためになされ
たもので、特別な囲い板などを要せず、回路パターン設
計の自由度を阻害することなく、容易に電磁シールドが
できるプリント配線板を得ることを目的としている。This invention was made in order to solve these problems, and provides a printed wiring board that can easily provide electromagnetic shielding without requiring a special shroud or hindering the freedom of circuit pattern design. The purpose is to obtain.
この発明にかかるプリント配線板は、外層に所定の導体
パターン層を形成後、高透磁率磁性物を含み絶縁性をも
ち、はんだ排除性のあるソルダレジストを、外層面に付
着したものである０〔作用〕
この発明においては、外層面には、高透磁率磁性物を含
み絶縁性のあるソルダレジストが付着されておシ、導体
パターン層に対する外部からの電磁雑音の影響が防がれ
、また、内部に生じた電磁雑音の外部への漏れを防止す
る。In the printed wiring board according to the present invention, after forming a predetermined conductor pattern layer on the outer layer, a solder resist containing a high permeability magnetic material, having insulation properties, and having solder removal properties is adhered to the outer layer surface. [Function] In this invention, an insulating solder resist containing a high permeability magnetic material is attached to the outer layer surface, and the effect of external electromagnetic noise on the conductor pattern layer is prevented. , prevent electromagnetic noise generated inside from leaking to the outside.
第１図はこの発明によるプリント配線板の一実施例の縦
断面図で、４層板の場合を示す。図において、１〜９．
９ａは上記従来の配線板と同一のものであシ、説明は略
する。２０は導体パターン層６及び７が設けられた外層
の絶縁板４，５の外層面に、必要な部分に付着されたソ
ルダレジスト膜であり、高透磁率磁性物を含み絶縁性を
もち、かつ、はんだ排除性に優れたソルダレジスト材を
用いている。FIG. 1 is a longitudinal cross-sectional view of one embodiment of a printed wiring board according to the present invention, showing a case of a four-layer board. In the figure, 1 to 9.
Reference numeral 9a is the same as the above-mentioned conventional wiring board, and the explanation thereof will be omitted. Reference numeral 20 denotes a solder resist film that is adhered to necessary portions on the outer layer surfaces of the outer layer insulating plates 4 and 5 on which the conductor pattern layers 6 and 7 are provided, and contains a high permeability magnetic material and has an insulating property. , uses a solder resist material with excellent solder removal properties.
このソルダレジスト材には、例えば、エポキシ樹脂など
合成樹脂に、Ｍｎ−Ｚｎ−Ｆｅ系などフェライト粉末な
どの磁性粉末を添加したものを用いている。This solder resist material is made of, for example, a synthetic resin such as epoxy resin to which magnetic powder such as Mn-Zn-Fe ferrite powder is added.
この磁性粉末は高透磁率で、絶縁性をもっている。This magnetic powder has high magnetic permeability and insulating properties.
こうして、プリント配線板は内外層面にソルダレジスト
膜２０が施されており、導体パターン層や実装部品に対
する外部からの電磁雑音が吸収され、電磁ノイズの影響
を防ぐとともに、内部から発生する電磁雑音の外部への
漏れを防止する。In this way, the solder resist film 20 is applied to the inner and outer layer surfaces of the printed wiring board, which absorbs electromagnetic noise from the outside to the conductor pattern layer and the mounted components, prevents the influence of electromagnetic noise, and reduces the electromagnetic noise generated from inside. Prevent leakage to the outside.
なお、上記実施例では、４層板の場合を説明したが、片
面板１両面板、あるいは３層板以上の多層板の場合にも
適用されるものである。In the above embodiments, the case of a four-layer board was explained, but the present invention is also applicable to a single-sided board, one double-sided board, or a multi-layer board of three or more layers.
以上の：うに、この発明によれば、外層に導体パターン
を形成後、高透磁性で絶縁性をもち、はんだ排除性を有
するツルダレジス）［を外層面に形成したので、外部か
らの電磁雑音、又は内部から発生する電磁雑音が吸収さ
れ、電磁ノイズの影響が防がれる。As described above, according to the present invention, after forming a conductor pattern on the outer layer, a high magnetic permeability, insulating, and solder resist (Tsurudaregis) is formed on the outer layer surface, which eliminates electromagnetic noise from the outside. Alternatively, electromagnetic noise generated from inside is absorbed, and the influence of electromagnetic noise is prevented.
第１図はこの発明によるプリント配線板の一実施例の一
部縦断面図、第２図は従来のプリント配線板の一部縦断
面図である。
１．４．．５・・・絶縁板、２，３，６．’７・・・導
体パターン層、２０・・・ソルダレジスト膜
なお、図中同一符号は同−又は相当部分を示す。FIG. 1 is a partial vertical cross-sectional view of an embodiment of a printed wiring board according to the present invention, and FIG. 2 is a partial vertical cross-sectional view of a conventional printed wiring board. 1.4. ．． 5... Insulating plate, 2, 3, 6. '7... Conductor pattern layer, 20... Solder resist film Note that the same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
線板において、高透磁率磁性物を含み絶縁性をもち、か
つ、はんだ排除性を有するソルダレジスト膜を外層面に
形成したことを特徴とするプリント配線板。A printed wiring board in which a conductor pattern layer is provided on the surface of an insulating plate, characterized in that a solder resist film containing a high permeability magnetic material, having insulation properties, and having solder repellency is formed on the outer layer surface. printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23950788A JPH0287600A (en) | 1988-09-24 | 1988-09-24 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23950788A JPH0287600A (en) | 1988-09-24 | 1988-09-24 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0287600A true JPH0287600A (en) | 1990-03-28 |
Family
ID=17045818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23950788A Pending JPH0287600A (en) | 1988-09-24 | 1988-09-24 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0287600A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132997U (en) * | 1989-04-12 | 1990-11-05 | ||
| JPH0786784A (en) * | 1993-09-10 | 1995-03-31 | Cmk Corp | Printed wiring board having magnetic coating film and its manufacture |
| WO1999038366A1 (en) * | 1998-01-22 | 1999-07-29 | Robert Bosch Gmbh | Multilayered substrate |
| JP2008036696A (en) * | 2006-08-09 | 2008-02-21 | Murata Mach Ltd | Turret changing system and punch press |
-
1988
- 1988-09-24 JP JP23950788A patent/JPH0287600A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02132997U (en) * | 1989-04-12 | 1990-11-05 | ||
| JPH0786784A (en) * | 1993-09-10 | 1995-03-31 | Cmk Corp | Printed wiring board having magnetic coating film and its manufacture |
| WO1999038366A1 (en) * | 1998-01-22 | 1999-07-29 | Robert Bosch Gmbh | Multilayered substrate |
| JP2008036696A (en) * | 2006-08-09 | 2008-02-21 | Murata Mach Ltd | Turret changing system and punch press |
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