JP3104109B2 - Electronic circuit module device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit module device used to construct a unit having functions such as amplification, oscillation, control and a combination thereof.

[0002]

2. Description of the Related Art In recent years, electronic circuit module devices have been widely used in various fields in order to facilitate the configuration of electronic devices themselves by modularizing each function as electronic devices become more sophisticated.
Many are used. At that time, there is an active movement to reduce the size and weight of electronic devices, and accordingly, there is a strong demand for smaller electronic circuit module devices. In response to this demand, components have been mounted at a high density, and applications have been diversified. As an example, an electronic circuit module device mounted on a movable part such as an optical head of an optical disk device is also required. This electronic circuit module device has a built-in high-frequency oscillation circuit, and there is also a need to minimize the leakage of electromagnetic waves.

FIG. 4 is a view showing the structure of a conventional electronic circuit module device, FIG. 4 (a) is a perspective view, and FIG.
FIG. 4A is a cross-sectional view of a double-sided printed wiring board,
FIG. 4C is a cross-sectional view of the single-sided double-sided printed wiring board shown in FIG.

In FIGS. 4 (a), 4 (b) and 4 (c), 1 is a case upper cover, 2 is a case lower cover, 3 is a double-sided printed wiring board, 4 is a through capacitor, 5 is an electronic component, and 6 is a solder. The attachment portion 7 is a single-sided double-sided printed wiring board. This electronic circuit module device is configured as follows.

[0005] A metal case composed of a case upper cover 1 and a case lower cover 2 is used to prevent external electromagnetic waves from affecting an internal electronic circuit, or to prevent electromagnetic waves generated in the internal electronic circuit from leaking to the outside. So it has a role of shield. Therefore it is usually made of metal.

As shown in FIG. 4 (c), the electronic component 5 is usually mounted on a single-sided double-sided printed wiring board 7 with its back surface soldered to a case and grounded. To this end, as shown in FIG. 4B, the electronic component 5 is mounted on both the front and back surfaces of the double-sided printed wiring board 3. The material of the substrate is a rigid material such as glass epoxy.

[0007] The feedthrough capacitor 4 functions as a bypass capacitor to prevent intrusion and leakage of electromagnetic waves from the lead lead-out portion and to enhance the shielding effect, and also has a role of a lead lead. Normally, wiring of an external electronic circuit is soldered to the outer leads of the feedthrough capacitor 4. Particularly, in the case of an electronic circuit module device mounted on a movable part such as an optical head of an optical disk device, a flexible printed board is often soldered to lead terminals of a feedthrough capacitor.

[0008] As described above, an electronic circuit having a specific function is unitized, and a desired characteristic can be obtained only by supplying a constant power supply voltage from the device side.

An electronic circuit module device mounted on an optical head of an optical disk device uses a very small feedthrough capacitor.

[0010]

However, in the above-described conventional configuration, since several feedthrough capacitors are used, even if an ultra-small capacitor is used, the space occupied by the feedthrough capacitor is large, and the electronic circuit module device is small. It had the disadvantage that it could not be converted. In addition, the feedthrough capacitor is difficult to automatically mount by a machine, is difficult to manufacture compared to other electronic components, and is expensive.
In addition, since it is difficult to secure the positional accuracy of the terminals of the feedthrough capacitor, there is a disadvantage in that the bondability with other electronic circuit boards or lead wirings of a flexible printed board is poor.

The present invention has been made in view of the above-mentioned drawbacks, and has a circuit configuration that does not use a feedthrough capacitor, that is capable of reducing the size of an electronic circuit module device, has high jointability with other electronic circuits, and that is capable of transmitting electromagnetic waves to the outside. An object of the present invention is to provide an electronic circuit module device in which leakage is sufficiently suppressed.

[0012]

In order to solve the above problems, an electronic circuit module device according to the present invention includes a printed circuit board mounted inside a metal case serving as a shield.
Place the electronic circuit part, formed on the metal case
The drawn part of the printed wiring board is placed in the gap
The wiring lead and the ground lead
To the outside of the metal case, and
Mounting the chip capacitor between said inner vicinity of the metal case and the wiring lead and the ground lead, the metal case and ground to the pull-out portion of the printed circuit board
The metal case is provided by providing a solder joint for connecting a lead.
The ground lead is one that is electrically connected to each other.

An electronic circuit module device according to the present invention.
Is a metal case that acts as a shield,
Has ground lead and back ground lead on the back
Of electronic circuits on a multilayer printed circuit board
And place the print in the gap formed in the metal case.
Arrange the lead-out part of the wiring board and through this lead-out part
Wiring lead, front ground lead and rear ground lead.
The lead out of the metal case, and
Near the inside of the metal case and the wiring
Lead and the front ground lead or the back ground
A chip capacitor is mounted between the leads and the metal
Connect signal leads inside and outside the case via through holes
The front ground lead and the rear ground lead
Signal wiring is provided between the in the lead portion of the metal case to the outside of the printed circuit board, before Symbol surface ground leads and the said printed circuit board
The back ground lead is directly electrically connected to the metal case.

Furthermore, the electronic circuit module device of the present invention
Indicates that the width of the printed wiring board is inside the metal case.
Of the metal
In the printed circuit board outside the case,
The width of the printed wiring board in the vicinity of the
Narrower than the width of the printed wiring board that has moved away from the part
Things.

[0015]

According to the present invention, unlike the conventional electronic circuit module device, by providing a bypass circuit using a smaller chip capacitor without using a feedthrough capacitor, the influence of external or external electromagnetic waves is provided. Prevent
In addition, since the space can be reduced, the size of the electronic circuit module device can be further reduced.

Since all of the electronic components to be mounted can be constituted by those which can be automatically mounted, production at low cost is possible. In addition, since the terminal position can be determined with high accuracy, the connection with an external electronic circuit is high. Also, a shield effect equivalent to or higher than that of the case using a feedthrough capacitor can be obtained with respect to penetration and leakage of electromagnetic waves. Therefore, an inexpensive, compact, and high-performance electronic circuit module device can be realized.

[0017]

FIG. 1 is a block diagram of an electronic circuit module device according to a first embodiment of the present invention. FIG. 1A is a perspective view of an electronic circuit module device using a single-sided double-sided printed wiring board 7, and FIG.
FIG. 3 is a perspective view of an electronic circuit module device using the device.

In the figure, the same components and parts as those in FIG. 4 are denoted by the same reference numerals, and the description thereof will be omitted. In FIGS. 1A and 1B, reference numeral 8 denotes a plug portion used for connection to an external electronic circuit, and 9 denotes a soldering shield portion.

FIG. 1 (c) is a plan view showing a component structure near a drawer portion of the electronic circuit module device shown in FIGS. 1 (a) and 1 (b) and a printed wiring board (3 or 7).

Printed circuit board on which electronic component 5 is mounted
(3 or 7) is placed in a metal case shielded by the case upper lid 1 and the case lower lid 2. A connection lead (signal line S, ground line G) to an external circuit (not shown) is drawn out from a gap g between the case upper cover 1 and the case lower cover 2, and the vicinity of the drawn portion to the external circuit portion in the metal case is drawn. In this case, by bypassing between the signal line S and the ground line G via the chip capacitor 5C, a high-frequency component which is put on the signal line S and goes out of the metal case is removed. Further, in order to prevent electromagnetic waves existing in the space inside the metal case from leaking from the gap of the metal case to the outside, a soldering shield portion 9 is provided at an external lead-out portion of the printed wiring board (3 or 7) by soldering. .

By adopting such a configuration, it is possible to reduce the size without using a conventional feedthrough capacitor,
In addition, it is possible to prevent electromagnetic waves from leaking from the oscillation circuit mounted on the printed wiring board to the external circuit, and prevent electromagnetic waves from entering the printed wiring board from the external circuit.

FIG. 2 is a block diagram of an electronic circuit module device according to a second embodiment of the present invention, in which a double-sided multilayer wiring board is used. FIG. 2A is a plan view showing a component configuration near a drawer portion of the electronic circuit module device and a double-sided multilayer wiring board, and FIG. 2B is a cross-sectional view of FIG. 2A.

In the figure, the same reference numerals are given to the same components, portions, and the like as those in FIG. 1, and description thereof will be omitted. 2 (a) and 2 (b), 10 is a signal line through hole, 11 is a ground line through hole, 12 is a front surface ground wiring, 12 ′
Is a front surface ground wiring on the back surface, 13 is a front surface signal line wiring, 14 is a plug part signal line wiring, 15 is an internal layer signal line wiring, 16 is an internal layer ground line wiring, and 17 is a plug part ground line wiring.

This embodiment is similar to the first embodiment shown in FIG.
The double-sided multilayer wiring board on which the electronic components 5 are mounted is placed in a metal case shielded by a case upper cover 1 and a case lower cover 2. Then, a connection lead to an external circuit (not shown) is drawn out from a gap g between the case upper cover 1 and the case lower cover 2.

That is, as shown in FIG. 2 (b), the front surface ground wiring 12 on the front surface and the front surface ground wiring 12 'on the back surface are connected to at least one of the front and back surfaces of the double-sided multilayer wiring board from the metal case. The plug signal line wiring 14 is drawn out from the gap g between the case upper cover 1 and the case lower cover 2, and the double-sided multilayer wiring is mounted via the signal line through hole 10 in the vicinity of the board drawing part of the metal case upper cover 1. As shown in FIG. 2 (b), it is taken out of the metal case via the signal line wiring 15 of the inner layer of the double-sided multilayer wiring board, and is pulled out through the signal line through hole 10 as shown in FIG. It is connected to the line wiring 17.

Also, in order to prevent electromagnetic waves existing in the space inside the metal case from leaking out of the gap g of the metal case to the outside, the surface ground wirings 12 and 12 on the front surface and the back surface of the external lead-out portion of the printed wiring board are soldered. ′ Are respectively provided with soldering shield portions 9. In addition, in order to remove high-frequency components leaking to the outside by being placed on the signal line wiring 15 in the inner layer, the signal line wiring 15 is connected to the front and rear surface ground wiring.
By adopting a structure of sandwiching between 12, 12 ', the same action as the feedthrough capacitor is provided in a pseudo manner.

Further, as shown in FIG. 2 (b), by arranging at least two layers of the brand line wiring 16 of the internal layer in the structure sandwiching the signal line wiring 15 inside the double-sided mounting multilayer wiring board, the removal of high frequency components It is good also as a structure which raises an effect.

With the above configuration, it is small and can be automatically mounted, and leakage of electromagnetic waves can be reduced.

FIG. 3 is a plan view showing the structure of an electronic circuit module device according to a third embodiment of the present invention. The same components and portions as those in FIGS. 1 and 2 are denoted by the same reference numerals. Description is omitted.

The basic structure is the same as in the first and second embodiments of the present invention. The difference is that the width of the printed wiring board in the external lead portion is such that the width inside the metal case near the lead portion from the metal case is wider than the width outside the metal case. In order to prevent electromagnetic waves existing in the space inside the metal case from leaking to the outside through the gap g of the metal case, a soldering shield part 9 is provided on a part of the surface ground wiring 12 of the external lead-out part of the printed wiring board by soldering. It is the same. By reducing the width of the printed wiring board in the drawer portion and drawing it out, the leakage of electromagnetic waves from the gap between the cases is more securely prevented.

With the above configuration, it is small and can be automatically mounted, and leakage of electromagnetic waves can be reduced.

[0032]

As described above, according to the electronic circuit module device of the present invention, the metal shield and the printed wiring are provided.
Metal shield and printed wiring with electrical connection to board
Since it can be fixed to the substrate, it is easy to configure an electronic circuit module device in which components are mounted at high density, and at the same time, it has electrical connection leads to the outside and can be easily connected, and is small and low in size. Cost and unnecessary radiation can be reduced. In addition, the same operation as a feedthrough capacitor
Can be used for the internal signal wiring
The high frequency component leaking to the filter can be removed.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an electronic circuit module device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of an electronic circuit module device according to a second embodiment of the present invention.

FIG. 3 is a configuration diagram of an electronic circuit module device according to a third embodiment of the present invention.

FIG. 4 is a composition diagram of a conventional electronic circuit module device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Case upper lid, 2 ... Case lower lid, 3 ... Double-sided mounting printed wiring board, 4 ... Through capacitor, 5 ... Electronic components, 5C ... Chip capacitor, 6 ... Solder part,
7: Single-sided double-sided printed wiring board, 8: Plug section,
9: Soldering shield part, 10: Signal line through hole, 11: Signal line through hole, 12: Front surface ground wiring, 12 ': Back surface ground wiring, 13: Front signal line wiring, 14: Plug signal Line wiring, 15 ... signal line wiring in the inner layer, 16 ... ground line wiring in the inner layer, 17
... Plug ground wiring.

Continuing on the front page (72) Inventor Hideyuki Nakanishi 1006 Kadoma, Kadoma, Osaka Prefecture Inside Matsushita Denshi Kogyo Co., Ltd. References JP-A-60-74600 (JP, A) JP-A-57-134999 (JP, A) JP-A-50-30056 (JP, A) JP-A-1-274497 (JP, A) 60-49693 (JP, U) Fully open Showa 18-182098 (JP, U) Fully open Showa 55-64152 (JP, U) Really open Showa 58-69974 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 9/00

Claims (3)

(57) [Claims] An electronic circuit portion on a printed circuit board is arranged inside a metal case serving as a shield.
And the print distribution in a gap formed in the metal case.
Arrange the drawing part of the wire substrate and through this drawing part
Connect the wiring lead and ground lead outside the metal case.
To the inside of the metal case with respect to the gap.
A chip capacitor is mounted beside and between the wiring lead and the ground lead , and the metal case and the ground lead are connected to the lead- out portion on the printed wiring board .
The metal case and the ground lead are electrically connected
Electronic circuit module apparatus characterized by being connected. 2. A metal case serving as a shield ,
Front ground lead on the front and rear ground lead on the back
Circuit on Multi-layer Printed Wiring Board with PCB
Place the part in front of the gap formed in the metal case
Place the drawer part of the printed wiring board and draw out
Wiring lead, surface ground lead and
And ground lead on the outside of the metal case
And near the inside of the metal case with respect to the gap and
The wiring lead and the surface ground lead or the
A chip capacitor is mounted between the ground leads on the back.
Through the signal leads inside and outside the metal case.
The front ground lead and the rear ground
Signal wiring is provided between the lands lead in lead portion from the metal case of the printed wiring board to the outside, before Symbol surface ground Lee of the printed circuit board
It characterized in that de and the backside ground leads are directly electrically connected to the metal case electronic circuit module device. 3. The method according to claim 1 , wherein the width of the printed wiring board is the same as that of the metal.
It is narrow near the drawer inside the case
In the printed wiring board outside the metal case,
The width of the printed wiring board in the vicinity of the lead portion
Is the printed wiring board that has moved away from the drawer portion.
3. The electronic circuit module device according to claim 1 , wherein the width is smaller than the width of the plate .