JPH0632716Y2 - Electronic device shield structure - Google Patents

Description

[Detailed Description of the Invention] [Outline] Regarding a shield structure of an electronic device for preventing radio wave leakage in external connection, a connector for external connection is provided for the purpose of reducing the number of parts and connecting steps and enhancing the radio wave reducing effect. The jack is fixed to a metal housing with a two-layer printed board interposed, and the connector jack and the metal housing are respectively connected to the two-layer printed surfaces of the two-layer printed board to generate from an electronic device. The high frequency signal is bypassed from the connector jack to the metal casing through the two-layer printed board.

[Industrial application field]

The present invention relates to a shield structure for an electronic device that prevents electric wave leakage in external connection.

In the external connection of electronic equipment, the high frequency signal generated from the electronic equipment is transmitted to the coaxial cable connected via the connector, and unnecessary radio waves leak from the coaxial cable to the outside, so bypass between the connector jack and the housing. I connected a capacitor and let the high frequency signal escape to the case side,
It requires a man-hour for connecting the bypass capacitor, and lead inductance is generated in the lead element used for connecting the bypass capacitor to reduce the bypass effect.Therefore, it is desirable to reduce the man-hour for connecting and to provide a shield structure for electronic devices with a high radio wave reducing effect. ing.

[Conventional technology]

Conventionally, in a shield structure of an electronic device, as shown in FIG. 4, a connector jack 10 is attached to a housing 20 with a mounting plate 40, and further, the connector jack 10 and the housing 20 are attached.
This is done by connecting a bypass capacitor 30 between them and letting a high-frequency signal escape to the housing side.

[Problems to be solved by the device]

However, since the bypass capacitor 30 is connected to the connector jack 10 and the housing 20 by the read element 50, the man-hours for connecting the bypass capacitor 30 are added to the attachment of the connector jack 10, which lowers the productivity and also the read element. 50 has a drawback that a lead inductance is generated and the impedance increases in proportion to the frequency, so that the bypass effect of the high frequency signal is reduced.

[Means for Solving the Problems]

The present invention will be described with reference to FIGS. 1 and 2 corresponding to the embodiment. By fixing a connector jack 1 for external connection to a metal housing 2 via a two-layer printed board 3, it is possible to fix it. At the same time, the connector jack 1 and the metal casing 2 are connected to the two-layer printed surfaces 31 and 32 formed on both sides of the two-layer printed board 3 respectively, and the high frequency signal generated from the electronic device 4 is transmitted from the connector jack 1 from the connector jack 1. It is configured to bypass the metal casing 2 through the two-layer printed board 3.

[Action]

Based on the above configuration, in the present invention, the connector jack 1 and the metal housing 2 are connected to each other via the two-layer printed board 3. The two-layer printed board 3 has a printed surface 31 on which a conductor is printed, Since 32 is opposed to two layers at a predetermined interval, it has a bypass effect for a high frequency signal like a capacitor.

Therefore, since the two-layer printed board 3 serves as both the mounting plate member of the connector jack 1 and the capacitor member for bypassing the high frequency signal, the man-hours for connecting the bypass capacitor are not required as in the conventional case, and the bypass effect is obtained by the lead element. It is possible to enhance the radio wave reduction effect without decreasing.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

As shown in FIGS. 1 and 2, the connector jack 1 is fixed to the tip of the connection cable 41 of the electronic device 4, and is integrally formed from the periphery of the terminal 11 for external connection to form a two-layer printed board. A mounting flange portion 12 for mounting to 3 is formed so as to project.

The two-layer printed board 3 to which the connector jack 1 is attached has a printed surface 31 in which conductors are printed on both surfaces of the insulating board 33.
And 32 are formed, and a through hole 34 for the terminal 11 of the connector jack 1 is formed in the central portion, and a print on the opposite side of the print surface 31 to which the mounting flange portion 12 of the connector jack 1 is joined. On the surface 32, the conductor around the through hole 34 is peeled off to form the insulating portion 35, and the terminal 11
The two-layer printed surfaces 31 and 32 are not connected to each other via the or mounting screw 13.

The mounting flange portion 12 of the connector jack 1 was joined to the printed surface 31 and screwed with the mounting screw 13.
The layer printed board 3 is joined with the other printed surface 32 to the metal housing 2 with screws, and the terminals 11 are projected outward from the openings 21 of the metal housing 2 to form a connector jack for external connection. 1 is attached to a metal housing 2.

When the electronic device 4 is connected to the outside by connecting the connector jack 1 attached in this way to the connector plug 6 fixed to the tip of the coaxial cable 5 for external connection, the high frequency generated by the electronic device 4 is generated. The signal is
Although it reaches the connector jack 1 through the connection cable 41 on the electronic device side, the connector jack 1 is connected to the connector plug 6 from the terminal 11, and at the same time, the mounting flange portion 12 and the metal layer via the two-layer printed board 3. Case 2
Since the two-layer printed circuit board 3 has a bypass effect on the high-frequency component like the capacitor, the high-frequency signal generated from the electronic device 4 passes from the connector jack 1 through the two-layer printed circuit board 3 to the metal casing. Bypassing to 2, the high-frequency signal is prevented from leaking to the connector plug 6 side, and the radio wave radiated from the external connection coaxial cable is cut.

FIG. 3 (a) shows the relationship between the frequency and the amount of attenuation of radiated radio waves according to an embodiment of the present invention, and FIG. 3 (b) shows a conventional example in which a bypass capacitor of 4700 pF has 15 mm each at both ends. It shows the amount of attenuation of radiated radio waves when a lead element is connected.As shown in the figure,
In the embodiment of the present invention, there is no reduction in the amount of attenuation in the high frequency part due to the read element, and a high attenuation effect is recognized in a wide range.

[Effect of device]

As is clear from the above description, according to the shield structure of the electronic device according to the present invention, the shield structure is configured by fixing the connector jack to the metal casing via the two-layer printed board, so that the bypass structure is achieved. There is no need to connect a capacitor or shield the cable, which reduces the number of parts and the number of connection steps to improve productivity, and also eliminates the reduction of the bypass effect for high frequency signals due to the read element, thus eliminating high frequency components. A large reduction effect can be achieved over a wide range.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a perspective view showing a connector jack and a two-layer printed board, and FIG. 3 (a) shows an attenuation amount of radiated radio waves according to the embodiment of the present invention. FIG. 3 (b) is a diagram showing the attenuation of radiated radio waves according to the conventional example, and FIG. 4 is a sectional view showing the conventional example. In the figure, 1 is a connector jack, 2 is a metal casing, 3 is a two-layer printed board, 31 and 32 are printed surfaces, and 4 is an electronic device.

Claims (1)

[Scope of utility model registration request] 1. A connector jack (1) for external connection is fixed to a metal casing (2) with a two-layer printed board (3) interposed, and a two-layer printed surface of the two-layer printed board. The connector jack (1) and the metal housing (2) are connected to (31) and (32), respectively, and a high-frequency signal generated from an electronic device (4) is fed from the connector jack (1) to the metal housing. A shield structure for electronic equipment, characterized in that the two-layer printed board (3) is bypassed to (2).