JPH06275976A - Electronic circuit module device - Google Patents

Abstract

PURPOSE:To provide an electronic circuit module device which is mounted with parts densely, simple in constitution, provided with an external electrical connection lead, easily connected, small in size, low in cost, and lessened in unnecessary radiation. CONSTITUTION:A printed wiring board (3 or 7) mounted with electronic parts is arranged inside a metal case composed of a case upper lid 1 and a lower lid 2, and a part of the printed wiring board is led out of the metal case to serve as an external connecting means. A bypass capacitor 5C is provided adjacent to the lead-out part of the printed wiring board, or a signal line is arranged in a multilayered board inner layer of the lead-out part, whereby the leakage of electromagnetic waves is reduced to an irreducible minimum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit module device used for constructing a unit having functions such as amplification, oscillation, control and a combination thereof.

[0002]

2. Description of the Related Art In recent years, electronic circuit module devices have been widely used in various fields for the purpose of modularizing each function and facilitating the configuration of the electronic device itself, as electronic devices have become more sophisticated.
Many are used. At that time, electronic devices are actively being reduced in size and weight, and accordingly, there is a strong demand for miniaturization of electronic circuit module devices. In response to this demand, components are mounted at high density and their applications are diversifying. As an example thereof, an electronic circuit module device to be mounted on a movable part such as an optical head of an optical disk device has been required. A high-frequency oscillation circuit is built in this electronic circuit module device, and it is particularly necessary to minimize the leakage of electromagnetic waves.

FIG. 4 is a diagram showing the configuration of a conventional electronic circuit module device, FIG. 4 (a) is a perspective view, and FIG. 4 (b) is FIG.
Cross-sectional view of the double-sided mounting printed wiring board of (a), FIG.
FIG. 4C is a sectional view of the single-sided double-sided printed wiring board of FIG.

In FIGS. 4 (a), 4 (b) and 4 (c), 1 is an upper case lid, 2 is a lower case lid, 3 is a double-sided printed wiring board, 4 is a feedthrough capacitor, 5 is an electronic component, and 6 is solder. The attachment portion 7 is a single-sided mounting double-sided printed wiring board, and this electronic circuit module device is configured as follows.

The metal case consisting of the case upper lid 1 and the case lower lid 2 prevents the electromagnetic waves from the outside from affecting the internal electronic circuits, or prevents the electromagnetic waves generated in the internal electronic circuits from leaking to the outside. As a shield. Therefore, it is usually made of metal.

As shown in FIG. 4 (c), the electronic component 5 is usually mounted on a single-sided mounting double-sided printed wiring board 7 whose back surface is soldered to a case and grounded, but is made smaller. Therefore, as shown in FIG. 4B, the electronic components 5 are mounted on the front and back surfaces of the double-sided printed wiring board 3. The material of the substrate is a rigid material such as glass epoxy.

The feed-through capacitor 4 functions as a bypass lead in order to prevent electromagnetic waves from entering and leaking from the lead lead-out portion and to enhance the shield effect, and also has a role of lead-out lead. Usually, the wiring of the external electronic circuit is soldered to the outer lead of the feedthrough capacitor 4. In particular, in the case of an electronic circuit module device mounted on a movable part such as an optical head of an optical disk device, a flexible printed circuit board is often soldered to the lead terminal of the feedthrough capacitor.

As described above, an electronic circuit having a specific function is unitized, and a desired characteristic can be obtained only by supplying a constant power supply voltage from the device side.

Further, a microminiature feedthrough capacitor is used in an electronic circuit module device mounted on an optical head of an optical disk device.

[0010]

However, in the above-mentioned conventional configuration, since a plurality of feedthrough capacitors are used, even if an ultra-compact one is used, the space occupied by the feedthrough capacitors is large and the electronic circuit module device is small. It had the drawback that it could not be converted. Further, this feedthrough capacitor is difficult to be automatically mounted by a machine, is difficult to manufacture as compared with other electronic parts, and is expensive.
Moreover, since it is difficult to secure the positional accuracy of the terminals of the feedthrough capacitor, there is a drawback that the bondability with the lead wiring of other electronic circuit boards, flexible printed boards, etc. is poor.

In view of the above-mentioned drawbacks, the present invention enables downsizing of an electronic circuit module device, has a circuit configuration without using a feedthrough capacitor, has high jointability with other electronic circuits, and has an electromagnetic wave to the outside. An object is to provide an electronic circuit module device in which leakage is sufficiently suppressed.

[0012]

In order to solve the above problems, in the electronic circuit module device of the present invention, a printed wiring board arranged inside a metal case serving as a shield is drawn out to the outside of the metal case. A chip capacitor is mounted between the external wiring lead and the ground lead on the inside of the printed wiring board near the gap of the drawn portion, and the ground lead on the printed wiring board has the metal case at the drawn portion. It is characterized by being directly electrically connected to.

Further, in the multilayer printed wiring board having three or more layers using the wiring board, one or more layers inside the printed wiring board are provided in the vicinity of the gap between the drawn-out portions of the metal case which functions as a shield. A signal line other than the ground line of the printed wiring board is wired in a part thereof, and the ground lead on the printed wiring board is connected to the metal case at a portion of the printed wiring board extending from the metal case to the outside. Is directly electrically connected to.

Further, a printed wiring board having three or more layers is used, and a signal line is wired in a part of one or more layers inside thereof.
By providing a ground region or a ground layer on the outer mounting surface or on the outer layer to form a pseudo feedthrough capacitor structure, a means for further preventing the influence of electromagnetic waves to the outside is provided.

[0015]

According to the present invention, unlike the conventional electronic circuit module device, a feed-through capacitor is not used, and a bypass circuit with a smaller chip capacitor is provided, so that the influence of electromagnetic waves from the outside or to the outside is provided. Prevent
Moreover, since the space can be reduced, the electronic circuit module device can be further downsized.

Since all the electronic components thus mounted can be automatically mounted, production at low cost becomes possible. In addition, since the terminal position can be determined with high accuracy, the bondability with an external electronic circuit is high. Further, with respect to the invasion and leakage of electromagnetic waves, a shield effect equal to or higher than that when a feedthrough capacitor is used can be obtained. Therefore, it is possible to realize an electronic circuit module device that is inexpensive, compact, and has good performance.

[0017]

1 is a block diagram of an electronic circuit module device according to a first embodiment of the present invention. FIG. 1A is a perspective view of an electronic circuit module device using a single-sided mounting double-sided printed wiring board 7, and FIG. 1B is a double-sided mounting printed wiring board 3.
It is a perspective view of an electronic circuit module device using.

In the figure, the same components and parts as in FIG. 4 are designated by the same reference numerals, and the description thereof will be omitted. 1 (a) and 1 (b), 8 is a plug portion used for connection with an external electronic circuit, and 9 is a soldering shield portion.

FIG. 1 (c) is a plan view showing the component structure and the printed wiring board (3 or 7) in the vicinity of the drawn-out portion of the electronic circuit module device shown in FIGS. 1 (a) and 1 (b).

Printed wiring board on which electronic component 5 is mounted
(3 or 7) is arranged in a metal case shielded by the case upper lid 1 and the case lower lid 2. Then, the connection leads (signal line S, ground line G) to the external circuit (not shown) are drawn out from the gap g between the case upper cover 1 and the case lower cover 2, and the vicinity of the extending part to the external circuit part inside the metal case. By bypassing between the signal line S and the ground line G via the chip capacitor 5C, the high-frequency component that is placed on the signal line S and tends to go out of the metal case is removed. Further, in order to prevent the electromagnetic waves existing in the space inside the metal case from leaking to the outside from the gap of the metal case, the soldering shield part 9 is provided on the external drawing part of the printed wiring board (3 or 7) by soldering. .

With such a structure, miniaturization is possible without using a feedthrough capacitor as in the conventional case,
Moreover, it is possible to prevent the electromagnetic wave from leaking from the oscillation circuit mounted on the printed wiring board to the external circuit, and prevent the electromagnetic wave from entering the printed wiring board from the external circuit.

FIG. 2 is a block diagram of an electronic circuit module device according to a second embodiment of the present invention, in which a double-sided mounting multilayer wiring board is used. 2 (a) is a plan view showing a component structure and a double-sided mounting multilayer wiring board in the vicinity of the drawn-out portion of the electronic circuit module device, and FIG. 2 (b) is a sectional view of FIG. 2 (a).

In the figure, the same components and parts as those in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. 2A and 2B, 10 is a signal line through hole, 11 is a ground line through hole, 12 is a surface ground wiring on the surface, and 12 '.
Is a front surface ground wiring, 13 is a front signal wiring, 14 is a plug signal wiring, 15 is an inner layer signal wiring, 16 is an inner ground wiring, and 17 is a plug ground wiring.

This embodiment is similar to the first embodiment shown in FIG.
The double-sided mounting multilayer wiring board on which the electronic component 5 is mounted is arranged in a metal case shielded by a case upper lid 1 and a case lower lid 2. Then, a connection lead to an external circuit (not shown) is drawn out from the gap g between the case upper lid 1 and the case lower lid 2.

That is, as shown in FIG. 2B, the surface ground wiring 12 on the front surface and the surface ground wiring 12 'on the back surface are connected to the metal case from at least one of the front surface and the back surface of the double-sided mounting multilayer wiring board. The plug signal line wiring 14 is drawn out from the gap g between the case upper lid 1 and the case lower lid 2, and the double-sided mounting multi-layer wiring via the signal line through hole 10 in the vicinity of the board drawing portion of the case upper lid 1 of the metal case. As shown in FIG. 2 (b), the surface of the plug part ground is taken out of the metal case through the signal line wiring 15 in the inner layer of the double-sided mounting multilayer wiring board as shown in FIG. 2 (b). It is connected to the line wiring 17.

Further, in order to prevent the electromagnetic waves existing in the space inside the metal case from leaking to the outside from the gap g of the metal case, the surface ground wirings 12 and 12 on the front and rear surfaces of the external lead-out portion of the printed wiring board are soldered. The soldering shield parts 9 are respectively provided on a part of ′. In addition, in order to remove the high frequency components that are leaked to the outside by being placed on the signal line wiring 15 of the inner layer, the signal line wiring 15 is provided on the front and back surface ground wirings.
The sandwiched structure of 12 and 12 'has the same effect as a feedthrough capacitor.

Further, as shown in FIG. 2 (b), by removing at least two layers in the structure in which the brand line wiring 16 of the inner layer is sandwiched by the signal line wiring 15 inside the double-sided mounting multilayer wiring board, the high frequency component is removed. A structure that enhances the effect may be used.

With the above-mentioned structure, it is small and can be automatically mounted, and the leakage of electromagnetic waves can be reduced.

FIG. 3 is a plan view showing the structure of an electronic circuit module device according to a third embodiment of the present invention, in which the same components and parts as those in FIGS. 1 and 2 are designated by the same reference numerals. The description is omitted.

The basic structure is the same as that of the first and second embodiments of the present invention. The difference is that the width of the printed wiring board of the external lead-out portion is wider inside the metal case near the lead-out portion from the metal case than outside the metal case. In order to prevent the electromagnetic waves existing in the space inside the metal case from leaking to the outside from the gap g of the metal case, a soldering shield part 9 is provided on a part of the surface ground wire 12 of the external drawing part of the printed wiring board by soldering. Are the same. By narrowing the width of the printed wiring board at the lead-out portion and pulling it out to the outside, leakage of electromagnetic waves from the gap between the cases is more firmly prevented.

With the above-mentioned structure, it is small and can be automatically mounted, and the leakage of electromagnetic waves can be reduced.

[0032]

As described above, according to the electronic circuit module device of the present invention, the structure of the electronic circuit module device in which the components are densely mounted is easy, and at the same time, the electrical connection leads to the outside are provided. It has an easy connection, is small in size, low in cost, and can reduce unnecessary radiation.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic circuit module device according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of an electronic circuit module device according to a second embodiment of the present invention.

FIG. 3 is a configuration diagram of an electronic circuit module device according to a third embodiment of the present invention.

FIG. 4 is a composition of a conventional electronic circuit module device.

[Explanation of symbols]

1 ... Case upper lid, 2 ... Case lower lid, 3 ... Double-sided mounting printed wiring board, 4 ... Penetrating capacitor, 5 ... Electronic component, 5C ... Chip capacitor, 6 ... Soldering part,
7 ... Single-sided mounting double-sided printed wiring board, 8 ... Plug part,
9 ... Soldering shield part, 10 ... Signal line through hole, 11 ... Signal line through hole, 12 ... Front surface ground wiring, 12 '... Back surface ground wiring, 13 ... Surface signal line wiring, 14 ... Plug part signal Wire wiring, 15… Signal wiring on the inner layer, 16… Ground wiring on the inner layer, 17
… Plug ground wire wiring.

(72) Inventor Hideyuki Nakanishi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electronics Industrial Co., Ltd. (72) Akira Ueno, 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electronics Industrial Co., Ltd.

Claims (3)

[Claims] 1. A wiring to the outside on the printed wiring board inside the vicinity of the gap of the drawn-out portion where the printed wiring board arranged inside the metal case which functions as a shield is drawn out to the outside of the metal case. An electronic circuit module device in which a chip capacitor is mounted between a lead and a ground lead, and the ground lead on the printed wiring board is electrically connected directly to the metal case at the lead-out portion. 2. In a multi-layer printed wiring board comprising three or more layers, the print is formed in a part of one or more layers inside the printed wiring board in the vicinity of a gap of a drawn-out portion of a metal case serving as a shield. A signal line other than the ground line of the wiring board is wired, and the ground lead on the printed wiring board is directly electrically connected to the metal case at a portion of the printed wiring board that extends from the metal case to the outside. The electronic circuit module device according to claim 1, wherein: 3. The width of the printed wiring board inside the metal case that functions as a shield is wider than the width of the printed wiring board in the drawn-out portion near the gap drawn out of the metal case, 3. The electronic circuit module device according to claim 1, wherein the ground lead of the drawn-out portion of the substrate is directly electrically connected to the metal case.