JPS63276233A - Semiconductor device - Google Patents

Abstract

PURPOSE:To improve a yield of bonding by a method wherein the respective sides of a semiconductor chip mounting part are made to have a rounding in a circular-arc shape on the side of internal electrodes and the internal electrodes are extended in a vertical direction to the outside on the peripheries of the mounting part to eliminate the phenomenon of the short-circuit between bonding wires. CONSTITUTION:The outer peripheries of a semiconductor mounting part 2 for mounting a semiconductor chip 5, particularly the central outer peripheries of the respective sides of the placing part 2 are swelled roundly toward the side of internal electrodes 1 to be led out to the outside. The electrodes 1 are extended to the outside nearly vertically to the outer peripheries of the mounting part 2. For this, the directions of bonding wires 4 for connecting semiconductor chip connection parts 3 with the electrodes 1 become nearly the same as those of the electrodes 1. Whereupon, the phenomenon of the short-circuit between a wire 4 and an electrode 1 adjacent to the electrode 1 to be connected with the wire 4 is eliminated. Thereby, a yield of bonding is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly to a semiconductor device having internal electrodes extending outside around a semiconductor chip mounting portion.

[Conventional technology]

Conventionally, in this type of semiconductor device, the shape of the semiconductor device section for mounting the semiconductor chip is square or rectangular, and the semiconductor device section has an internal electrode extending to the outside around the square, and the semiconductor chip connection section on the semiconductor chip side has an internal electrode extending outside. FIG. 5 is a plan view of a semiconductor device showing an example of such a conventional semiconductor device, and FIG. 6 is an enlarged view of part 0 shown in FIG. .

As shown in FIG. 5, this semiconductor device has a semiconductor chip 5 placed in the center of a ceramic package 6 in which internal electrodes 1 are formed.
A semiconductor chip mounting section 2 is provided as an area for mounting a semiconductor chip 5, and a semiconductor chip connection section 3 of a semiconductor chip 5 and an internal electrode 1 are connected by a bonding wire 4.

Further, as can be seen from the enlarged view of part C shown in FIG. 6, the angle between the bonding wire 4 and the internal mold i1 became smaller as it went to the peripheral corners of the chip compared to the central part of the periphery.

[Problem that the invention seeks to solve]

In the above-described semiconductor device, the semiconductor chip mounting portion has a square or rectangular shape, and internal electrodes extend outward from the periphery thereof. Therefore, when connecting the semiconductor chip connection part and the internal electrodes with bonding wires, the bonding wires and the adjacent internal electrodes may short-circuit because the directions of the bonding wires and the internal electrodes are different, especially near the four corners of the ceramic case. However, there was a drawback that the yield in the bonding process was reduced.

An object of the present invention is to provide a semiconductor device that does not cause a short circuit phenomenon between such a bonding wire and an internal electrode other than the internal electrode to be connected to the bonding wire, and also does not cause a short circuit phenomenon between the bonding wires. There is a particular thing.

[Means for solving problems]

In the semiconductor device of the present invention, the outer periphery of a semiconductor chip mounting portion on which a semiconductor chip is mounted is formed to have a substantial bulge toward the internal electrode side, and the internal electrode is formed with respect to the outer periphery of the semiconductor chip mounting portion. and is configured to extend outward approximately vertically. Thereby, the direction of the internal electrodes and the direction of the bonding wire can be made substantially the same.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a semiconductor device showing a first embodiment of the present invention, and FIG. 2 is an enlarged view of section A shown in FIG. 1.

As shown in FIG. 1, the outer periphery of the semiconductor chip mounting part 2 on which the semiconductor chip 5 is mounted has a central outer periphery that bulges out toward the internal electrode 1 leading out to the outside, and along this bulge and approximately relative to the outer periphery. The internal electrodes 1 extend outward in the vertical direction. Therefore, the directions of the bonding wire 4 that connects the semiconductor chip connection portion 3 and the internal electrode 1 and the internal electrode 1 are substantially the same. Note that 6 is a ceramic package having internal electrodes 1.

Furthermore, as shown in FIG. 2, since the directions of the bonding wire 4 and the internal electrode 1 are almost the same,
A short circuit phenomenon between the internal electrode 1 adjacent to the internal electrode to be connected to the bonding wire 4 is eliminated. This is because the four corners of the ceramic package 6 were conventionally open, but in this embodiment, the spaces and arrangement of the internal electrodes 1 are changed by utilizing these corners.

3 is a plan view of a semiconductor device showing a second embodiment of the present invention, and FIG. 4 is an enlarged view of section B shown in FIG. 3.

As shown in FIGS. 3 and 4, the semiconductor device of this embodiment has a semiconductor chip mounting portion 2 on a ceramic package 6.
This embodiment differs from the first embodiment in that the shape is changed from a rounded shape to a ten-triangular shape. As described in the first embodiment, in order to prevent short circuit between the bonding wire 4 and the internal electrode 1 adjacent to the internal electrode to be connected, the shape of the semiconductor chip mounting portion 2 is bulged toward the internal electrode 1 side. In addition, the bonding wire 4 and the internal electrode 1 are oriented in substantially the same direction. However, in this first embodiment, the directions of the bonding wires 4 and the internal electrodes 1 near the four corners of the ceramic case 6 are still insufficient. Therefore, in this second embodiment, by making the semiconductor chip mounting part 2 into a ten triangular shape, the directions of the bonding wires 4 at the four corners and the internal electrodes 1 are the same, thereby preventing short circuits near the four corners of the ceramic case 6. This is to eliminate the phenomenon.

〔Effect of the invention〕

As explained above, the present invention provides a structure in which each side of the semiconductor chip mounting portion is curved toward the internal electrode side (either rounded or expanded into a polygonal shape such as a dodecagon), and the periphery thereof is perpendicular to the outside. By forming the internal electrodes by extending them in the direction, the direction of the bonding wire connecting between the semiconductor chip connection part and the internal electrodes can be made almost the same as the direction of the internal electrodes. This has the effect that it is possible to eliminate short-circuit phenomena between internal electrodes and adjacent internal electrodes, and that bonding yield can be improved.

[Brief Description of the Drawings] Fig. 1 is a plan view of a semiconductor device showing a first embodiment of the present invention, Fig. 2 is an enlarged view of section A in Fig. 1, and Fig. 3 is a plan view of a semiconductor device showing a first embodiment of the present invention. 4 is an enlarged view of section B in FIG. 3, FIG. 5 is a plan view of a semiconductor device showing a conventional example, and FIG. 6 is an enlarged view of section 0 in FIG. 5. It is an enlarged view of. DESCRIPTION OF SYMBOLS 1... Internal electrode, 2... Semiconductor chip mounting part, 3...
... Semiconductor chip connection portion, 4... Bonding wire, 5... Semiconductor chip, 6... Ceramic package. 1st 7, -5 thousand 5I21 early 6th

Claims (1)

[Claims] In a semiconductor device in which an internal electrode leading to the outside is formed around a semiconductor chip mounting part on which a semiconductor chip is mounted, the shape of the semiconductor chip mounting part is substantially bulged toward the internal electrode side. and the internal electrodes are arranged substantially perpendicularly to the outer periphery of the semiconductor chip mounting section.