JPH06252328A - Lead frame for mounting semiconductor element - Google Patents

Abstract

PURPOSE:To provide the title lead frame for mounting semiconductor element, miniaturized and excellent in electrode characteristics. CONSTITUTION:A bus bar 11 for gland is provided outside the part along a die pad 2 inside a lead 3. Besides, hanging pins 10 electrically connecting to the bus bar 11 for gland is used as the leads for gland. The lead frame 5 can be miniaturized by the spaces of the leads for gland substituted by the hanging pins 10. Besides, the hanging pins 10 electrically connecting to the pad 2 enlarge the gland plane for enhancing the electrical characteristics as the leads for gland. Furthermore, multiple gland electrodes of an IC chip can be electrically connected to the bus bar 11 for gland to reduce the numbers of the leads 3 thereby enabling the lead frame 5 to be miniaturized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame for mounting a semiconductor element.

[0002]

2. Description of the Related Art FIG. 10 is a perspective view of a conventional semiconductor device of a quad flat package type, FIG. 11 is a sectional view taken along the line XI-XI of FIG. 10, and FIG. 12 is a lead of this semiconductor device. It is a top view of the die pad periphery of a frame. In the figure, 1 is an IC chip as a semiconductor element in which an integrated circuit is formed, 2 is an I
A rectangular die pad 3 to which the C chip 1 is attached via an adhesive is a large number of leads provided outside the die pad 2 so as to be orthogonal to the four outer edges of the die pad 2. The lead 3 is an internal lead 3a on the inner end side near the die pad 2 electrically connected to the IC chip 1.
And an outer lead 3b on the outer end side which is bent for connection with an external circuit (not shown). Reference numeral 4 is a hanging pin for connecting the four corners of the die pad 2, which are corners, for supporting the die pad 2.

Reference numeral 5 is a conductive lead frame for mounting the IC chip 1, which is composed of a die pad 2, leads 3 and hanging pins 4. The lead frame 5 is formed by punching a conductive metal plate into a predetermined shape.
The ends of the outer leads 3b of the leads 3 and the outer ends of the hanging pins 4 are initially connected to each other in order to hold the lead frame 5 in a constant shape. The IC chip 1 is mounted on the lead frame 5. After resin sealing,
The outer end portion side of the suspension pin 4 protruding from the connecting portion and the sealing resin 6 is cut by a mold or the like. 6 is IC
Electrode outlet 1a of chip 1 and internal lead 3a of lead 3
A thin metal wire for electrically connecting the ends to each other by a wire bonding method, and 7 is a sealing resin for sealing the IC chip 1, the die pad 2, the inner lead 3a of the lead 3, the hanging pin 4, and the thin metal wire 6.

The semiconductor device configured as described above is manufactured through a die bonding process, a wire bonding process, a resin sealing process, a lead cutting process, a lead bend process, an electrical characteristic inspection process, and the like. By mounting 3b on the circuit board, mounting on the circuit board is performed. After mounting, in this semiconductor device, electric power is supplied from the circuit board side to the IC chip 1 side via leads 3 for a predetermined power source, and at the same time, the circuit board and the IC are connected via leads 3 for a predetermined signal. Signals are exchanged between the chips 1 to operate. Also in this case,
The IC chip 1 through the predetermined ground lead 3
Is grounded.

[0005]

In the above-mentioned conventional semiconductor device, the lead frame 5 has the structure in which the leads 3 and the suspension pins 4 are radially arranged around the die pad 2, so that the electrodes of the IC chip 1 are formed. Due to the increase in the number of leads 3 accompanying the increase in the number of outlets 1a, there is a problem in that the shape becomes large and the entire semiconductor device becomes large. In this case, even if the number of leads 3 increases, it is possible to make the leads 3 thin and arrange them at a small pitch to prevent the lead frame 5 from increasing in size. Since it becomes more difficult to manufacture and implement the device, there are limits to such measures.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a lead frame for mounting a semiconductor element, which is miniaturized and has excellent electrical characteristics. .

[0007]

According to a first aspect of the present invention, a die pad to which a semiconductor element is attached is supported by electrically conductive suspended pins provided at its corners, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected to a ground bus bar that is electrically connected to the semiconductor element outside the lead along the die pad inside the lead. Is provided, and the bus bar for ground and the hanging pin are electrically connected, and the hanging pin is used as a lead for ground.

According to a second aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, a ground bus bar for electrical connection with the semiconductor element is provided outside the lead pad along the inner die pad. The ground bus bar and the hanging pin are electrically connected to each other, and the hanging pin is used as a ground lead, and the semiconductor element is electrically connected to the outside along the ground bus bar inside the lead. A power supply bus bar is provided, and both ends of the power supply bus bar are provided for a pair of power supplies provided near a pair of adjacent hanging pins. Is that which is electrically connected to the over-de.

According to a third aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, a ground bus bar for electrical connection with the semiconductor element is provided outside the lead pad along the inner die pad. The ground bus bar and the hanging pin are electrically connected to each other, and the hanging pin is used as a ground lead, and the semiconductor element is electrically connected to the outside along the ground bus bar inside the lead. A power supply bus bar is provided, and both ends of the power supply bus bar are provided for a pair of power supplies provided near a pair of adjacent hanging pins. Electrically bonded to the over-de, and is to have successively lowered toward the die pad side the vertical position of the ground bus bar and the power bus bar from the lead.

According to a fourth aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used as a ground lead. That is what I use.

According to a fifth aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used as a ground lead. That is, the groove is formed around the semiconductor element of the die pad.

According to a sixth aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used as a ground lead. A power supply bus bar that is electrically connected to the semiconductor element is provided outside the lead along the die pad inside, and both ends of the power supply bus bar are connected to a pair of adjacent hanging pins. That is, it is electrically connected to a pair of power supply leads provided in the vicinity.

According to a seventh aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used as a ground lead. A power supply bus bar that is used for electrical connection with the semiconductor element is provided along the die pad inside the lead, and both ends of the power supply bus bar are adjacent to a pair of adjacent hanging pins. Electrically connected to a pair of power supply leads provided in
In addition, the vertical positions of the outer edges of the power supply bus bar and the die pad are sequentially lowered from the lead toward the semiconductor element side.

According to an eighth aspect of the present invention, a die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at the corners of the die pad, and an electrical connection with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used as a ground lead. A bus bar for power supply and a bus bar for power supply, which are electrically connected to the semiconductor element, are provided on the outside along the die pad inside the lead, and both ends of the bus bar for ground and power supply bus bar are used. Section is provided near the pair of air suspension pins that are adjacent to each other. Each de is that they are electrically connected.

[0015]

In the first aspect of the present invention, since the hanging pins provided at the corners of the die pad are used as the ground leads, the number of leads can be increased without changing the overall size of the lead frame. You can Further, since the ground bus bar provided so as to surround the die pad is electrically connected to the hanging pins, the semiconductor element and the hanging pins are electrically connected by electrically connecting the semiconductor element and the ground bus bar. Electrical connection can be made, and these electrical connections can be facilitated. further,
This ground busbar can be electrically connected to a large number of ground electrode outlets of the semiconductor element, and the number of ground leads can be reduced accordingly, and the suspended pins can be electrically connected to the die pad. Since they are connected, the ground plane can be widened correspondingly, and the electrical characteristics of the suspended pins as ground leads can be improved.

Further, in the second invention of the present invention, in the case of the first invention, a pair of power supply leads provided in the vicinity of a pair of adjacent hanging pins are provided along the ground bus bar. Since they are electrically connected by the power supply bus bar, it becomes possible to electrically connect between a large number of power supply electrode outlets of the semiconductor element and the pair of power supply leads via the power supply bus bar. The number of power supply leads of the lead frame can be reduced.

Further, in the third invention of the present invention, in the case of the second invention, the vertical positions of the ground busbar and the power busbar are sequentially lowered from the lead toward the die pad side. When electrically connecting the lead, the semiconductor element, and the power source bus bar with a metal thin wire or the like, it is possible to effectively prevent the metal thin wire or the like from coming into contact with the ground bus bar or the power source bus bar.

Further, in the fourth invention of the present invention, similarly to the first invention, the suspension pins provided at the corners of the die pad are used as the ground leads. However, the electrical connection between the suspension pins and the semiconductor element is made. The connection is made by electrically connecting the semiconductor element and the die pad. Therefore, in the fourth aspect of the invention, the same operation as in the first aspect of the invention can be achieved without the ground bus bar.

Further, in a fifth aspect of the present invention, in the case of the fourth aspect, a groove is formed around the semiconductor element of the die pad, and the adhesive for the semiconductor element to the die pad serves to electrically connect the semiconductor element of the die pad to the electrical element. So that it does not flow out to the physical connection.

Further, in the sixth invention of the present invention, in the case of the fourth invention, a pair of power supply leads provided in the vicinity of a pair of adjacent hanging pins are provided for power supply provided along the die pad. Since they are electrically connected by the bus bar, it becomes possible to electrically connect between the power source electrode outlets of the semiconductor element and the pair of power source leads through the power source bus bar, and the lead frame is accordingly connected. It is possible to reduce the number of power supply leads.

Further, in the seventh invention of the present invention, in the case of the sixth invention, the vertical positions of the outer edge portions of the power supply bus bar and the die pad are sequentially lowered from the lead toward the semiconductor element side. When the semiconductor element and the suspension pin are electrically connected to each other and the semiconductor element and the power source bus bar are electrically connected to each other by a metal thin wire, it is possible to effectively prevent the metal thin wire 6 from contacting the power source bus bar and the outer edge portion of the die pad in the middle. .

Further, in the eighth invention of the present invention, in the case of the fourth invention, each pair of ground and power supply leads provided in the vicinity of a pair of adjacent hanging pins is provided along the die pad. Since they are electrically connected by the ground bus bar and the power bus bar provided, a large number of ground and power electrode outlets of the semiconductor element and the pair of grounds are provided through the ground and power bus bars. It is possible to electrically connect the power supply lead and the power supply lead, and the number of ground and power supply leads of the lead frame can be reduced accordingly.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. Example 1. FIG. 1 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an embodiment of the first invention of the present invention. In the figure, the same or corresponding parts as those of the semiconductor device shown in FIGS. 10 to 12 are designated by the same reference numerals and the description thereof will be omitted.

In the figure, 10 is a conductive suspended pin that is attached to the four corners of the die pad 2, supports the die pad 2 and also functions as a lead. This hanging pin 10 is electrically connected to the die pad 2.
A slanted arm portion 10a that is mechanically connected and a lead portion 10 that is divided into two forks extending in parallel to the lead 3 on the outer end side thereof.
b and. The lead portions 10b parallel to each other of the pair of adjacent hanging pins 10 are arranged on both end sides of the group of leads 3 facing one outer edge of the die pad 2, and the outer end portions protruding from the sealing resin are Lead 3
Is bent into the same shape as the external lead 3b.

Reference numeral 11 denotes a ground bus bar which is arranged along the outer edge of the die pad 2 inside the lead 3 so as to surround the die pad 2. Both ends of the ground bus bar 11 are electrically connected to the arm portions 10a of the pair of air suspension pins 10 adjacent to each other, and the ground electrode take-out port 1a of the IC chip 1 and the thin metal wire 6 are interposed. It is electrically connected. The lead frame 5 includes the die pad 2, the leads 3, and the hanging pins 10.
And the ground bus bar 11, which are formed by punching or etching a conductive metal plate.

Next, the operation of the suspension pin 10 and the ground bus bar 11 will be described. The IC chip 1 is provided with a plurality of ground electrode outlets 1a, and it is necessary to electrically connect the ground electrode outlets 1a to the plurality of leads 3 by the thin metal wires 6. On the other hand, the air suspension pins 10 are attached to the four corners of the die pad 2 to hold the die pad 2. However, since the air suspension pins 10 each have two lead portions 10b, they are attached to each other. If used as ground leads, a total of eight ground leads can be obtained. Therefore, eight leads can be added to the lead frame 5 having the same size, and the lead frame 5 and the semiconductor device can be downsized accordingly. In this case, each hanging pin 10 is electrically connected to the die pad 2, and since the die pad 2 itself is also a part of the ground lead, the ground plane can be made large and the hanging pin 10 can be used. It is possible to improve the electrical characteristics of the ground lead.

In the above case, the lead portions 10b of the suspension pins 10 are arranged at the four corners of the die pad 2 and are located far from the electrode outlets 1a of the IC chip 1, but are electrically connected to the suspension pins 10. Ground bus bar 1
Since 1 is arranged around the die pad 2, the grounding electrode take-out port 1a of the IC chip 1 and the grounding bus bar 11 are electrically connected by the thin metal wire 6, so that the IC chip 1 and the hanging pin are suspended. It is possible to make an electrical connection with the wire 10, and to facilitate wire bonding work for the hanging pin 10. Further, the bus bar 11 for ground has a large number of electrode outlets 1 of the IC chip 1.
It is possible to make an electrical connection with a via the thin metal wire 6, and the number of the grounding leads 3 can be reduced accordingly, and from this point as well, the lead frame 5 can be miniaturized.

In the lead frame 5 shown in FIG. 1, four suspension pins 1 provided at four corners of the die pad 2 are used.
Although all 0 are used as ground leads,
As shown in FIG. 2, only a part of the suspended pins 10 (two suspended pins 10 in this case) may be used as a ground lead.

Here, in the first embodiment, the vertical position of the ground bus bar 11 is located below the internal lead 3a, so that the electrode outlet 1a of the IC chip 1 and the lead 3 are sealed at the time of resin sealing. Even when the metal thin wire 6 connecting the and the wire droops, the metal thin wire 6 can be effectively prevented from coming into contact with the ground bus bar 11.

Example 2. FIG. 3 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an embodiment of the second invention and the third invention of the present invention, and FIG. 4 is a sectional view around the die pad of the lead frame. In the figure, 12 is a ground bus bar 11 inside the lead 3.
Is a bus bar for power supply, which is arranged on the outer side of the power supply electrode and is electrically connected to the electrode outlet 1a for power supply of the IC chip 1 through the thin metal wire 6. The power source bus bar 12 constitutes a part of the lead frame 5, and both ends of the power source bus bar 12 are provided in the vicinity of the parallel lead portions 10b of the pair of air suspension pins 10 adjacent to each other. Electrically connected to. The positions of the power supply bus bar 12 and the ground bus bar 11 in the vertical direction are sequentially lowered from the lead 3 toward the die pad 2 side. The other structure is the same as that of the lead frame 5 and the like of the first embodiment.

The IC chip 1 is provided with a plurality of electrode outlets 1a for power supply as well as a plurality of electrode outlets 1a for ground and input / output signals. The provided power supply bus bar 12 can be electrically connected to a large number of power supply electrode outlets 1a of the IC chip 1 through the thin metal wires 6, and accordingly, the number of power supply leads 3 can be increased. Can be reduced. Therefore, by providing the power source bus bar 12 on the lead frame 5, it is possible to further reduce the size of the lead frame 5.

Further, since the ground bus bar 11 is located below the power supply bus bar 12, when the thin metal wire 6 connecting the IC chip 1 and the power supply bus bar 12 hangs downward during resin sealing or the like. However, the metal thin wire 6 is prevented from coming into contact with the ground bus bar 11. Similarly, since the power supply bus bar 12 is located below the internal lead 3a of the lead 3, the IC chip 1 and the lead 3 are
Even if the thin metal wire 6 connecting to and hangs downward during resin sealing, the thin metal wire 6 is effectively prevented from coming into contact with the power source bus bar 12 and the ground bus bar 11.

Also in the lead frame 5 of the second embodiment, since the hanging pin 10 is used as the ground lead, the same effect as that of the lead frame 5 of the first embodiment can be obtained.

Example 3. FIG. 5 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an embodiment of the fourth invention. In the figure, 13 is an IC
A rectangular die pad to which the chip 1 is bonded,
The die pad 13 is formed to be larger than the die pad 2 of the first embodiment and the like, and is electrically connected to the plurality of ground electrode outlets 1a of the IC chip 1 via the thin metal wires 6. In addition, the lead portions 10b of the four corners of the die pad 13 are electrically and mechanically connected to the suspended pins 10 used as ground leads, and the outer edges of the outer edges of the die pad 13 are orthogonal to the outer edges. Thus, a plurality of leads 3 are provided. In this case, the lead frame 5 is composed of the leads 3, the hanging pins 10 and the die pad 13.

In the lead frame 5 of the third embodiment, the die pad 13 is slightly larger, but it is not necessary to provide the ground bus bar 11 as in the lead frame 5 of the first embodiment, so that the lead frame 5 can be downsized. Can be planned. Further, also in the case of the third embodiment, the hanging pin 10 is used as the ground lead, and the same effect as that of the lead frame 5 of the first embodiment can be obtained. Further, also with respect to the die pad 13 of the third embodiment, since it is possible to electrically connect a large number of the ground electrode outlets 1a of the IC chip 1 through the thin metal wires 6, the ground leads 3 can be connected accordingly. The number can be reduced, and also in this respect, the same effect as that of the lead frame 5 of the first embodiment can be obtained.

Example 4. FIG. 6 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an embodiment of the fifth invention of the present invention. The lead frame 5 of the fourth embodiment is the die pad 1 of the lead frame 5 of the third embodiment.
The groove 14 is provided around the IC chip 1 of No. 3. I
When the C chip 1 is bonded to the die pad 13 (die bonding), the adhesive flows out onto the die pad 13 outside the IC chip 1, and the metal thin wire 6 to the die pad 13
Although it may be difficult to bond with the die pad 13, by providing the groove 14 in the die pad 13, it is possible to prevent the adhesive from flowing out of the groove 14, and thus the die pad 13
It is possible to facilitate the bonding work of the thin metal wire 6 to the. Even in this case, the same effect as that of the lead frame 5 of the third embodiment can be obtained.

In the third and fourth embodiments, the die pad 13 is positioned vertically below the internal leads 3a, so that the IC chip 1 is sealed with the resin when the resin is sealed.
Even if the metal thin wire 6 connecting the electrode outlet 1a and the lead 3 hangs down, it is possible to effectively prevent the metal thin wire 6 from coming into contact with the die pad 13.

Example 5. FIG. 7 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an embodiment of the sixth invention and the seventh invention of the present invention, and FIG. 8 is a sectional view around the die pad of the lead frame. In the figure, 15 is the outer edge portion 1 of the die pad 13 inside the lead 3.
3a is a bus bar for power supply, which is arranged on the outer side along 3a and is electrically connected to the electrode outlet 1a for power supply of the IC chip 1 through the thin metal wire 6. This power bus bar 15
Both ends of are electrically connected to a pair of power supply leads 3 respectively provided in the vicinity of parallel lead portions 10b of a pair of adjacent suspension pins 10.

The outer edge portion 13a of the die pad 13 to which the thin metal wire 6 is bonded is projected upward with respect to the central portion 13b to which the IC chip 1 is bonded.
Power busbar 15 and outer edge portion 13 of die pad 13
The vertical position of a is sequentially lowered from the lead 3 toward the IC chip 1 side. The other structure is the same as that of the lead frame 5 and the like of the third embodiment, and the power source bus bar 15 constitutes a part of the lead frame 5.

In the lead frame 5 of the fifth embodiment, the lead portion 10 of the suspended pin 10 connected to the die pad 13 is used.
Since b is used as the ground lead, the same effect as that of the lead frame 5 of the third embodiment can be obtained, and a pair of power supply leads provided near the pair of air suspension pins 10 adjacent to each other. 3 to die pad 13
Since they are electrically connected by the power source bus bar 15 provided along the outer edge of the IC chip, a large number of power source electrode outlets 1a of the IC chip 1 and the pair of power source electrodes are connected via the power source bus bar 15. It is possible to make electrical connection with the leads 3 through the thin metal wires 6, and the number of leads 3 for power supply of the lead frame 5 can be reduced accordingly. Therefore, it is possible to reduce the size of the lead frame 5 as the number of the leads 3 for the power source decreases.

Further, since the outer edge portion 13a of the die pad 13 is located below the power source bus bar 15, the thin metal wires 6 connected to the power source bus bar 15 and the die pad 1 are connected.
3 is effectively prevented from coming into contact with the outer edge portion 13a, and further,
Since the power supply bus bar 15 is located below the lead 3, the contact between the metal thin wire 6 connected to the lead 3 and the power supply bus bar 15 is effectively prevented. Further, since the central portion 13b of the die pad 13 is located lower than the outer edge portion 13a, the position of the upper surface of the IC chip 1 is also lowered by that amount, and the metal connected between the IC chip 1 and the outer edge portion 13a of the die pad 13 is connected. Contact of the thin wire 6 with the upper end of the IC chip 1 is also effectively prevented.

Further, since the central portion 13b of the die pad 13 is at a position lower than the outer edge portion 13a, the adhesive does not flow out to the outer edge portion 13a when the IC chip 1 is die-bonded, and the wire bonding work is facilitated. .

Example 6. FIG. 9 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an embodiment of the eighth invention of the present invention. In the figure, reference numeral 16 is a ground disposed inside the lead 3 along the outer edge of the die pad 2 and electrically connected to the ground electrode take-out port 1a of the IC chip 1 through the thin metal wire 6. Both ends of this ground bus bar 16 are parallel lead parts 1 of a pair of adjacent suspended pins 10.
0b is electrically connected to a pair of ground leads 3 respectively provided near 0b.

Reference numeral 17 is a ground bus bar 1 inside the lead.
6 is a power source bus bar disposed outside thereof along the line 6 and electrically connected to the electrode outlet 1a for power source of the IC chip 1 via the thin metal wire 6, and both ends of the power source bus bar 17 are It is electrically connected to a pair of power supply leads 3 provided inside the ground lead 3. In addition,
The other structure is the same as that of the lead frame 5 and the like of the third embodiment, and the ground bus bar 16 and the power supply bus bar 17 constitute a part of the lead frame 5.

In the lead frame 5 of the sixth embodiment, the lead portion 10 of the suspended pin 10 connected to the die pad 2 is used.
Since b is used as a ground lead, the same effect as that of the lead frame 5 of the above-described third embodiment can be obtained, and each pair of grounds provided in the vicinity of the pair of adjacent hanging pins 10 for ground. Since the power supply leads 3 and the power supply leads 3 are electrically connected by the ground busbar 16 and the power supply busbar 17 respectively provided along the die pad 2, the IC chip 1 is connected through these.
It is possible to make electrical connection through a metal thin wire 6 between the multiple ground electrode outlets 1a and the multiple power source electrode outlets 1a and the pair of ground and power leads 3 each. The number of ground leads 3 and power supply leads 3 can be reduced. Therefore, since the number of the ground leads 3 and the power supply leads 3 can be reduced, the lead frame 5 can be further downsized.

Here, in the sixth embodiment, the die pad 2, the ground bus bar 16 and the power supply bus bar 1 are used.
If the vertical position of 7 is gradually lowered from the internal lead 3a toward the die pad 2 side, the electrode outlet 1a of the IC pad 1 and the lead 3, the power supply bus bar 17 and the ground bus bar 16 are connected to each other. It is possible to effectively prevent contact between the thin metal wire 6 and the power source bus bar 17, the ground bus bar 16 and the die pad 2.

[0047]

Since the present invention is constituted as described above, it has the following effects.

According to the first aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the conductive suspension pins provided at the corners of the die pad, and the electrical contact with the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element provided with a large number of leads to be connected, a ground bus bar for electrical connection with the semiconductor element is provided outside the lead pad along the inner die pad. Since the ground bus bar and the hanging pin are electrically connected and the hanging pin is used as a ground lead, the lead frame can be miniaturized by using the hanging pin and providing the ground bus bar. At the same time, since the die pad can be used as part of the ground lead, the electrical characteristics of the ground lead are improved. Rukoto can.

According to the second aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the electrically conductive suspended pins provided at the corners of the die pad, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected, a ground bus bar that is electrically connected to the semiconductor element is provided outside the lead along the die pad inside the lead. , The ground bus bar and the suspension pin are electrically connected, and the suspension pin is used as a ground lead, and the semiconductor element is electrically connected to the outside along the ground bus bar inside the lead. A power supply bus bar is provided, and both ends of the power supply bus bar are provided in the vicinity of a pair of adjacent hanging pins. Since electrically connected to the source lead, it is possible to obtain the same effects as the first aspect of the invention, minute in which a power bus bar, can be downsized further leadframe.

According to the third aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the electrically conductive suspended pins provided at the corners of the die pad, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected, a ground bus bar that is electrically connected to the semiconductor element is provided outside the lead along the die pad inside the lead. , The ground bus bar and the suspension pin are electrically connected, and the suspension pin is used as a ground lead, and the semiconductor element is electrically connected to the outside along the ground bus bar inside the lead. A power supply bus bar is provided, and both ends of the power supply bus bar are provided in the vicinity of a pair of adjacent hanging pins. Since it is electrically joined to the source lead and the vertical positions of the ground bus bar and the power bus bar are sequentially lowered from the lead toward the die pad, the same effect as the first invention can be obtained. At the same time, since a step is provided on the ground and power bus bars, it is possible to effectively prevent contact of metal wires or the like with these.

According to the fourth aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the electrically conductive suspended pins provided at the corners of the die pad, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used for grounding. Since it is used as a lead, the size of the lead frame can be reduced by using the suspended pins and the die pad, and the electrical characteristics of the ground lead can be improved because the die pad can be used as a part of the ground lead. be able to. Note that the lead frame can be made smaller than in the case of the first invention because there is no need to provide a ground bus bar.

According to the fifth aspect of the present invention,
Is a die pad to which a semiconductor element is attached is supported by electrically conductive hanging pins provided at the corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, the die pad and the semiconductor element are electrically connected to each other, and the hanging pin electrically connected to the die pad is used as a ground lead, and around the semiconductor element of the die pad. Since the groove is formed, the same effect as the fourth aspect of the invention can be obtained, and since the groove is provided in the die pad, the bonding of the metal thin wire or the like to the die pad can be facilitated.

According to the sixth aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the electrically conductive suspension pins provided at the corners of the die pad, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used for grounding. In addition to being used as leads, a power supply bus bar that is electrically connected to the semiconductor element is provided outside the lead along the die pad inside, and both ends of this power supply bus bar are suspended in a pair of adjacent air suspensions. Since it is electrically connected to the pair of power supply leads provided near the pin, the same effect as the fourth invention can be obtained. The amount provided power bus bar, it can be achieved further miniaturization of the lead frame.

According to the seventh aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the electrically conductive suspended pins provided at the corners of the die pad, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used for grounding. While using as a lead, a power supply bus bar that is electrically connected to the semiconductor element is provided outside the lead along the die pad.
Both ends of this power supply bus bar are electrically connected to a pair of power supply leads provided in the vicinity of a pair of adjacent hanging pins, and the vertical position of the outer edge of the power supply bus bar and the die pad is set from the lead. Since it is gradually lowered toward the semiconductor element side, it is possible to obtain the same effect as that of the sixth aspect of the present invention, and the step is provided on the bus bar for grounding and the power source, so that the contact of the metal thin wire or the like can be effectively performed. It can be prevented.

Further, according to the eighth aspect of the present invention, the die pad to which the semiconductor element is attached is supported by the conductive suspension pins provided at the corners of the die pad, and the semiconductor element is provided outside the die pad. In a lead frame for mounting a semiconductor element, which is provided with a large number of leads that are electrically connected, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used for grounding. In addition to being used as a lead, the vertical position of the outer edge of the die pad is lower than the lead, and the ground bus bar is electrically connected to the semiconductor element outside the lead along the die pad inside the lead. And a power supply bus bar, and connect both ends of the ground bus bar and the power supply bus bar to a pair of adjacent hanging pins. Since each of them is electrically connected to a pair of ground lead and power supply lead provided in the vicinity of, respectively, it is possible to obtain the same effect as that of the fourth aspect of the present invention, and also to use the ground bus bar and the power supply lead. Since the bus bar is provided, the lead frame can be further downsized.

[Brief description of drawings]

FIG. 1 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a first embodiment of the present invention.

FIG. 2 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a modified embodiment of the first embodiment of the present invention.

FIG. 3 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a second embodiment of the present invention.

FIG. 4 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a third embodiment of the present invention.

FIG. 5 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a fourth embodiment of the present invention.

FIG. 6 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a fifth embodiment of the present invention.

FIG. 7 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a sixth embodiment of the present invention.

FIG. 8 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to a seventh embodiment of the present invention.

FIG. 9 is a plan view around a die pad of a lead frame for mounting a semiconductor element according to an eighth embodiment of the present invention.

FIG. 10 is a perspective view showing an example of a conventional semiconductor device.

11 is a sectional view taken along the line XI-XI of FIG.

FIG. 12 is a plan view around a die pad of a lead frame of a conventional semiconductor device.

[Explanation of symbols]

 1 IC chip (semiconductor element) 2 Die pad 3 Lead 5 Lead frame 10 Suspended pin 11 Bus bar for ground 12 Bus bar for power supply 13 Die pad 14 Groove 15 Bus bar for power supply 16 Bus bar for power supply 17 Bus bar for power supply

Claims (8)

[Claims] 1. A die pad to which a semiconductor element is attached is supported by conductive hanging pins provided at its corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, a ground bus bar electrically connected to the semiconductor element is provided outside the lead frame along the die pad inside the lead, and the ground bus bar and the suspension are provided. A lead frame for mounting a semiconductor element, characterized in that the pin is electrically connected and the suspended pin is used as a ground lead. 2. A die pad to which a semiconductor element is attached is supported by electrically conductive hanging pins provided at its corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, a ground bus bar electrically connected to the semiconductor element is provided outside the lead frame along the die pad inside the lead, and the ground bus bar and the suspension are provided. A power supply for electrically connecting the pin and using the suspended pin as a ground lead, and for electrically connecting the semiconductor element to the outside of the lead along the bus bar for ground inside the lead. Bus bar for power supply, and both ends of the bus bar for power supply are provided with a pair of electric wires provided near the pair of adjacent hanging pins. Lead frame for semiconductor device mounting, characterized in that the use leads are electrically connected. 3. A die pad to which a semiconductor element is attached is supported by electrically conductive suspended pins provided at its corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, a ground bus bar electrically connected to the semiconductor element is provided outside the lead frame along the die pad inside the lead, and the ground bus bar and the suspension are provided. A power supply for electrically connecting the pin and using the suspended pin as a ground lead, and for electrically connecting the semiconductor element to the outside of the lead along the bus bar for ground inside the lead. Bus bar for power supply, and both ends of the bus bar for power supply are provided with a pair of electric wires provided near the pair of adjacent hanging pins. A lead frame for mounting a semiconductor element, wherein the lead bus is electrically joined to a semiconductor lead, and the vertical positions of the ground bus bar and the power bus bar are sequentially lowered from the lead toward the die pad side. . 4. A die pad to which a semiconductor element is attached is supported by conductive suspension pins provided at its corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, the die pad and the semiconductor element are electrically connected, and the suspended pin electrically connected to the die pad is used as a ground lead. A lead frame for mounting semiconductor elements. 5. A die pad to which a semiconductor element is attached is supported by conductive hanging pins provided at its corners, and a large number of leads for electrically connecting to the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, the die pad and the semiconductor element are electrically connected to each other, and the hanging pin electrically connected to the die pad is used as a ground lead. A lead frame for mounting a semiconductor element, wherein a groove is formed around the semiconductor element of the die pad. 6. A die pad to which a semiconductor element is attached is supported by electrically conductive suspended pins provided at its corners, and a large number of leads for electrically connecting with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, the die pad and the semiconductor element are electrically connected to each other, and the hanging pin electrically connected to the die pad is used as a ground lead. A power supply bus bar, which is electrically connected to the semiconductor element, is provided on the outside of the lead along the die pad, and both ends of the power supply bus bar are provided in the vicinity of a pair of adjacent hanging pins. A lead frame for mounting a semiconductor element, which is electrically connected to a pair of power supply leads provided. 7. A die pad to which a semiconductor element is attached is supported by electrically conductive suspended pins provided at its corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, the die pad and the semiconductor element are electrically connected to each other, and the hanging pin electrically connected to the die pad is used as a ground lead. A power supply bus bar that is electrically connected to the semiconductor element is provided outside the lead along the die pad, and both ends of the power supply bus bar are provided in the vicinity of a pair of the air suspension pins adjacent to each other. Electrically connected to the pair of power supply leads, and the vertical position of the outer edge of the power supply bus bar and the die pad. Is sequentially lowered from the lead toward the semiconductor element side, a lead frame for mounting a semiconductor element. 8. A die pad to which a semiconductor element is attached is supported by conductive suspended pins provided at its corners, and a large number of leads for electrical connection with the semiconductor element are provided outside the die pad. In a lead frame for mounting a semiconductor element, the die pad and the semiconductor element are electrically connected to each other, and the hanging pin electrically connected to the die pad is used as a ground lead. On the outside of the lead along the die pad,
A ground bus bar and a power bus bar, which are electrically connected to the semiconductor element, respectively, are provided, and both ends of the ground bus bar and the power bus bar are provided in the vicinity of a pair of the hanging pins adjacent to each other. A lead frame for mounting a semiconductor element, which is electrically connected to a pair of the ground lead and the power supply lead, respectively.