JPS63274792A - Production of stamper for optical disk - Google Patents

Abstract

PURPOSE:To obtain a stamper having superior transfer accuracy by forming a pregrouped pattern on a glass substrate and a conductive film of Ni on the pattern, cleaning the film by irradiation with UV and carrying out Ni plating so as to increase the adhesive strength of the resulting plated Ni layer to the conductive film. CONSTITUTION:A resist film of about 1,100Angstrom thickness is formed on the surface of a glass substrate flattened by polishing. After the film is soft-backed at 80 deg.C in a drying furnace, information is recorded with a laser beam cutting machine and the film is developed, well washed, spin-dried and post-baked at 90 deg.C in the drying furnace. Ni is then deposited by sputtering with a sputtering device to form a conductive film of about 700Angstrom thickness. The formed film is irradiated with UV, generated ozone is removed and the film is washed and set in an electroforming device to form a plated Ni layer on the surface of the film. The adhesive strength of the plated Ni layer to the conductive film is increased and a stamper having low defect density and high transfer accuracy is obtd.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing an optical disc standber.

[Summary of the invention]

The present invention provides not only a method for manufacturing a stamper for optical discs, but also
The glass substrate with the pre-group pattern on which the conductive film has been formed is subjected to UV irradiation in a DEEP-UVi equipment to remove dirt and oxide film from the conductive film and modify the surface, and when performing nickel plating, the conductive film is After performing pretreatment to improve the leakage properties, nickel plating is performed to improve the MS properties between the conductive film and the nickel plating, and to improve the transfer accuracy.

[Conventional technology]

Various conventional methods for manufacturing stampers are known. A typical method is to apply and form a 7-photoresist (e.g. AZ-1350) fi on a smooth glass substrate, record information with a laser beam using a cutting machine, and after development, sputtering is applied to the resist-coated glass substrate. A conductive film is formed by a method or a vacuum evaporation method, and nickel plating is performed using this conductive film as a cathode to obtain a nickel plating layer.

This nickel plating layer is used as a stamper.

2 to 5 show the steps of the prior art, and the details are as follows.

Glass substrate 1 with a thickness of approximately 8 mm whose surface has been polished and flattened.
A resist film 2 with a thickness of about 1,000 layers is formed on the film using a spin code method (Figure v52).Next, a laser cutting machine is used to cut the information on the resist film 2. 2 is recorded and further developed to form a pre-group pattern 3 (FIG. 3).Next, nickel is sputtered onto the substrate to a thickness of approximately 700 mm to form a conductive film 4 (
(Fig. 4) Next, the conductive film 4 is immersed in a nickel plating solution as a cathode, electrolyzed, and plated to a thickness of approximately 300 μm!
(FIG. 5) Further, the plating surface is polished to have a uniform thickness. The resist film 2 is removed from the 0th order glass substrate 1 and cleaned to form a stand bar 6. The standby 6 made in this way is used as a mold to make a large number of optical disk substrates, and the standby must have a long lifespan. Good 0m type property. ■High transfer accuracy. etc. are required.

[Problem that the invention seeks to solve]

However, in the above-mentioned conventional technology, the conductive film 4 is plated with nickel to form a plating film, and then this! There is a fact that the defect density increases at the stage of making the standby 6 separated by 11 seconds, and this is due to poor adhesion when sputtering the conductive film 4 and plating with the conductive film 4 as a cathode.
This solves the problem of degrading standby quality.

The present invention is intended to solve these problems, and its purpose is to improve the adhesion between the conductive film and the nickel plating layer, thereby creating a standby with high transfer accuracy and low defect density. It's there to provide.

[Means for solving problems]

The method for manufacturing an optical disk standby according to the present invention includes forming a conductive film on a pregroup pattern formed on a glass substrate, and then performing nickel plating using the conductive film as a cathode to form a standby. It is characterized in that it is first installed in a DEEP-UV processing device and irradiated with ultraviolet rays to perform a cleaning process on the conductive film.

[Effect]

According to the above structure of the present invention, the increase in defect density at the stage of forming the standby bar 6 means that when the plating layer 5 is peeled off from the glass substrate 1, a part of the conductive film is removed from the glass substrate 1 or the resist. l! ! This indicates that the adhesion between the conductive film 4 and the plating layer 5 is insufficient.

The cause of this can be presumed to be oil stains on the conductive film during the sputtering process or the formation and staining of an oxide film due to handling after sputtering. Therefore, in nickel plating, DEEP-UV is irradiated onto the glass substrate before plating to remove several to several dozen oxide films and stains formed on the surface of the conductive film. As a result, the conductive film is activated, dirt adhering to the surface can be removed, leakage is improved, and a stand bar with high adhesion can be obtained.

〔Example〕

FIG. 1 is a sectional view of a stand bar in an embodiment of the present invention, and as shown in FIGS. 2 to 5, a 6 mm thick glass substrate whose surface has been polished to make it flat and kept clean. 1, a resist film 2 of 1100A was formed using photoresist AZI350 by a spin code method. Furthermore, soft baking was performed at 80'''C for 15 minutes using a drying oven.

Next, information was recorded using a laser cutting machine, and development was performed using an AZ developer. Development was carried out at 20°C for 60 seconds, and after thorough washing with water, spin drying was carried out.

Next, post-baking was performed at 90@C for 30 minutes using a drying oven. Furthermore, nickel was sputtered to a thickness of 700 mm on the surface of the substrate mounted on a sputtering device to form a conductive film 4. Next, the glass substrate with such a conductive film was
It was attached to an EP-UV device (product 82 Chemitron) and irradiated with ultraviolet rays for 3 minutes. Further ozone generated was removed over a period of 2 minutes, and then removed from the Chemitron.

During the DEEP-UV irradiation, the surface of the nickel conductive film was placed on the lamp side of the device, and the irradiation was performed while vibrating from side to side. The glass substrate that had been subjected to the DEEP-UV treatment was washed with water, then placed in an electroforming device, leakage was confirmed, and electrolysis was started immediately after being placed in the plating solution. When it reached a predetermined thickness, it was taken out from the electroforming apparatus, washed with water, dried, and the plated surface was polished to obtain a stand bar 6 of 290 μm. Furthermore, injection molding was performed in the standber to obtain a large number of optical disk media.

〔Effect of the invention〕

As described above, according to the invention, a glass substrate on which a conductive film has been formed is placed in a DEEP-UV system, irradiated with ultraviolet rays, and after cleaning the conductive film, electrolysis is performed using the conductive film as a cathode for nickel plating. By forming the layer, the adhesion between the conductive film and the nickel plating layer can be improved, and a standby with low defect density and high transfer accuracy can be obtained.

[Brief explanation of drawings]

FIG. 1 is a main sectional view showing an embodiment of an optical disk standber according to the present invention. FIGS. 2 to 5 are cross-sectional views showing the manufacturing process of a conventional optical disc stapler/per. 1...Glass substrate 2...Resist film 3...Pre-group 4...Conductor film 5...Meh! A! i
6...Standbar Figure 6 is a sectional view showing a standbar for millet millet. Above 1 [Person Seiko Epson Co., Ltd. No. 10 Note 2 +1 Specialized 3+% Name 4 Omori 61 sword

Claims (1)

[Claims] After forming a conductive film on a pre-group pattern formed on a glass substrate, in the step of forming a stamper by performing nickel plating using the conductive film as a cathode, the stamper is attached to a DEEP-UV processing equipment before plating processing. 1. A method for manufacturing an optical disk stamper, which comprises performing a cleaning process on a conductive film by irradiating ultraviolet rays.