JPS63105986A - Production of stamper for optical disk - Google Patents

Abstract

PURPOSE:To improve the adhesive power of a conductibilized film and Ni plating by immersing a glass substrate with a pregrooved pattern formed with the conductibilized film into an Ni plating liquid, rotating the same and subjecting the substrate to a reverse electrolytic treatment with a specific negative voltage. CONSTITUTION:A resist film 2 is formed by spin coating method using a photoresist on the glass substrate 1 the surface of which is polished to a flat surface and is kept clean. The film is then dried by heating. Information recording is executed on the film by a laser cutting machine and the film is dried after development to form pregrooves 3. Ni is sputtered to a prescribed thickness on the surface of such substrate 1 to form the conductibilized film 4. The substrate 1 is then immersed in the Ni plating liquid and is rotated; thereafter, the conductibilized film 4 as an anode is electrolyzed at 0.1-0.3V to remove the oxide films and stains of the film 4 and to improve the wettability. Ni plating is executed immediately thereafter to form a plating layer 5; further the plated surface is polished, by which a stamper 6 is obtd.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing a stamper for an original disk.

[Summary of the invention]

The present invention provides a method for manufacturing a stamper for an original disk, comprising:
A glass substrate with a pre-group pattern on which a conductive film has been completely formed is immersed in a nickel plating solution and rotated.
-After applying a negative voltage corresponding to either CL3V and performing reverse electrolytic treatment, the stains and oxide film on the conductive film are removed, and pretreatment is performed to fully recover wettability. By performing full nickel plating, the adhesion between the conductive film and the electrolytic nickel plating is completely improved.

[Conventional technology]

Conventionally, various methods are known as methods for manufacturing stampers. A typical method is to use a smooth glass substrate.
Applying a layer of photoresist (e.g. AZ-1350);
Next, using a setting machine, a lot of information is recorded on the laser source, and after development, a conductive film is entirely formed on the resist-coated substrate by sputtering or vacuum evaporation, and this conductive film is used as a cathode. Perform N1 plating to obtain an N1 plated layer. This N1 plated layer is used as a stamper.

2 to 5 show the steps of the prior art, and the details are as follows.

A resist film 2yk having a thickness of about 01 μm is formed by a spin code method on a glass substrate 1 having a thickness of about 6 mm and whose surface has been polished and made flat (FIG. 2).

Next, information is recorded on the resist film 2 using a laser cutting machine. Furthermore, complete development is performed to form a pattern of pregroup 3 (FIG. 3).

Next, a conductive film 4 is formed on the substrate by sputtering N1 to a thickness of approximately 700 mm (FIG. 4).

Next, the conductive film 4 was immersed in an N1 plating solution as a cathode.
Electrolysis is performed to form a plating layer 5 having a thickness of about 500 μm (FIG. 5).

Furthermore, the plating surface was polished to ensure a uniform thickness.

Next, it is peeled off from the glass substrate 1 and the resist film 2 is removed by cleaning, thereby producing a stamper 6.

The stamper 6 made in this way is used as a mold, and a large number of original disk substrates are made. (1) Low defect density, etc. are required.

[Problem that the invention seeks to solve]

However, in the above-mentioned conventional technology, the defect density increases at the stage of forming a plating film by applying N1 plating to the conductive film 4 and then peeling it off to form the stamper 6. ,
This is due to poor adhesion when the conductive film 4 is sputtered and N1 plating is performed using the conductive film 4 as a cathode, resulting in a problem of deteriorating the quality of the stamper.

Therefore, the present invention is intended to solve these problems, and its purpose is to provide a four-electrified film and a nickel-plated a
The object of the present invention is to provide a stamper with high transfer precision and low defect density by improving the adhesion with the stamper.

[Means for solving problems]

The method for manufacturing a stamper for an original disk of the present invention is to completely form a conductive film on a pre-group pattern formed on a glass substrate, and then immerse the glass substrate 1 in a Tsukeru plating solution and rotate it.I: Is it possible to carry out nickel plating after carrying out a pretreatment to completely recover the wettability of the conductive film by performing reverse electrolytic treatment at a negative voltage corresponding to one of L1 to α5v? Features.

[For production]

According to the above configuration of the present invention, the defect density increases in the forming stage of the stamper B, and the plating Jfl 5 k
, a part of the conductive film is attached to the glass substrate 1 or the resist film 2 when it is peeled off from the glass substrate 1. This means that the adhesion between the conductive film 4 and the plating layer 5 is This shows that the light is not visible. The cause of this can be presumed to be oil stains on the conductive film during the sputtering process, and the formation and staining of an oxide film due to handling after careful sputtering. Therefore,
During nickel plating, the conductive film is immersed in a nickel plating solution and subjected to reverse electrolytic treatment by applying a full negative voltage of CLIV-cL5V, and the number z to number of spots formed on the surface of the conductive film is This removes the oxide film and dirt on the A-base. As a result, the conductive film is activated, the wettability is improved, and a stamper with high adhesion can be obtained.

〔Example〕

FIG. 1 is a cross-sectional view of a stamper according to an embodiment of the present invention, and as shown in FIGS. A resist film 2 of 100 filtration layers was formed on a glass original plate by a spin code method using photoresist AZ1350i. Further, a drying oven was used to perform a soft bake at 80° C. for 15 minutes.

Next, the information was recorded on a laser cutting machine, and the current 11&'Y line was made at AZ Developer.

Development was carried out at 22° C. for 60 seconds, and after thorough washing with water, spin drying was carried out.

Next, a boil baking process was carried out at 90° C. for 30 minutes using a drying oven. Furthermore, it is attached to the sputtering equipment and N1 is applied to the substrate surface.
This was sputtered to a thickness of 700× to form a conductive film. Next, it was immersed in N1 plating solution and rotated. The rotation speed is 40r
It was set as pm. Next, with the conductive film as an anode,
Electrolyze for 5 seconds to remove the oxide film and dirt on the conductive film.
7-coating to completely improve wettability. This electrolysis method is
This is commonly called reverse electrolysis, and at cL1v or less, the oxide film cannot be removed even if the treatment is carried out for a long time, and the surface metal is mainly deposited. Furthermore, when α3Vi is exceeded, the conductive film is etched even for a few seconds, reducing pattern accuracy.
Alternatively, a bad shadow will be cast on the nickel plated surface.

Immediately after such treatment, nickel plating was performed to a thickness of t-310 μm to form plating/I5.

Furthermore, plating surface polishing PAt-I, -, 29,0μm
I got a stamper.

〔Effect of the invention〕

As described above, according to the invention, a glass substrate on which a conductive film is completely formed is immersed in a nickel plating solution and rotated (L
It is possible to reduce the defect density by applying a negative voltage corresponding to one of IV-α3v and performing pretreatment to restore the wettability of the conductive film, followed by nickel plating.9 The quality of party discs can be totally improved.

[Brief explanation of the drawing]

FIG. 1 is a main cross-sectional view showing an embodiment of the original disk stamper of the present invention. 2 to 6 are cross-sectional views illustrating the manufacturing process of a conventional original disk standber. 1...Glass substrate 2...Resist film 3...Pre-group 4...Conductive film 5...Plating layer 6...Stamper and above Applicant: Seiko Epson Corporation No. 31 1 Kaya + Kasumibe 61 power

Claims (1)

[Claims] After forming a conductive film on a pregroove pattern formed on a glass substrate, the glass substrate is immersed in a nickel plating solution and rotated to apply a negative voltage of 0.1V to 0.3V. 1. A method for producing a stamper for an optical disk, which comprises performing a pre-treatment of restoring the wettability of a conductive film by applying and performing a reverse electrolytic treatment, followed by nickel plating.