JPS6327039U - - Google Patents

Info

Publication number
JPS6327039U
JPS6327039U JP1986121270U JP12127086U JPS6327039U JP S6327039 U JPS6327039 U JP S6327039U JP 1986121270 U JP1986121270 U JP 1986121270U JP 12127086 U JP12127086 U JP 12127086U JP S6327039 U JPS6327039 U JP S6327039U
Authority
JP
Japan
Prior art keywords
resin
bonding
stamp
thickness
squeegee
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986121270U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0528763Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986121270U priority Critical patent/JPH0528763Y2/ja
Publication of JPS6327039U publication Critical patent/JPS6327039U/ja
Application granted granted Critical
Publication of JPH0528763Y2 publication Critical patent/JPH0528763Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Die Bonding (AREA)
JP1986121270U 1986-08-06 1986-08-06 Expired - Lifetime JPH0528763Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986121270U JPH0528763Y2 (enExample) 1986-08-06 1986-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986121270U JPH0528763Y2 (enExample) 1986-08-06 1986-08-06

Publications (2)

Publication Number Publication Date
JPS6327039U true JPS6327039U (enExample) 1988-02-22
JPH0528763Y2 JPH0528763Y2 (enExample) 1993-07-23

Family

ID=31010381

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986121270U Expired - Lifetime JPH0528763Y2 (enExample) 1986-08-06 1986-08-06

Country Status (1)

Country Link
JP (1) JPH0528763Y2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110524A (ja) * 2009-11-30 2011-06-09 Canon Machinery Inc 塗布装置
KR101165360B1 (ko) 2010-11-26 2012-07-12 주식회사 프로텍 다이 본더용 접착제 스탬핑 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6375628B2 (ja) * 2014-01-27 2018-08-22 三菱電機株式会社 樹脂供給装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110524A (ja) * 2009-11-30 2011-06-09 Canon Machinery Inc 塗布装置
KR101165360B1 (ko) 2010-11-26 2012-07-12 주식회사 프로텍 다이 본더용 접착제 스탬핑 장치

Also Published As

Publication number Publication date
JPH0528763Y2 (enExample) 1993-07-23

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