JPS6325910B2 - - Google Patents
Info
- Publication number
- JPS6325910B2 JPS6325910B2 JP58208334A JP20833483A JPS6325910B2 JP S6325910 B2 JPS6325910 B2 JP S6325910B2 JP 58208334 A JP58208334 A JP 58208334A JP 20833483 A JP20833483 A JP 20833483A JP S6325910 B2 JPS6325910 B2 JP S6325910B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grinding
- grindstone
- eccentric
- outer periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 description 60
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000006061 abrasive grain Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20833483A JPS60104644A (ja) | 1983-11-08 | 1983-11-08 | ウエハ−の外周研削・面取装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20833483A JPS60104644A (ja) | 1983-11-08 | 1983-11-08 | ウエハ−の外周研削・面取装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60104644A JPS60104644A (ja) | 1985-06-10 |
| JPS6325910B2 true JPS6325910B2 (US20100268047A1-20101021-C00003.png) | 1988-05-27 |
Family
ID=16554545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20833483A Granted JPS60104644A (ja) | 1983-11-08 | 1983-11-08 | ウエハ−の外周研削・面取装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60104644A (US20100268047A1-20101021-C00003.png) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62107979A (ja) * | 1985-11-05 | 1987-05-19 | Mitsubishi Metal Corp | ウエハの面取装置 |
| JPH0637024B2 (ja) * | 1987-08-23 | 1994-05-18 | エムテック株式会社 | オリエンテ−ションフラットの研削方法及び装置 |
| US5117590A (en) * | 1988-08-12 | 1992-06-02 | Shin-Etsu Handotai Co., Ltd. | Method of automatically chamfering a wafer and apparatus therefor |
| JP3035690B2 (ja) * | 1994-01-27 | 2000-04-24 | 株式会社東京精密 | ウェーハ直径・断面形状測定装置及びそれを組み込んだウェーハ面取り機 |
| WO1997048522A1 (en) * | 1996-06-15 | 1997-12-24 | Unova U.K. Limited | Improvements in and relating to grinding machines |
| DE19636055A1 (de) * | 1996-09-05 | 1998-03-12 | Wacker Siltronic Halbleitermat | Verfahren zur materialabtragenden Bearbeitung der Kante einer Halbleiterscheibe |
| JP2014226767A (ja) * | 2013-05-27 | 2014-12-08 | 株式会社東京精密 | ウェーハ面取り装置及びウェーハ面取り方法 |
| JP6608604B2 (ja) * | 2015-03-26 | 2019-11-20 | 株式会社東京精密 | 面取り加工された基板及び液晶表示装置の製造方法 |
| JP6906079B2 (ja) * | 2019-07-26 | 2021-07-21 | Ｊｘ金属株式会社 | リン化インジウム基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5641949U (US20100268047A1-20101021-C00003.png) * | 1979-09-11 | 1981-04-17 |
-
1983
- 1983-11-08 JP JP20833483A patent/JPS60104644A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5641949U (US20100268047A1-20101021-C00003.png) * | 1979-09-11 | 1981-04-17 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60104644A (ja) | 1985-06-10 |
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