JPS6325736Y2 - - Google Patents

Info

Publication number
JPS6325736Y2
JPS6325736Y2 JP13669383U JP13669383U JPS6325736Y2 JP S6325736 Y2 JPS6325736 Y2 JP S6325736Y2 JP 13669383 U JP13669383 U JP 13669383U JP 13669383 U JP13669383 U JP 13669383U JP S6325736 Y2 JPS6325736 Y2 JP S6325736Y2
Authority
JP
Japan
Prior art keywords
wafer
diameter
shaped
disc
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13669383U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6045437U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13669383U priority Critical patent/JPS6045437U/ja
Publication of JPS6045437U publication Critical patent/JPS6045437U/ja
Application granted granted Critical
Publication of JPS6325736Y2 publication Critical patent/JPS6325736Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP13669383U 1983-09-05 1983-09-05 半導体ウエ−ハホルダ Granted JPS6045437U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13669383U JPS6045437U (ja) 1983-09-05 1983-09-05 半導体ウエ−ハホルダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13669383U JPS6045437U (ja) 1983-09-05 1983-09-05 半導体ウエ−ハホルダ

Publications (2)

Publication Number Publication Date
JPS6045437U JPS6045437U (ja) 1985-03-30
JPS6325736Y2 true JPS6325736Y2 (enrdf_load_stackoverflow) 1988-07-13

Family

ID=30307269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13669383U Granted JPS6045437U (ja) 1983-09-05 1983-09-05 半導体ウエ−ハホルダ

Country Status (1)

Country Link
JP (1) JPS6045437U (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6045437U (ja) 1985-03-30

Similar Documents

Publication Publication Date Title
US5180974A (en) Semiconductor testing and shipping system
CN107799454B (zh) 用于静电卡盘系统的置中夹具
US20010038791A1 (en) Method for aligning wafers in a cassette
JPS6325736Y2 (enrdf_load_stackoverflow)
JPH07260795A (ja) 分析装置用コンベヤ
US6086976A (en) Semiconductor wafer, handling apparatus, and method
US4344383A (en) Retainer ring for securing substrates in a vacuum deposition system
JPH031172Y2 (enrdf_load_stackoverflow)
US4579313A (en) Sample mounting system
US5218209A (en) Ion implanter
KR102673906B1 (ko) 카드 홀더 및 이를 포함하는 프로브 스테이션
JPS60198818A (ja) フオトレジストの現像装置
US4516842A (en) Aperture wheel
US3166875A (en) Support for lapping transistor wafers or the like
JPH02183958A (ja) イオン注入装置
JPH02720U (enrdf_load_stackoverflow)
JPH0439653Y2 (enrdf_load_stackoverflow)
US20050136653A1 (en) Non-adhesive semiconductor wafer holder and assembly
JPH0452678B2 (enrdf_load_stackoverflow)
JPH04366540A (ja) 半導体装置の製造方法およびイオン注入装置
JP2914087B2 (ja) 電子部品ホルダおよび電子部品の取扱い方法
CN119796662A (zh) 一种用于金属膜片湿法加工的料盘组件及提篮装置
JPS6323705Y2 (enrdf_load_stackoverflow)
JPH0325917A (ja) 半導体製造装置
JPH0517152Y2 (enrdf_load_stackoverflow)