JPS63255990A - プリント配線板用絶縁基材 - Google Patents

プリント配線板用絶縁基材

Info

Publication number
JPS63255990A
JPS63255990A JP8992287A JP8992287A JPS63255990A JP S63255990 A JPS63255990 A JP S63255990A JP 8992287 A JP8992287 A JP 8992287A JP 8992287 A JP8992287 A JP 8992287A JP S63255990 A JPS63255990 A JP S63255990A
Authority
JP
Japan
Prior art keywords
printed wiring
base material
insulating base
wiring boards
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8992287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0252431B2 (enrdf_load_stackoverflow
Inventor
宣行 玉井
浄照 柏女
小沢　茂幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP8992287A priority Critical patent/JPS63255990A/ja
Publication of JPS63255990A publication Critical patent/JPS63255990A/ja
Publication of JPH0252431B2 publication Critical patent/JPH0252431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP8992287A 1987-04-14 1987-04-14 プリント配線板用絶縁基材 Granted JPS63255990A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8992287A JPS63255990A (ja) 1987-04-14 1987-04-14 プリント配線板用絶縁基材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8992287A JPS63255990A (ja) 1987-04-14 1987-04-14 プリント配線板用絶縁基材

Publications (2)

Publication Number Publication Date
JPS63255990A true JPS63255990A (ja) 1988-10-24
JPH0252431B2 JPH0252431B2 (enrdf_load_stackoverflow) 1990-11-13

Family

ID=13984193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8992287A Granted JPS63255990A (ja) 1987-04-14 1987-04-14 プリント配線板用絶縁基材

Country Status (1)

Country Link
JP (1) JPS63255990A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025089142A1 (ja) * 2023-10-23 2025-05-01 株式会社ダイセル 置換型ポリフェニレンサルファイド樹脂を含む樹脂組成物
WO2025089141A1 (ja) * 2023-10-23 2025-05-01 株式会社ダイセル 置換型ポリフェニレンサルファイド樹脂を含む樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025089142A1 (ja) * 2023-10-23 2025-05-01 株式会社ダイセル 置換型ポリフェニレンサルファイド樹脂を含む樹脂組成物
WO2025089141A1 (ja) * 2023-10-23 2025-05-01 株式会社ダイセル 置換型ポリフェニレンサルファイド樹脂を含む樹脂組成物

Also Published As

Publication number Publication date
JPH0252431B2 (enrdf_load_stackoverflow) 1990-11-13

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