JPS63254790A - 電子回路構造体の製造方法 - Google Patents

電子回路構造体の製造方法

Info

Publication number
JPS63254790A
JPS63254790A JP8867487A JP8867487A JPS63254790A JP S63254790 A JPS63254790 A JP S63254790A JP 8867487 A JP8867487 A JP 8867487A JP 8867487 A JP8867487 A JP 8867487A JP S63254790 A JPS63254790 A JP S63254790A
Authority
JP
Japan
Prior art keywords
transfer
circuit
electronic circuit
components
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8867487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563035B2 (enrdf_load_stackoverflow
Inventor
憲一 布施
正幸 石和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP8867487A priority Critical patent/JPS63254790A/ja
Publication of JPS63254790A publication Critical patent/JPS63254790A/ja
Publication of JPH0563035B2 publication Critical patent/JPH0563035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP8867487A 1987-04-13 1987-04-13 電子回路構造体の製造方法 Granted JPS63254790A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8867487A JPS63254790A (ja) 1987-04-13 1987-04-13 電子回路構造体の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8867487A JPS63254790A (ja) 1987-04-13 1987-04-13 電子回路構造体の製造方法

Publications (2)

Publication Number Publication Date
JPS63254790A true JPS63254790A (ja) 1988-10-21
JPH0563035B2 JPH0563035B2 (enrdf_load_stackoverflow) 1993-09-09

Family

ID=13949370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8867487A Granted JPS63254790A (ja) 1987-04-13 1987-04-13 電子回路構造体の製造方法

Country Status (1)

Country Link
JP (1) JPS63254790A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273481A (ja) * 1988-04-26 1989-11-01 Nec Corp ファクシミリ装置
JPH0899610A (ja) * 1994-09-30 1996-04-16 Tsutsunaka Plast Ind Co Ltd 防曇性能を有する合成樹脂製窓材およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01273481A (ja) * 1988-04-26 1989-11-01 Nec Corp ファクシミリ装置
JPH0899610A (ja) * 1994-09-30 1996-04-16 Tsutsunaka Plast Ind Co Ltd 防曇性能を有する合成樹脂製窓材およびその製造方法

Also Published As

Publication number Publication date
JPH0563035B2 (enrdf_load_stackoverflow) 1993-09-09

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Legal Events

Date Code Title Description
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