JPS6325161Y2 - - Google Patents
Info
- Publication number
- JPS6325161Y2 JPS6325161Y2 JP14089783U JP14089783U JPS6325161Y2 JP S6325161 Y2 JPS6325161 Y2 JP S6325161Y2 JP 14089783 U JP14089783 U JP 14089783U JP 14089783 U JP14089783 U JP 14089783U JP S6325161 Y2 JPS6325161 Y2 JP S6325161Y2
- Authority
- JP
- Japan
- Prior art keywords
- ethylene
- acid copolymer
- resin layer
- adhesive
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011256 inorganic filler Substances 0.000 claims description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 10
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 claims description 9
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 claims description 9
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 238000011282 treatment Methods 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 18
- 239000000853 adhesive Substances 0.000 description 17
- 239000000758 substrate Substances 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- TZHYBRCGYCPGBQ-UHFFFAOYSA-N [B].[N] Chemical compound [B].[N] TZHYBRCGYCPGBQ-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
本考案は熱伝導性がすぐれた混成集積回路用金
属基板および混成集積回路用積層体に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal substrate for a hybrid integrated circuit and a laminate for a hybrid integrated circuit with excellent thermal conductivity.
従来、集積回路（IC）用基板の放熱性を改良
するために金属基板が用いられている。金属基板
の場合、その上に形成する導体の伝導性を防止す
るために表面を絶縁化処理したり、さらには金属
基板、接着剤および銅箔からなる積層体が用いら
れている。金属基板としてアルミニウム板を使用
する場合には、従来アルマイト処理などの絶縁化
処理を施したアルミニウム板にさらに接着剤を介
して銅箔を貼付けた構造のものが使われている。
このアルマイト層は絶縁層の役割とともにエツチ
ング時のレジストの役目も果している。しかし、
最近の機器の薄型化、小型化にともない、基板自
体が薄いものが要求されているために薄くなるに
従つてアルマイト処理が困難になるばかりか、１
ｍ×１ｍのような大型板の製造が不可能となつて
いる。そのため、混成集積回路生産時の生産性が
低下し、コストの上昇を招いている。一方、金属
基板、接着剤および銅箔からなる積層体の場合、
接着剤の厚さが薄いならば、銅箔と基板との絶縁
性が悪くなる。一方、厚い場合では、接着剤中の
揮発物質のため、加熱時にフクレが生じ、導体が
剥離するのみならず、耐電圧性が低下することが
あるばかりでなく、熱伝導性が悪くなるために高
密度実装抵抗体としては不適当なものとなる。ま
た、これらの欠点を改良するためにアルミニウム
板の片面に接着剤を両面に塗布したポリイミドフ
イルム、さらに銅箔を重層した構造を有する集積
回路用基板が提案されている。特に、混成集積回
路を加工するさい。高温処理に耐え得る耐熱性の
タイプのものが望ましく、耐熱フイルム／接着剤
の組み合わせとして、ポリアミドイミド／エポキ
シ系、ポリアミド・エポキシ系およびポリエステ
ル／エポキシ系が用いられている。 Conventionally, metal substrates have been used to improve the heat dissipation of integrated circuit (IC) substrates. In the case of a metal substrate, the surface is insulated to prevent the conductivity of a conductor formed thereon, or a laminate consisting of a metal substrate, adhesive, and copper foil is used. When using an aluminum plate as a metal substrate, a conventional structure is used in which a copper foil is further attached via an adhesive to an aluminum plate that has been subjected to an insulating treatment such as alumite treatment.
This alumite layer serves not only as an insulating layer but also as a resist during etching. but,
As recent equipment becomes thinner and smaller, the substrate itself is required to be thinner.
It has become impossible to manufacture large plates such as m x 1 m. As a result, productivity during production of hybrid integrated circuits decreases, leading to an increase in costs. On the other hand, in the case of a laminate consisting of a metal substrate, adhesive and copper foil,
If the adhesive is thin, the insulation between the copper foil and the board will be poor. On the other hand, if the adhesive is thick, volatile substances in the adhesive may cause blistering during heating, which not only causes the conductor to peel off, but also reduces the voltage resistance and deteriorates thermal conductivity. This makes it unsuitable for use as a high-density mounting resistor. In addition, in order to improve these drawbacks, an integrated circuit board has been proposed that has a structure in which a polyimide film is coated on one side of an aluminum plate with an adhesive on both sides, and copper foil is further layered. Especially when processing hybrid integrated circuits. A heat-resistant type that can withstand high-temperature treatment is desirable, and polyamide-imide/epoxy, polyamide/epoxy, and polyester/epoxy are used as heat-resistant film/adhesive combinations.
しかしながら、これらの積層体では、絶縁耐熱
フイルムの両面に接着剤を塗布するために工程が
非常に複雑になり、加工コストがアツプするばか
りでなく、接着剤の塗布ムラなどによつて接着力
が低下したり、高温加工処理時にフクレを生じた
りするなどによつて望ましくない。一方、絶縁性
の点から、接着剤とフイルムの厚さは、合計とし
て厚いほうが好ましいが、その反面熱伝導性、す
なわち放熱性が著しく低下するため、接着剤とフ
イルムとの合計の厚さが50〜200ミクロンに制御
する必要がある。さらに、厚みムラを数ミクロン
以内になるように均一に積層しないと、耐電圧お
よび絶縁性にムラを生じ、過電流が局部的に流
れ、回路を破壊する危険を生じる。 However, in these laminates, the process is extremely complicated because adhesive is applied to both sides of the insulating heat-resistant film, which not only increases processing costs but also reduces adhesive strength due to uneven adhesive application. This is undesirable because it may cause a decrease in the hardness or cause blistering during high-temperature processing. On the other hand, from the point of view of insulation, it is preferable that the total thickness of the adhesive and film be thicker, but on the other hand, thermal conductivity, that is, heat dissipation, will be significantly reduced. Need to be controlled to 50-200 microns. Furthermore, if the layers are not uniformly laminated so that the thickness unevenness is within several microns, there will be unevenness in withstand voltage and insulation, and there will be a risk that overcurrent will flow locally and destroy the circuit.
また、熱伝導性をよくするために接着層に熱伝
導性がすぐれた無機充填剤を添加した系も提案さ
れているが、接着力が低下したり、さらに塗膜の
厚さが厚くなるなどの欠点がある。 In addition, systems in which an inorganic filler with excellent thermal conductivity is added to the adhesive layer have been proposed to improve thermal conductivity, but this may result in a decrease in adhesive strength or an increase in the thickness of the coating film. There are drawbacks.
本考案はこれらの問題を解決するものであり、
金属板の放熱性を生かし、かつ絶縁膜の信頼性を
著しく向上させ、加工性を簡略化させたものであ
る。すなわち、本考案は金属板に接着性を有し、
しかも高温で架橋能力を有するのみならず、熱伝
導性がすぐれ、さらに高温においても安定なフイ
ルム、さらに導電性金属箔を重層した構造を有す
る混成集積回路用基板である。 This invention solves these problems,
It takes advantage of the heat dissipation properties of the metal plate, significantly improves the reliability of the insulating film, and simplifies processability. That is, the present invention has adhesive properties to metal plates,
Moreover, it is a substrate for a hybrid integrated circuit that not only has crosslinking ability at high temperatures, but also has excellent thermal conductivity, and has a structure in which a film that is stable even at high temperatures and a conductive metal foil are layered.
本考案の金属板は放熱などの役割をはたすもの
であり、厚さが0.1〜３mm（好適には0.1〜2.5mm）
のものが好ましい。また、金属の種類としては、
アルミニウム、銅および鉄などの金属ならびにこ
れらの金属を主成分とする合金（たとえば、ステ
ンレス鋼）があげられる。 The metal plate of the present invention plays a role such as heat radiation, and has a thickness of 0.1 to 3 mm (preferably 0.1 to 2.5 mm).
Preferably. In addition, as for the type of metal,
Examples include metals such as aluminum, copper, and iron, and alloys containing these metals as main components (for example, stainless steel).
また、導電性金属箔の厚さは20〜400ミクロン
であり、20〜300ミクロンが望ましく、とりわけ
20〜200ミクロンのものが好適である導電性金属
の種類としては、銅、ニツケル、アルミニウムな
どの金属およびこれらの金属を主成分とする合金
ならびにこれらの金属および合金を二種以上をク
ラツド（貼り合わせること）したものがあげられ
る。 Also, the thickness of the conductive metal foil is 20-400 microns, preferably 20-300 microns, especially
Conductive metals with a diameter of 20 to 200 microns are preferable, including metals such as copper, nickel, and aluminum, alloys containing these metals as main components, and cladding (pasting) of two or more of these metals and alloys. (to match) can be given.
さらに、金属板と導電性金属箔との中間にある
樹脂層は金属板と導電性金属箔とに接着能力を有
し、かつ高温加熱時に架橋能力を有するばかりで
なく、絶縁層の役目をはたすものである。本考案
の最も重要な点はこの樹脂である。この樹脂層の
厚さが10〜4000ミクロンのものが望ましく、とり
わけ20〜200ミクロンのものが好適である。この
樹脂層はエチレン−アクリル酸共重合体および／
またはエチレン−メタクリル酸共重合体とエチレ
ン−酢酸ビニル共重合体のけん化物とからなるも
のである。エチレン−アクリル酸共重合体および
エチレン−メタクリル酸共重合体のアクリル酸お
よびメタクリル酸の含有率は通常それぞれ５〜50
重量％である。また、エチレン−酢酸ビニル共重
合体の酢酸ビニルの含有率は一般には５〜60重量
％である。本考案において使われるけん化物はこ
のエチレン−酢酸ビニル共重合体をけん化（加水
分解）させることによつて得られる。加水分解率
は90％以上が望ましい。加水分解は一般にはメチ
ルアルコール中で苛性ソーダを用いて行なわれ
る。エチレン−アクリル酸共重合体および／また
はエチレン−メタクリル酸共重合体とエチレン−
酢酸ビニル共重合体のけん化物との組成割合は
１／５ないし５／１が望ましい（１／２ないし
２／１が好適）。 Furthermore, the resin layer located between the metal plate and the conductive metal foil not only has the ability to adhere to the metal plate and the conductive metal foil and has the ability to crosslink when heated at high temperatures, but also serves as an insulating layer. It is something. The most important point of this invention is this resin. The resin layer preferably has a thickness of 10 to 4000 microns, particularly preferably 20 to 200 microns. This resin layer is made of ethylene-acrylic acid copolymer and/or
Or it consists of a saponified product of ethylene-methacrylic acid copolymer and ethylene-vinyl acetate copolymer. The content of acrylic acid and methacrylic acid in ethylene-acrylic acid copolymer and ethylene-methacrylic acid copolymer is usually 5 to 50, respectively.
Weight%. Further, the vinyl acetate content of the ethylene-vinyl acetate copolymer is generally 5 to 60% by weight. The saponified product used in the present invention can be obtained by saponifying (hydrolyzing) this ethylene-vinyl acetate copolymer. A hydrolysis rate of 90% or more is desirable. Hydrolysis is generally carried out using caustic soda in methyl alcohol. Ethylene-acrylic acid copolymer and/or ethylene-methacrylic acid copolymer and ethylene-
The composition ratio of the vinyl acetate copolymer to the saponified product is preferably 1/5 to 5/1 (preferably 1/2 to 2/1).
本考案の最も重要な点はエチレン−アクリル酸
共重合体および／またはエチレン−メタクリル酸
共重合体ならびにエチレン−酢酸ビニル共重合体
のけん化物を処理させることによつて得られる組
成物に熱伝導率が１×10-3cal／℃・cm・秒以上
であり、かつ電気抵抗値が1010Ω・cm以上の無機
充填剤を５〜70容量％（好適には、20〜60容量
％）充填してなることである。充填量が５容量％
未満では、熱伝導率の向上がみられない。一方、
70容量％を越えると、熱伝導率は向上するが、接
着能力が低下するので好ましくない。無機充填剤
としては、熱伝導率が１×10-3cal／℃・cm・秒
以上であり、かつ電気抵抗値が1010Ω・cm以上の
ものであればいずれもよいが、代表例としては、
酸化ベリリウム、窒素硼素、酸化マグネシウム
（マグネシア）、酸化アルミニウム（アルミナ）、
炭化けい素およびガラスビーズがあげられる。ま
た、該無機充填剤の粉末の粒度としては、粒子径
が100ミクロン以下のものが望ましく、とりわけ
0.1〜20ミクロンのものが好適である。粒子径が
0.1ミクロン未満では、前記樹脂組成物に均一に
分散させることが困難である。一方、100ミクロ
ンを越えると、樹脂層の厚さが厚くなり、さらに
接着強度も低下するために望ましくない。 The most important point of this invention is that the composition obtained by treating the saponified products of ethylene-acrylic acid copolymer and/or ethylene-methacrylic acid copolymer and ethylene-vinyl acetate copolymer has thermal conductivity. 5 to 70% by volume (preferably 20 to 60% by volume) of an inorganic filler having a ratio of 1 x 10 -3 cal/℃・cm・sec or more and an electrical resistance value of 10 10 Ω・cm or more. This is done by filling it. Filling amount is 5% by volume
If it is less than that, no improvement in thermal conductivity will be observed. on the other hand,
If it exceeds 70% by volume, the thermal conductivity will improve, but the adhesion ability will decrease, which is not preferable. Any inorganic filler may be used as long as it has a thermal conductivity of 1 x 10 -3 cal/℃・cm・sec or more and an electrical resistance value of 10 10 Ω・cm or more, but typical examples include teeth,
Beryllium oxide, boron nitrogen, magnesium oxide (magnesia), aluminum oxide (alumina),
Mention may be made of silicon carbide and glass beads. In addition, the particle size of the inorganic filler powder is preferably 100 microns or less, especially
0.1 to 20 microns are preferred. The particle size is
If it is less than 0.1 micron, it is difficult to uniformly disperse it in the resin composition. On the other hand, if it exceeds 100 microns, the resin layer will become thicker and the adhesive strength will further decrease, which is not desirable.
以上のごときエチレン−アクリル酸共重合体お
よび／またはエチレンメタクリル酸共重合体とエ
チレン−酢酸ビニル共重合体のけん化物を処理さ
せることによつて得られる組成物および無機充填
剤から得られる樹脂層は100℃以上の温度で加熱
するさいにアルミニウム板および銅箔と接着能を
有し、しかも100℃以下の温度において熱可塑性
を示すものである。さらに、100℃以上に加熱す
ることによつて架橋反応（架橋反応は該樹脂層の
劣化が生じる360〜400℃まで可能である）を起
し、附熱性がすぐれ、かつ絶縁性および高熱伝導
性を有するものが得られる。 A resin layer obtained from a composition and an inorganic filler obtained by treating the above saponified products of ethylene-acrylic acid copolymer and/or ethylene methacrylic acid copolymer and ethylene-vinyl acetate copolymer. has adhesive ability to aluminum plates and copper foils when heated at temperatures of 100°C or higher, and exhibits thermoplasticity at temperatures of 100°C or lower. Furthermore, by heating to 100℃ or higher, a crosslinking reaction occurs (crosslinking reaction is possible up to 360-400℃, which causes deterioration of the resin layer), and it has excellent heat properties, insulation, and high thermal conductivity. A product having the following properties is obtained.
以下、本考案を図面を用いて説明する。第１図
は両面に導電性金属箔を重層した構造の両面銅張
り混成集積回路用基板の代表例の一部の断面図の
拡大図である。また、第２図は片面のみを導電性
金属箔重層し、他面は前記樹脂層とした構造の片
面銅張り混成集積回路基板の代表例の一部の断面
図の拡大図である。第１図および第２図におい
て、いずれも１は導電性金属箔であり、３は金属
板である。また、２はエチレン−アクリル酸共重
合体および／またはエチレン−メタクリル酸共重
合体とエチレン−酢酸ビニル共重合体のけん化物
を処理させることによつて得られる組成物および
無機充填剤を充填してなる樹脂層（組成割合は
１／１）である。２′は無機充填剤を含まない樹
脂層である。第１図は樹脂層２を金属板３と導電
性金属箔１との間に加熱圧着によつて貼付けた構
造のものである。第２図および第３図は金属板３
の片面は第１図と同様な構造とし、他面の片面に
樹脂層２および２′を貼付けた構造のものである。 The present invention will be explained below with reference to the drawings. FIG. 1 is an enlarged view of a cross-sectional view of a typical example of a double-sided copper-clad hybrid integrated circuit board having a structure in which conductive metal foil is layered on both sides. Further, FIG. 2 is an enlarged view of a cross-sectional view of a part of a typical example of a single-sided copper-clad hybrid integrated circuit board having a structure in which conductive metal foil is layered on only one side and the resin layer is layered on the other side. In both FIGS. 1 and 2, 1 is a conductive metal foil, and 3 is a metal plate. In addition, 2 is filled with a composition obtained by treating a saponified product of an ethylene-acrylic acid copolymer and/or an ethylene-methacrylic acid copolymer and an ethylene-vinyl acetate copolymer, and an inorganic filler. This is a resin layer (composition ratio is 1/1). 2' is a resin layer containing no inorganic filler. FIG. 1 shows a structure in which a resin layer 2 is attached between a metal plate 3 and a conductive metal foil 1 by heat-pressing. Figures 2 and 3 show metal plate 3.
One side has a structure similar to that shown in FIG. 1, and resin layers 2 and 2' are pasted on the other side.
本考案は金属板と導電性金属箔との間に一般に
使用されている接着剤を用いる必要がないために
接着剤の塗布工程が省略されるばかりか、接着剤
中の揮発物質（たとえば、有機溶媒）のために加
熱時のフクレの発生を生じることがない。また、
樹脂層成形時および加熱圧着時において、熱可塑
性を示す絶縁性樹脂層がこれらの高温加熱処理に
よつて架橋反応され、架橋した樹脂層となるため
に耐熱性が著しく向上するなどの利点を有するも
のである。 This invention not only eliminates the need to use commonly used adhesives between the metal plate and the conductive metal foil, but also eliminates volatile substances in the adhesive (e.g. organic (solvent) will not cause blistering during heating. Also,
During resin layer molding and thermocompression bonding, the thermoplastic insulating resin layer undergoes a crosslinking reaction through these high-temperature heat treatments, resulting in a crosslinked resin layer, which has advantages such as significantly improved heat resistance. It is something.
さらに、該樹脂層内にアルミナ、窒化けい素な
どの絶縁性を有し、しかも熱伝導性の良好な無機
粉末状物を充填（添加）することによつて放熱性
を一層向上させたものである。また、本考案の基
板は曲絞り加工ができるなどの利点も有する。そ
の上、エチレン−アクリル酸共重合体およびエチ
レン−メタクリル酸共重合体が有する−COOH
基とけん化物が有する−OH基とが架橋反応をお
こすための促進剤を添加させることによつて架橋
が一層完結した絶縁性樹脂層を製造することもで
きる。 Furthermore, heat dissipation is further improved by filling (adding) an inorganic powder material with insulation properties and good thermal conductivity, such as alumina and silicon nitride, into the resin layer. be. The substrate of the present invention also has the advantage of being capable of curved drawing processing. Moreover, the -COOH of ethylene-acrylic acid copolymer and ethylene-methacrylic acid copolymer
It is also possible to produce an insulating resin layer with more complete crosslinking by adding an accelerator for causing a crosslinking reaction between the group and the -OH group of the saponified material.
第１図は両面銅箔張り混成集積回路基板の代表
例の一部の断面図の拡大図である。第２図および
第３図は片面銅箔張り混成集積回路用基板の代表
例の一部の断面図である。両図において、１は導
電性金属箔であり、２はエチレン−アクリル酸共
重合体および／またはエチレン−メタクリル酸共
重合体とエチレン−酢酸ビニル共重合体のけん化
物を処理させることによつて得られる組成物に無
機充填剤を充填させた樹脂層である。また、２′
は無機充填剤を含まない樹脂層の例である。さら
に、３は金属板である。
FIG. 1 is an enlarged sectional view of a portion of a typical example of a double-sided copper foil-covered hybrid integrated circuit board. FIGS. 2 and 3 are cross-sectional views of a portion of a representative example of a single-sided copper foil-clad hybrid integrated circuit board. In both figures, 1 is a conductive metal foil, and 2 is a conductive metal foil made by treating a saponified product of ethylene-acrylic acid copolymer and/or ethylene-methacrylic acid copolymer and ethylene-vinyl acetate copolymer. This is a resin layer in which the resulting composition is filled with an inorganic filler. Also, 2'
is an example of a resin layer containing no inorganic filler. Furthermore, 3 is a metal plate.
Claims (1)
金属の合金の板、(B)エチレン−アクリル酸共重合
体および／またはエチレン−メタクリル酸共重合
体ならびにエチレン−酢酸ビニル共重合体のけん
化物を処理させることによつて得られる組成物に
熱伝導率が１×10-3cal／℃・秒以上であり、か
つ電気抵抗が1010Ω・cm以上の無機充填剤を５〜
70％充填してなる厚さが10〜4000ミクロンの樹脂
層ならびに(C)導電性金属箔を順次積層してなる混
成集積回路用基板。 Treatment of (A) plates of aluminum, copper and iron and alloys of these metals, (B) saponified products of ethylene-acrylic acid copolymer and/or ethylene-methacrylic acid copolymer and ethylene-vinyl acetate copolymer An inorganic filler having a thermal conductivity of 1 x 10 -3 cal/℃・sec or more and an electrical resistance of 10 10 Ω・cm or more is added to the composition obtained by
A board for a hybrid integrated circuit comprising a 70% filled resin layer having a thickness of 10 to 4000 microns and (C) a conductive metal foil laminated in sequence.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14089783U JPS6049660U (en) | 1983-09-13 | 1983-09-13 | Substrate for hybrid integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14089783U JPS6049660U (en) | 1983-09-13 | 1983-09-13 | Substrate for hybrid integrated circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6049660U JPS6049660U (en) | 1985-04-08 |
| JPS6325161Y2 true JPS6325161Y2 (en) | 1988-07-08 |
Family
ID=30315296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14089783U Granted JPS6049660U (en) | 1983-09-13 | 1983-09-13 | Substrate for hybrid integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6049660U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0614579B2 (en) * | 1985-08-27 | 1994-02-23 | 三菱電線工業株式会社 | Metal core substrate and manufacturing method thereof |
| JP2009152536A (en) * | 2007-08-17 | 2009-07-09 | Shinshu Univ | Circuit board of electronic apparatus assuring highly efficient heat radiation, and electronic controller, computer system, electrical home appliance, and industrial apparatus product including the same |
| WO2015063866A1 (en) * | 2013-10-29 | 2015-05-07 | 新日鐵住金株式会社 | Surface-treated metal plate and method for manufacturing surface-treated metal plate |
-
1983
- 1983-09-13 JP JP14089783U patent/JPS6049660U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6049660U (en) | 1985-04-08 |
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