JPS63250488A - めつき処理方法 - Google Patents

めつき処理方法

Info

Publication number
JPS63250488A
JPS63250488A JP62084267A JP8426787A JPS63250488A JP S63250488 A JPS63250488 A JP S63250488A JP 62084267 A JP62084267 A JP 62084267A JP 8426787 A JP8426787 A JP 8426787A JP S63250488 A JPS63250488 A JP S63250488A
Authority
JP
Japan
Prior art keywords
water
hole
plating
substrate
peripheral wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62084267A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0325519B2 (enExample
Inventor
Osamu Kano
修 加納
Yoshihiko Takano
良比古 高野
Atsuo Senda
厚生 千田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP62084267A priority Critical patent/JPS63250488A/ja
Priority to US07/177,964 priority patent/US4871585A/en
Publication of JPS63250488A publication Critical patent/JPS63250488A/ja
Publication of JPH0325519B2 publication Critical patent/JPH0325519B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/4572—Partial coating or impregnation of the surface of the substrate
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
JP62084267A 1987-04-06 1987-04-06 めつき処理方法 Granted JPS63250488A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62084267A JPS63250488A (ja) 1987-04-06 1987-04-06 めつき処理方法
US07/177,964 US4871585A (en) 1987-04-06 1988-04-05 Method of plating treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62084267A JPS63250488A (ja) 1987-04-06 1987-04-06 めつき処理方法

Publications (2)

Publication Number Publication Date
JPS63250488A true JPS63250488A (ja) 1988-10-18
JPH0325519B2 JPH0325519B2 (enExample) 1991-04-08

Family

ID=13825678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62084267A Granted JPS63250488A (ja) 1987-04-06 1987-04-06 めつき処理方法

Country Status (2)

Country Link
US (1) US4871585A (enExample)
JP (1) JPS63250488A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5073405A (en) * 1991-01-15 1991-12-17 Westinghouse Electric Corp. Applying a tapered electrode on a porous ceramic support tube by masking a band inside the tube and drawing in electrode material from the outside of the tube by suction
US5741383A (en) * 1992-08-18 1998-04-21 Essex Specialty Products, Inc. Process for bonding a vehicle window
WO2003084675A1 (en) * 2002-04-09 2003-10-16 Nagoya Oilchemical Co., Ltd. Masking material
USD655998S1 (en) * 2010-04-12 2012-03-20 Engineered Products And Services, Inc. Double washer pull plug
US8826852B2 (en) 2010-04-12 2014-09-09 Engineered Products And Services, Inc. Optimized double washer pull plug for minimizing coating error
US9206499B2 (en) * 2010-08-30 2015-12-08 United Technologies Corporation Minimizing blockage of holes in turbine engine components
JP5602194B2 (ja) * 2012-07-19 2014-10-08 京セラドキュメントソリューションズ株式会社 電荷供給部材及びそれを備えた画像形成装置
US10150133B2 (en) * 2014-02-12 2018-12-11 Irenic Solutions, LLC Bore masking system
CN113663836B (zh) * 2021-08-06 2025-09-23 中联重科股份有限公司 用于轴孔内壁的屏蔽工件

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3171756A (en) * 1961-05-04 1965-03-02 Ibm Method of making a printed circuit and base therefor
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
JPS5288772A (en) * 1976-01-20 1977-07-25 Matsushita Electric Industrial Co Ltd Method of producing printed circuit board
NL8105922A (nl) * 1981-12-31 1983-07-18 Philips Nv Werkwijze voor het partieel metalliseren van elektrisch geleidende niet-metallische patronen.
US4449983A (en) * 1982-03-22 1984-05-22 Alza Corporation Simultaneous delivery of two drugs from unit delivery device
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4624847A (en) * 1985-04-22 1986-11-25 Alza Corporation Drug delivery device for programmed delivery of beneficial drug
JPH11557A (ja) * 1997-04-15 1999-01-06 Sumitomo Metal Mining Co Ltd 排ガス浄化用触媒層、排ガス浄化用触媒構造体およびこれらを使用しての排ガス浄化方法

Also Published As

Publication number Publication date
JPH0325519B2 (enExample) 1991-04-08
US4871585A (en) 1989-10-03

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term