JPS6324857U - - Google Patents

Info

Publication number
JPS6324857U
JPS6324857U JP1986118584U JP11858486U JPS6324857U JP S6324857 U JPS6324857 U JP S6324857U JP 1986118584 U JP1986118584 U JP 1986118584U JP 11858486 U JP11858486 U JP 11858486U JP S6324857 U JPS6324857 U JP S6324857U
Authority
JP
Japan
Prior art keywords
light
emitting
mask plate
display
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986118584U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416468Y2 (pl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986118584U priority Critical patent/JPH0416468Y2/ja
Publication of JPS6324857U publication Critical patent/JPS6324857U/ja
Application granted granted Critical
Publication of JPH0416468Y2 publication Critical patent/JPH0416468Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1986118584U 1986-07-31 1986-07-31 Expired JPH0416468Y2 (pl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986118584U JPH0416468Y2 (pl) 1986-07-31 1986-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986118584U JPH0416468Y2 (pl) 1986-07-31 1986-07-31

Publications (2)

Publication Number Publication Date
JPS6324857U true JPS6324857U (pl) 1988-02-18
JPH0416468Y2 JPH0416468Y2 (pl) 1992-04-13

Family

ID=31005173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986118584U Expired JPH0416468Y2 (pl) 1986-07-31 1986-07-31

Country Status (1)

Country Link
JP (1) JPH0416468Y2 (pl)

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415037A (ja) * 1990-05-08 1992-01-20 Sony Corp 脈診装置
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
KR100496066B1 (ko) * 2002-06-04 2005-06-16 에이피전자 주식회사 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡
JP2006120691A (ja) * 2004-10-19 2006-05-11 Matsushita Electric Ind Co Ltd 線状光源装置
JP2006517738A (ja) * 2003-02-07 2006-07-27 松下電器産業株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置
JP2007123939A (ja) * 2007-01-29 2007-05-17 Kyocera Corp 発光装置
JP2007142476A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2007142477A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2008182271A (ja) * 2003-01-09 2008-08-07 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2008294309A (ja) * 2007-05-25 2008-12-04 Showa Denko Kk 発光装置、表示装置
JP2012178581A (ja) * 2006-03-03 2012-09-13 Lg Innotek Co Ltd 発光ダイオードパッケージ
JP2013120840A (ja) * 2011-12-07 2013-06-17 Shin Etsu Chem Co Ltd 積層基板
WO2014061555A1 (ja) * 2012-10-19 2014-04-24 シャープ株式会社 発光装置および発光装置のヒートシンクへの取付構造
JP2014146653A (ja) * 2013-01-28 2014-08-14 Dainippon Printing Co Ltd 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体、樹脂付きリードフレーム、光半導体装置
JP2014236175A (ja) * 2013-06-05 2014-12-15 日亜化学工業株式会社 発光装置
JP2014235212A (ja) * 2013-05-31 2014-12-15 三菱電機株式会社 映像表示装置
JP2015096875A (ja) * 2013-11-15 2015-05-21 三菱電機株式会社 表示装置
JP2017187710A (ja) * 2016-04-08 2017-10-12 三菱電機株式会社 表示装置
JP2017188589A (ja) * 2016-04-06 2017-10-12 日亜化学工業株式会社 発光装置
JP2019075552A (ja) * 2017-10-12 2019-05-16 ルーメンス カンパニー リミテッド ディスプレイ用ｌｅｄモジュール組立体

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415037A (ja) * 1990-05-08 1992-01-20 Sony Corp 脈診装置
KR100496066B1 (ko) * 2002-06-04 2005-06-16 에이피전자 주식회사 엘이디전광판의 기판에 정밀한 실링제의 주사를 위한 선캡
JP4574694B2 (ja) * 2003-01-09 2010-11-04 京セラ株式会社 発光素子収納用パッケージおよび発光装置
JP2008182271A (ja) * 2003-01-09 2008-08-07 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2006517738A (ja) * 2003-02-07 2006-07-27 松下電器産業株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2006120691A (ja) * 2004-10-19 2006-05-11 Matsushita Electric Ind Co Ltd 線状光源装置
JP2006210624A (ja) * 2005-01-27 2006-08-10 Toshiba Lighting & Technology Corp 発光装置
US8796717B2 (en) 2006-03-03 2014-08-05 Lg Innotek Co., Ltd. Light-emitting diode package and manufacturing method thereof
JP2012178581A (ja) * 2006-03-03 2012-09-13 Lg Innotek Co Ltd 発光ダイオードパッケージ
JP2007123939A (ja) * 2007-01-29 2007-05-17 Kyocera Corp 発光装置
JP2007142477A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2007142476A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2008294309A (ja) * 2007-05-25 2008-12-04 Showa Denko Kk 発光装置、表示装置
JP2013120840A (ja) * 2011-12-07 2013-06-17 Shin Etsu Chem Co Ltd 積層基板
WO2014061555A1 (ja) * 2012-10-19 2014-04-24 シャープ株式会社 発光装置および発光装置のヒートシンクへの取付構造
JP2014146653A (ja) * 2013-01-28 2014-08-14 Dainippon Printing Co Ltd 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体、樹脂付きリードフレーム、光半導体装置
JP2014235212A (ja) * 2013-05-31 2014-12-15 三菱電機株式会社 映像表示装置
JP2014236175A (ja) * 2013-06-05 2014-12-15 日亜化学工業株式会社 発光装置
US10429011B2 (en) 2013-06-05 2019-10-01 Nichia Corporation Method of manufacturing light emitting device
JP2015096875A (ja) * 2013-11-15 2015-05-21 三菱電機株式会社 表示装置
JP2017188589A (ja) * 2016-04-06 2017-10-12 日亜化学工業株式会社 発光装置
US10026718B2 (en) 2016-04-06 2018-07-17 Nichia Corporation Light emitting device
JP2017187710A (ja) * 2016-04-08 2017-10-12 三菱電機株式会社 表示装置
JP2019075552A (ja) * 2017-10-12 2019-05-16 ルーメンス カンパニー リミテッド ディスプレイ用ｌｅｄモジュール組立体

Also Published As

Publication number Publication date
JPH0416468Y2 (pl) 1992-04-13

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