JPS63247320A - 電気・電子部品用銅合金の製造方法 - Google Patents

電気・電子部品用銅合金の製造方法

Info

Publication number
JPS63247320A
JPS63247320A JP62082040A JP8204087A JPS63247320A JP S63247320 A JPS63247320 A JP S63247320A JP 62082040 A JP62082040 A JP 62082040A JP 8204087 A JP8204087 A JP 8204087A JP S63247320 A JPS63247320 A JP S63247320A
Authority
JP
Japan
Prior art keywords
alloy
casting
electrical
ingot
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62082040A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438828B2 (cg-RX-API-DMAC10.html
Inventor
Motohisa Miyato
宮藤　元久
Yasuhiro Nakajima
安啓 中島
Akitoshi Saito
斉藤　明敏
Masato Watari
渡　真人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP62082040A priority Critical patent/JPS63247320A/ja
Publication of JPS63247320A publication Critical patent/JPS63247320A/ja
Publication of JPH0438828B2 publication Critical patent/JPH0438828B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Conductive Materials (AREA)
JP62082040A 1987-04-02 1987-04-02 電気・電子部品用銅合金の製造方法 Granted JPS63247320A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62082040A JPS63247320A (ja) 1987-04-02 1987-04-02 電気・電子部品用銅合金の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62082040A JPS63247320A (ja) 1987-04-02 1987-04-02 電気・電子部品用銅合金の製造方法

Publications (2)

Publication Number Publication Date
JPS63247320A true JPS63247320A (ja) 1988-10-14
JPH0438828B2 JPH0438828B2 (cg-RX-API-DMAC10.html) 1992-06-25

Family

ID=13763406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62082040A Granted JPS63247320A (ja) 1987-04-02 1987-04-02 電気・電子部品用銅合金の製造方法

Country Status (1)

Country Link
JP (1) JPS63247320A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4319249A1 (de) * 1992-06-11 1993-12-16 Mitsubishi Shindo Kk Anschlußrahmenmaterial, das aus einer Kupferlegierung geformt ist, für mit Epoxyharz gekapselte Halbleitervorrichtungen
JP2007119844A (ja) * 2005-10-27 2007-05-17 Hitachi Cable Ltd 曲げ加工性に優れる高強度銅合金材およびその製造方法
CN109022962A (zh) * 2018-07-24 2018-12-18 东北轻合金有限责任公司 一种航空用铝合金扁铸锭及其制造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4319249A1 (de) * 1992-06-11 1993-12-16 Mitsubishi Shindo Kk Anschlußrahmenmaterial, das aus einer Kupferlegierung geformt ist, für mit Epoxyharz gekapselte Halbleitervorrichtungen
JP2007119844A (ja) * 2005-10-27 2007-05-17 Hitachi Cable Ltd 曲げ加工性に優れる高強度銅合金材およびその製造方法
CN109022962A (zh) * 2018-07-24 2018-12-18 东北轻合金有限责任公司 一种航空用铝合金扁铸锭及其制造方法

Also Published As

Publication number Publication date
JPH0438828B2 (cg-RX-API-DMAC10.html) 1992-06-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees