JPS63245991A - Assembly of electronic parts and the like and insulating substrate - Google Patents
Assembly of electronic parts and the like and insulating substrateInfo
- Publication number
- JPS63245991A JPS63245991A JP7989987A JP7989987A JPS63245991A JP S63245991 A JPS63245991 A JP S63245991A JP 7989987 A JP7989987 A JP 7989987A JP 7989987 A JP7989987 A JP 7989987A JP S63245991 A JPS63245991 A JP S63245991A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- holding hole
- circuit
- circuit board
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、抵抗器、コンデンサ、LED、 トランジス
ターなど(以下「電気部品等」という。)と回路基板な
ど絶縁基体との組合せ体に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a combination of a resistor, a capacitor, an LED, a transistor, etc. (hereinafter referred to as "electrical components, etc.") and an insulating substrate such as a circuit board.
(従来の技術)
従来、例えば第8図に示すように絶縁基体である回路基
板Pと電気部品である抵抗器Rとの組合せ体において、
この抵抗器は、その両側から延びているリード線Ra、
Ra@基板に設けであるスルーホール内に差入れて、こ
のリード線下端を接着剤で仮り止めしてから基板の裏側
から半田Hによって固定し、各リード線Raを導電回路
部Eに接続するものである。(Prior Art) Conventionally, as shown in FIG. 8, for example, in a combination of a circuit board P as an insulating base and a resistor R as an electrical component,
This resistor has lead wires Ra extending from both sides thereof,
Ra@Insert into the through hole provided on the board, temporarily fix the lower end of this lead wire with adhesive, and then fix it with solder H from the back side of the board, and connect each lead wire Ra to the conductive circuit part E. It is.
(発明が解決しようとする問題点)
この種の組合せ体によると、抵抗器が回路基板上方に位
置することになるために、この上方のスペースが抵抗器
で占められて取付はスペースが広くなって実装密度が上
らない問題があった。(Problem to be Solved by the Invention) According to this type of combination, since the resistor is located above the circuit board, the space above this is occupied by the resistor, resulting in a large mounting space. There was a problem that the mounting density could not be increased.
本発明の目的は、電気絶縁基体上方の取付はスペースを
省スペースとすることができて実装密度を上げることが
できる電気部品等と絶縁基体との組合せ体を提供するこ
とにある。An object of the present invention is to provide a combination of an electrical component, etc., and an insulating base, which can be mounted above an electrically insulating base to save space and increase packaging density.
(問題点を解決するための手段)
本発明の組合せ体は、絶縁基体1,1a〜1Cと、この
絶縁基体に設けている保持孔2,2a〜2Cと導電部3
,3a 〜3c、4,4a 〜4Gとを備えており、上
記保持孔で電気部品等5.58〜5Gを支持し、この電
気部品等が上記導電部と電気的に接続しているものであ
る。(Means for Solving the Problems) The combination of the present invention includes an insulating base 1, 1a to 1C, holding holes 2, 2a to 2C provided in the insulating base, and a conductive part 3.
, 3a to 3c, 4, 4a to 4G, and the holding hole supports an electrical component etc. 5.58 to 5G, and the electrical component etc. is electrically connected to the conductive part. be.
(実施例) 以下本発明の詳細な説明する。(Example) The present invention will be explained in detail below.
まず第1実施例を第1,2図を参照して説明する。絶縁
基体である回路基板1にはその厚み方向に貫通する保持
孔2を設けである。この保持孔は上下に段部21,22
を備えた断面「工」字状に形成した円形孔である。回路
基板1の上下両面には導電部である導電回路3,4を設
けてあり、各回路端部31,41は上記保持孔2の開口
縁部および段部21,22をそれぞれ覆っており、孔内
で間隙11をもって互いに分離されている。First, a first embodiment will be described with reference to FIGS. 1 and 2. A circuit board 1, which is an insulating base, is provided with a holding hole 2 penetrating in the thickness direction thereof. This holding hole has stepped portions 21 and 22 on the top and bottom.
It is a circular hole with a cross section shaped like a square. Conductive circuits 3 and 4, which are conductive parts, are provided on both upper and lower surfaces of the circuit board 1, and each circuit end part 31, 41 covers the opening edge of the holding hole 2 and the stepped parts 21, 22, respectively. They are separated from each other by a gap 11 within the hole.
保持孔2内で抵抗器5を保持してあり、この抵抗器の上
下のつば部51.52外面は回路基板1の面と同一平面
を形成している。つば部51゜52裏面および外周面は
各回路端部31.41と接触している。抵抗器5は、カ
ーボンを混入した液状プラスチックを保持孔2内に充填
して硬化させることによって形成されたものである。な
お、この抵抗器を保持孔2内に圧入したものであっても
よい。したがって、上下の導電回路3,4の回路端部3
1と41とは保持孔2内の抵抗器5によって通電状態と
なる。A resistor 5 is held within the holding hole 2, and the outer surfaces of upper and lower collar portions 51 and 52 of this resistor form the same plane as the surface of the circuit board 1. The back and outer peripheral surfaces of the collars 51, 52 are in contact with each circuit end 31, 41. The resistor 5 is formed by filling the holding hole 2 with liquid plastic mixed with carbon and hardening the liquid plastic. Note that this resistor may be press-fitted into the holding hole 2. Therefore, the circuit ends 3 of the upper and lower conductive circuits 3, 4
1 and 41 are energized by the resistor 5 in the holding hole 2.
この例において、導電回路3の回路端部31と抵抗器5
との確実な導通を確保するために、鎖線に示すように短
冊状の導電体6を回路端部31と抵抗器5との間に形成
してもよい。形成方法の一例として、導電性インキによ
るシルク印刷法を用いる。In this example, the circuit end 31 of the conductive circuit 3 and the resistor 5
In order to ensure reliable conduction with the resistor 5, a strip-shaped conductor 6 may be formed between the circuit end 31 and the resistor 5, as shown by the chain line. As an example of the formation method, a silk printing method using conductive ink is used.
導電回路の構成の他の例として、第3.4図に示すよう
に導電回路3aと4aとを回路基板1aの同一面(図面
では上面)に形成してもよい。この場合、回路端部31
aと41aと間隙12をもって対向している。組合せ体
のその他の構成は上例と実質的に同一であるため、上例
の符号にraJを付して対応関係を明確にしである。As another example of the structure of the conductive circuit, conductive circuits 3a and 4a may be formed on the same surface (the upper surface in the drawing) of the circuit board 1a, as shown in FIG. 3.4. In this case, the circuit end 31
a and 41a face each other with a gap 12 in between. Since the other configurations of the combination are substantially the same as in the above example, raJ is added to the reference numerals in the above example to clarify the correspondence.
また保持孔の内部形状は上記各側に限定されず、第5,
6図に示すように全長にわたって同一径の孔2bであっ
てもよい。この例では抵抗器5bの回路基板1bにおけ
る保持状態を安定化させるために、上下に薄肉のつば部
51b、52bを回路基板の上下面にわずか露出させで
ある。各つば部の裏面で導電回路3b、4bの端部31
b、41bと接触している。Further, the internal shape of the holding hole is not limited to the above-mentioned respective sides, but the fifth,
As shown in FIG. 6, the holes 2b may have the same diameter over the entire length. In this example, in order to stabilize the state in which the resistor 5b is held on the circuit board 1b, upper and lower thin-walled collar portions 51b and 52b are slightly exposed on the upper and lower surfaces of the circuit board. The ends 31 of the conductive circuits 3b and 4b on the back side of each collar.
b, in contact with 41b.
ざら他の実施例を第7図を参照して説明する。Another embodiment will be described with reference to FIG.
回路基板1Cに貫通しである保持孔2C内に抵抗器5G
を収納してあり、つば部510.52Gの裏面は基板の
導電回路3c、4cの一端部31c、41cに接触して
いる。上側の回路3Cの他端部31C1は、基板1Cに
成形しである上端開口の袋部7内に収納しであるばね体
8と導通している。また下側の回路4Cの他端部41C
1は、基板1Cの下面より突出しである突部9を覆って
いる。なお、ばね体8にはソケットのピンが差込まれて
ばね片81で保持される。A resistor 5G is installed in the holding hole 2C that penetrates the circuit board 1C.
The back surface of the collar portion 510.52G is in contact with one end portions 31c, 41c of the conductive circuits 3c, 4c of the substrate. The other end portion 31C1 of the upper circuit 3C is electrically connected to a spring body 8 that is molded on the substrate 1C and is housed in a bag portion 7 that is open at the upper end. Also, the other end 41C of the lower circuit 4C
1 covers a protrusion 9 that protrudes from the lower surface of the substrate 1C. Note that a socket pin is inserted into the spring body 8 and held by a spring piece 81.
保持孔は必ずしも基板を貫通する必要はなく、めくら孔
であってもよい。また絶縁基体は回路基板の他に例えば
ICパッケージと回路基板を連結するために用いるソケ
ットであってもよく、その他コ季りターなとであっても
よい。The holding hole does not necessarily need to penetrate the substrate, and may be a blind hole. In addition to the circuit board, the insulating substrate may also be a socket used for connecting an IC package and a circuit board, or other materials.
(発明の効果)
本発明によれば、電気部品等を絶縁基体の保持孔で保持
する構成であるため、絶縁基体外方の取付はスペースを
省スペースとすることができ、実装密度を上げることが
できる。また取付はスペースを狭くすることができるた
め、コネクターなどのような小さな絶縁基体であっても
電気部品等を付設することができる。(Effects of the Invention) According to the present invention, since the electrical components, etc. are held in the holding holes of the insulating base, the mounting outside the insulating base can save space and increase the packaging density. Can be done. Furthermore, since the installation space can be narrowed, electrical components can be attached even to small insulating substrates such as connectors.
第1図は第2図I−I線断面図、
第2図は平面図、
第3図および第4図は第2の実施例を示し、第3図は第
4図■−■線断面図、第4図は平面図、第5図および6
図は第3の実施例を示し、第5図は平面図、第6図は第
5図Vl −Vl線断面図、第7図は第3の実施例を示
す斜視図、
第8図は従来例を示す断面図である。
1.1a〜1C・・・絶縁基体(回路基板)、2.2a
〜2C・・・保持孔、
3.3a 〜3c、4.4a 〜4c・・・導電部、(
導電回路)
5.5a〜5C・・・電気部品等(抵抗器)。
以上
第4図
第5図
第6図Figure 1 is a sectional view taken along the line I-I in Figure 2, Figure 2 is a plan view, Figures 3 and 4 show the second embodiment, and Figure 3 is a sectional view taken along the line ■-■ in Figure 4. , Figure 4 is a plan view, Figures 5 and 6.
The figures show the third embodiment, FIG. 5 is a plan view, FIG. 6 is a sectional view taken along the line Vl-Vl in FIG. 5, FIG. 7 is a perspective view showing the third embodiment, and FIG. 8 is a conventional It is a sectional view showing an example. 1.1a to 1C...Insulating base (circuit board), 2.2a
~2C... Holding hole, 3.3a ~3c, 4.4a ~4c... Conductive part, (
Conductive circuit) 5.5a to 5C... Electrical parts, etc. (resistors). Above Figure 4 Figure 5 Figure 6
Claims (1)
持孔で電気部品等を支持し、この電気部品等が上記導電
部と電気的に接続していることを特徴とする電気部品等
と絶縁基体との組合せ体。A holding hole and a conductive part are provided in an insulating base, an electric part, etc. is supported by the holding hole, and the electric part, etc. is electrically connected to the conductive part. A combination body with a base body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7989987A JPS63245991A (en) | 1987-04-01 | 1987-04-01 | Assembly of electronic parts and the like and insulating substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7989987A JPS63245991A (en) | 1987-04-01 | 1987-04-01 | Assembly of electronic parts and the like and insulating substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63245991A true JPS63245991A (en) | 1988-10-13 |
Family
ID=13703125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7989987A Pending JPS63245991A (en) | 1987-04-01 | 1987-04-01 | Assembly of electronic parts and the like and insulating substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63245991A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0377239U (en) * | 1989-11-27 | 1991-08-02 | ||
JP2008277568A (en) * | 2007-04-27 | 2008-11-13 | Victor Co Of Japan Ltd | Electronic component housing substrate and manufacturing method therefor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54140972A (en) * | 1978-04-25 | 1979-11-01 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of producing same |
JPS574263B2 (en) * | 1978-03-31 | 1982-01-25 | ||
JPS578770B2 (en) * | 1974-09-17 | 1982-02-18 | ||
JPS609256B2 (en) * | 1976-09-17 | 1985-03-08 | コニカ株式会社 | Silver halide color photographic material processing method |
JPS6227195A (en) * | 1985-07-27 | 1987-02-05 | 大日本印刷株式会社 | Integrated circuit card |
-
1987
- 1987-04-01 JP JP7989987A patent/JPS63245991A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS578770B2 (en) * | 1974-09-17 | 1982-02-18 | ||
JPS609256B2 (en) * | 1976-09-17 | 1985-03-08 | コニカ株式会社 | Silver halide color photographic material processing method |
JPS574263B2 (en) * | 1978-03-31 | 1982-01-25 | ||
JPS54140972A (en) * | 1978-04-25 | 1979-11-01 | Matsushita Electric Ind Co Ltd | Printed circuit board and method of producing same |
JPS6227195A (en) * | 1985-07-27 | 1987-02-05 | 大日本印刷株式会社 | Integrated circuit card |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0377239U (en) * | 1989-11-27 | 1991-08-02 | ||
JP2008277568A (en) * | 2007-04-27 | 2008-11-13 | Victor Co Of Japan Ltd | Electronic component housing substrate and manufacturing method therefor |
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