JPS63245991A - Assembly of electronic parts and the like and insulating substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a combination of a resistor, a capacitor, an LED, a transistor, etc. (hereinafter referred to as "electrical components, etc.") and an insulating substrate such as a circuit board.

(Prior Art) Conventionally, as shown in FIG. 8, for example, in a combination of a circuit board P as an insulating base and a resistor R as an electrical component,
This resistor has lead wires Ra extending from both sides thereof,
Ra@Insert into the through hole provided on the board, temporarily fix the lower end of this lead wire with adhesive, and then fix it with solder H from the back side of the board, and connect each lead wire Ra to the conductive circuit part E. It is.

(Problem to be Solved by the Invention) According to this type of combination, since the resistor is located above the circuit board, the space above this is occupied by the resistor, resulting in a large mounting space. There was a problem that the mounting density could not be increased.

An object of the present invention is to provide a combination of an electrical component, etc., and an insulating base, which can be mounted above an electrically insulating base to save space and increase packaging density.

(Means for Solving the Problems) The combination of the present invention includes an insulating base 1, 1a to 1C, holding holes 2, 2a to 2C provided in the insulating base, and a conductive part 3.
, 3a to 3c, 4, 4a to 4G, and the holding hole supports an electrical component etc. 5.58 to 5G, and the electrical component etc. is electrically connected to the conductive part. be.

(Example) The present invention will be explained in detail below.

First, a first embodiment will be described with reference to FIGS. 1 and 2. A circuit board 1, which is an insulating base, is provided with a holding hole 2 penetrating in the thickness direction thereof. This holding hole has stepped portions 21 and 22 on the top and bottom.
It is a circular hole with a cross section shaped like a square. Conductive circuits 3 and 4, which are conductive parts, are provided on both upper and lower surfaces of the circuit board 1, and each circuit end part 31, 41 covers the opening edge of the holding hole 2 and the stepped parts 21, 22, respectively. They are separated from each other by a gap 11 within the hole.

A resistor 5 is held within the holding hole 2, and the outer surfaces of upper and lower collar portions 51 and 52 of this resistor form the same plane as the surface of the circuit board 1. The back and outer peripheral surfaces of the collars 51, 52 are in contact with each circuit end 31, 41. The resistor 5 is formed by filling the holding hole 2 with liquid plastic mixed with carbon and hardening the liquid plastic. Note that this resistor may be press-fitted into the holding hole 2. Therefore, the circuit ends 3 of the upper and lower conductive circuits 3, 4
1 and 41 are energized by the resistor 5 in the holding hole 2.

In this example, the circuit end 31 of the conductive circuit 3 and the resistor 5
In order to ensure reliable conduction with the resistor 5, a strip-shaped conductor 6 may be formed between the circuit end 31 and the resistor 5, as shown by the chain line. As an example of the formation method, a silk printing method using conductive ink is used.

As another example of the structure of the conductive circuit, conductive circuits 3a and 4a may be formed on the same surface (the upper surface in the drawing) of the circuit board 1a, as shown in FIG. 3.4. In this case, the circuit end 31
a and 41a face each other with a gap 12 in between. Since the other configurations of the combination are substantially the same as in the above example, raJ is added to the reference numerals in the above example to clarify the correspondence.

Further, the internal shape of the holding hole is not limited to the above-mentioned respective sides, but the fifth,
As shown in FIG. 6, the holes 2b may have the same diameter over the entire length. In this example, in order to stabilize the state in which the resistor 5b is held on the circuit board 1b, upper and lower thin-walled collar portions 51b and 52b are slightly exposed on the upper and lower surfaces of the circuit board. The ends 31 of the conductive circuits 3b and 4b on the back side of each collar.
b, in contact with 41b.

Another embodiment will be described with reference to FIG.

A resistor 5G is installed in the holding hole 2C that penetrates the circuit board 1C.
The back surface of the collar portion 510.52G is in contact with one end portions 31c, 41c of the conductive circuits 3c, 4c of the substrate. The other end portion 31C1 of the upper circuit 3C is electrically connected to a spring body 8 that is molded on the substrate 1C and is housed in a bag portion 7 that is open at the upper end. Also, the other end 41C of the lower circuit 4C
1 covers a protrusion 9 that protrudes from the lower surface of the substrate 1C. Note that a socket pin is inserted into the spring body 8 and held by a spring piece 81.

The holding hole does not necessarily need to penetrate the substrate, and may be a blind hole. In addition to the circuit board, the insulating substrate may also be a socket used for connecting an IC package and a circuit board, or other materials.

(Effects of the Invention) According to the present invention, since the electrical components, etc. are held in the holding holes of the insulating base, the mounting outside the insulating base can save space and increase the packaging density. Can be done. Furthermore, since the installation space can be narrowed, electrical components can be attached even to small insulating substrates such as connectors.

[Brief explanation of the drawing]

Figure 1 is a sectional view taken along the line I-I in Figure 2, Figure 2 is a plan view, Figures 3 and 4 show the second embodiment, and Figure 3 is a sectional view taken along the line ■-■ in Figure 4. , Figure 4 is a plan view, Figures 5 and 6.
The figures show the third embodiment, FIG. 5 is a plan view, FIG. 6 is a sectional view taken along the line Vl-Vl in FIG. 5, FIG. 7 is a perspective view showing the third embodiment, and FIG. 8 is a conventional It is a sectional view showing an example. 1.1a to 1C...Insulating base (circuit board), 2.2a
~2C... Holding hole, 3.3a ~3c, 4.4a ~4c... Conductive part, (
Conductive circuit) 5.5a to 5C... Electrical parts, etc. (resistors). Above Figure 4 Figure 5 Figure 6

Claims (1)

[Claims] A holding hole and a conductive part are provided in an insulating base, an electric part, etc. is supported by the holding hole, and the electric part, etc. is electrically connected to the conductive part. A combination body with a base body.