JPS63239832A - Ｉｃチップ用パッケージおよびその製造方法 - Google Patents

Ｉｃチップ用パッケージおよびその製造方法

Info

Publication number
JPS63239832A
JPS63239832A JP62075744A JP7574487A JPS63239832A JP S63239832 A JPS63239832 A JP S63239832A JP 62075744 A JP62075744 A JP 62075744A JP 7574487 A JP7574487 A JP 7574487A JP S63239832 A JPS63239832 A JP S63239832A
Authority
JP
Japan
Prior art keywords
chip
support member
printed circuit
circuit board
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62075744A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0550134B2 (OSRAM
Inventor
ジャック　フォンタン
カレル　クルツェル
ジェラール　デエーヌ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SAS
Original Assignee
Bull SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bull SAS filed Critical Bull SAS
Publication of JPS63239832A publication Critical patent/JPS63239832A/ja
Publication of JPH0550134B2 publication Critical patent/JPH0550134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W44/601—
    • H10W70/685—
    • H10W76/157—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62075744A 1986-03-28 1987-03-28 Ｉｃチップ用パッケージおよびその製造方法 Granted JPS63239832A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8604500A FR2596607A1 (fr) 1986-03-28 1986-03-28 Procede de montage d'un circuit integre sur une carte de circuits imprimes, boitier de circuit integre en resultant et ruban porteur de circuits integres pour la mise en oeuvre du procede
FR8604500 1986-03-28

Publications (2)

Publication Number Publication Date
JPS63239832A true JPS63239832A (ja) 1988-10-05
JPH0550134B2 JPH0550134B2 (OSRAM) 1993-07-28

Family

ID=9333661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62075744A Granted JPS63239832A (ja) 1986-03-28 1987-03-28 Ｉｃチップ用パッケージおよびその製造方法

Country Status (6)

Country Link
US (1) US4812949A (OSRAM)
EP (1) EP0239494B1 (OSRAM)
JP (1) JPS63239832A (OSRAM)
DE (1) DE3772078D1 (OSRAM)
ES (1) ES2025676T3 (OSRAM)
FR (1) FR2596607A1 (OSRAM)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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US5065282A (en) * 1986-10-17 1991-11-12 Polonio John D Interconnection mechanisms for electronic components
US4914812A (en) * 1987-12-04 1990-04-10 General Electric Company Method of self-packaging an IC chip
US5184211A (en) * 1988-03-01 1993-02-02 Digital Equipment Corporation Apparatus for packaging and cooling integrated circuit chips
US5091825A (en) * 1988-03-29 1992-02-25 Hughes Aircraft Company Orthogonal bonding method and equipment
JP2592308B2 (ja) * 1988-09-30 1997-03-19 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
FR2638896B1 (fr) * 1988-11-08 1990-12-21 Bull Sa Boitier de circuit integre de haute densite, support de circuit integre et carte d'interconnexion en resultant
FR2638895A1 (fr) * 1988-11-08 1990-05-11 Bull Sa Support de circuit integre et son procede de fabrication, circuit integre adapte au support et boitier en resultant
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5258649A (en) * 1989-05-20 1993-11-02 Hitachi, Ltd. Semiconductor device and electronic apparatus using semiconductor device
US5038078A (en) * 1989-06-05 1991-08-06 Rca Licensing Corporation Degaussing coil attachment arrangement
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
US5053922A (en) * 1989-08-31 1991-10-01 Hewlett-Packard Company Demountable tape-automated bonding system
US5142444A (en) * 1989-08-31 1992-08-25 Hewlett-Packard Company Demountable tape-automated bonding system
US5003429A (en) * 1990-07-09 1991-03-26 International Business Machines Corporation Electronic assembly with enhanced heat sinking
US5175613A (en) * 1991-01-18 1992-12-29 Digital Equipment Corporation Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips
DE4129191C2 (de) * 1991-09-03 1994-08-11 Hartmut Ortlieb Verfahren zur Herstellung eines wasserdichten Reißverschlusses
JP2509027B2 (ja) * 1991-10-16 1996-06-19 三菱電機株式会社 半導体装置
DE4217597C2 (de) * 1992-05-27 1994-09-08 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine
DE4217596C2 (de) * 1992-05-27 1994-06-16 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte Bausteine
DE4217598A1 (de) * 1992-05-27 1993-12-02 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte hochintegrierte, gehäuselose Bausteine
DE4217599C2 (de) * 1992-05-27 1994-08-25 Siemens Nixdorf Inf Syst Einbausystem für auf Leiterplatten montierte, hochintegrierte, gehäuselose Bausteine
US5229917A (en) * 1992-07-24 1993-07-20 The United States Of America As Represented By The Secretary Of The Air Force VLSI integration into a 3-D WSI dual composite module
US5378924A (en) * 1992-09-10 1995-01-03 Vlsi Technology, Inc. Apparatus for thermally coupling a heat sink to a lead frame
US5539151A (en) * 1992-09-25 1996-07-23 Vlsi Technology, Inc. Reinforced sealing technique for an integrated-circuit package
DE4237632A1 (de) * 1992-11-07 1994-05-11 Export Contor Ausenhandelsgese Schaltungsanordnung
DE4310446C1 (de) * 1993-03-31 1994-05-05 Export Contor Ausenhandelsgese Schaltungsanordnung
US5367434A (en) * 1993-05-06 1994-11-22 Motorola, Inc. Electrical module assembly
US6021046A (en) * 1993-06-09 2000-02-01 Dallas Semiconductor Corporation Thermal protection of electrical elements systems
US5579206A (en) * 1993-07-16 1996-11-26 Dallas Semiconductor Corporation Enhanced low profile sockets and module systems
US5528463A (en) * 1993-07-16 1996-06-18 Dallas Semiconductor Corp. Low profile sockets and modules for surface mountable applications
JPH07147347A (ja) * 1993-11-25 1995-06-06 Matsushita Electric Ind Co Ltd 集積回路装置
US5881453A (en) * 1994-05-17 1999-03-16 Tandem Computers, Incorporated Method for mounting surface mount devices to a circuit board
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
US5754401A (en) * 1996-02-16 1998-05-19 Sun Microsystems, Inc. Pressure compliantly protected heatsink for an electronic device
JP3185682B2 (ja) * 1996-09-19 2001-07-11 株式会社村田製作所 放熱板付誘電体基板
CN1185702C (zh) * 1997-05-09 2005-01-19 时至准钟表股份有限公司 半导体封装的制造方法和集合电路基板
TW430959B (en) * 1998-04-22 2001-04-21 World Wiser Electronics Inc Thermal enhanced structure of printed circuit board
US6573119B1 (en) * 1999-02-17 2003-06-03 Hitachi, Ltd. Semiconductor device and method of manufacture thereof
US6137161A (en) * 1999-09-14 2000-10-24 International Business Machines Corporation Interposer array module for capacitive decoupling and filtering
JP2001251056A (ja) * 2000-03-03 2001-09-14 Sony Corp プリント配線基板の製造方法
US6249434B1 (en) 2000-06-20 2001-06-19 Adc Telecommunications, Inc. Surface mounted conduction heat sink
US6823586B2 (en) * 2002-05-29 2004-11-30 Meriton Networks Inc. Method of mounting a butterfly package on a PCB
US7142001B2 (en) * 2004-07-07 2006-11-28 Robert Bosch Gmbh Packaged circuit module for improved installation and operation
JP4634498B2 (ja) * 2008-11-28 2011-02-16 三菱電機株式会社 電力用半導体モジュール
CN103515340B (zh) * 2012-06-29 2016-09-07 三星电机株式会社 电源模块封装和用于制造电源模块封装的方法
CN103515364A (zh) * 2012-06-29 2014-01-15 三星电机株式会社 电源模块封装和用于制造电源模块封装的方法
TWI544868B (zh) * 2014-07-11 2016-08-01 台達電子工業股份有限公司 散熱模組及其結合方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696323A (en) * 1970-02-27 1972-10-03 Amp Inc Dip header
GB1374666A (en) * 1972-06-02 1974-11-20 Logic Dynamics Inc Assembly comprising a micro electronic package a bus strip and a printed circuit base
FR2456390A1 (fr) * 1979-05-11 1980-12-05 Thomson Csf Grille d'encapsulation, microboitier de circuit electronique utilisant cette grille et procede d'encapsulation de circuit electronique en microboitier
US4393581A (en) * 1980-01-22 1983-07-19 Amp Incorporated Method of forming leads on a lead frame
FR2489592A1 (fr) * 1980-09-02 1982-03-05 Thomson Csf Micro-boitier ceramique d'encapsulation de circuit electronique
US4396935A (en) * 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
EP0081419A3 (en) * 1981-12-03 1985-05-15 FAIRCHILD CAMERA & INSTRUMENT CORPORATION High lead count hermetic mass bond integrated circuit carrier
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
FR2565032B1 (fr) * 1984-05-25 1987-02-20 Inf Milit Spatiale Aeronaut Dispositif de repartition de potentiel electrique et boitier de composant electronique incorporant un tel dispositif

Also Published As

Publication number Publication date
US4812949A (en) 1989-03-14
DE3772078D1 (de) 1991-09-19
EP0239494A1 (fr) 1987-09-30
EP0239494B1 (fr) 1991-08-14
ES2025676T3 (es) 1992-04-01
JPH0550134B2 (OSRAM) 1993-07-28
FR2596607A1 (fr) 1987-10-02

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