JPS63239093A - Card module - Google Patents
Card moduleInfo
- Publication number
- JPS63239093A JPS63239093A JP62074907A JP7490787A JPS63239093A JP S63239093 A JPS63239093 A JP S63239093A JP 62074907 A JP62074907 A JP 62074907A JP 7490787 A JP7490787 A JP 7490787A JP S63239093 A JPS63239093 A JP S63239093A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- card module
- resin
- view
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明はカード用モジュールに係り、特にペレット封Ｉ
Ｅ技術に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a card module, and particularly to a pellet seal I
Regarding E-technology.
〈従来の技術〉
従来、この種のカード用モジュールは第５図、第６図に
示されているように基板５１．６１上にペレット５６．
６６を搭載し、該ペレット上部より樹脂５５，６５を滴
下してペレット５６．６６の表面を樹脂５５．６５で被
うことにより、封止していた。なお、５２は端子、６７
は接続用パッドをそれぞれ示している。また、６８は接
着材である。<Prior Art> Conventionally, this type of card module has a pellet 56.61 on a substrate 51.61, as shown in FIGS.
66 was mounted, resins 55 and 65 were dropped from above the pellets, and the surfaces of the pellets 56 and 66 were covered with the resins 55 and 65, thereby sealing them. In addition, 52 is a terminal, 67
indicate connection pads, respectively. Further, 68 is an adhesive material.
〈発明の解決しようとする問題点〉
上述した従来のカード用モジュールはペレットの封止に
液状樹脂を使用するので、液状樹脂の信頼性を評価しな
ければならないという問題点があった。また、外枠の型
を作ることが必要であり。<Problems to be Solved by the Invention> Since the above-described conventional card module uses liquid resin to seal the pellet, there is a problem in that the reliability of the liquid resin must be evaluated. It is also necessary to make a mold for the outer frame.
そのためにコストも高くなるばかりでなく反りや曲げに
も弱いので取り扱いにも注意しなければならないという
問題点もあった。さらに液状樹脂により封止した外観は
その上面が平坦でないことから製造履歴の調査用捺印に
おいても押印しにくいという問題点があった。This not only increases the cost, but also causes the problem that it is susceptible to warping and bending, so care must be taken when handling it. Furthermore, since the top surface of the exterior sealed with liquid resin is not flat, there is a problem in that it is difficult to stamp a seal for investigating the manufacturing history.
〈問題点を解決するための手段〉
本発明は基板と、該基板上に搭載されたベレットと、該
ペレットを被う樹脂封止材を含むカード用モジュールに
おいて、上記樹脂封止材は少なくともペレットを被うト
ランスファモールド成形品であることを特徴としている
。<Means for Solving the Problems> The present invention provides a card module including a substrate, a pellet mounted on the substrate, and a resin encapsulant covering the pellet, wherein the resin encapsulant covers at least the pellet. It is characterized by being a transfer molded product that covers the
〈作用〉
上記構成に係るカード用モジュールは基板にペレットを
搭載後、少なくともペレットをトランスファモールド成
形品の樹脂封止材で被う。<Function> In the card module having the above configuration, after the pellet is mounted on the substrate, at least the pellet is covered with a resin sealing material of a transfer molded product.
すなわち、上述した従来のカード用モジュールに対し、
本発明は基板にボンディングされたペレットに樹脂を圧
縮、成形による樹脂封止を行°なうという独創的内容を
有する。In other words, compared to the conventional card module mentioned above,
The present invention has an original content in that a pellet bonded to a substrate is compressed and molded to seal the pellet with resin.
〈実施例〉
次に１本発明の実施例について図面を参照して説明する
。<Example> Next, an example of the present invention will be described with reference to the drawings.
第１図は本発明の第１実施例を示す斜視図である。１１
は基板であり、基板１１の端子１２の部分を除いてトラ
ンスファモールドされている。FIG. 1 is a perspective view showing a first embodiment of the present invention. 11
is a board, and the parts of the board 11 except for the terminals 12 are transfer molded.
第２図は端子にコネクタ２４を取り付け、実際のカード
を完成した状態を示す斜視図である。従来例と違い、こ
のまま捺印やコーキングが出来るのでコスト低減になる
。さらにカードを多連にすると一度に多数のカードをト
ランスファできるので、より一層のコスト低減になる。FIG. 2 is a perspective view showing the state in which the connector 24 is attached to the terminal and the actual card is completed. Unlike conventional methods, stamping and caulking can be done as is, reducing costs. Furthermore, by connecting multiple cards, a large number of cards can be transferred at once, resulting in further cost reduction.
第３図は本発明の第２実施例を示す斜視図である。３３
はペレットをトランスファモールドしたものであるが、
この場合はペレットの回りだけをトランスファするよう
にする。FIG. 3 is a perspective view showing a second embodiment of the invention. 33
is made by transfer molding pellets,
In this case, only the area around the pellet should be transferred.
第４図はトランスファされた場所の断面図である。基板
に穴を開け、両面から模型にトランスファすることによ
り片面だけの方法より一層強度的に強くなるし、また樹
脂の回りも良くなる。この実施例ではバッテリー取り付
は部を有し、全体にトランスファモールドできない場合
等に有利である。FIG. 4 is a cross-sectional view of the transferred location. By drilling holes in the board and transferring it to the model from both sides, it becomes stronger than the method using only one side, and the resin also spreads better. In this embodiment, the battery is attached in a separate section, which is advantageous in cases where transfer molding cannot be performed entirely.
〈発明の効果〉
以上説明したように本発明はカード用モジュールのペレ
ットをトランスファモールドにより封止することにより
、外枠の型を作る必要がなく、コスト低減につながる。<Effects of the Invention> As explained above, according to the present invention, by sealing the pellet of the card module by transfer molding, there is no need to make a mold for the outer frame, leading to cost reduction.
また液状樹脂に比べ、樹脂を圧縮するので封止密度が大
きくなり、信頼性も高くなる。さらに反りや曲げ等に対
しても強くなるという効果がある。Furthermore, compared to liquid resin, since the resin is compressed, the sealing density is higher and reliability is also higher. Furthermore, it has the effect of becoming stronger against warping, bending, etc.
第１図は本発明の第１実施例の斜視図、第２図は第１実
施例にコネクタを取り付け、カード形にした状態の斜視
図、
第３図は本発明の第２実施例の斜視図、第４図は第３図
のＡ−Ａｆｉ断面図。
第５図は従来のカード用モジュールの斜視図、第６図は
第５図のＢ−Ｂ線断面図である。
１１．３１．４１．５１．６１
・・・・・・基板、
１２．３２．５２
・・・・・・端子、
１３、２３、３３、４３
・・・・・・トランスファモールド、
２４・・・・・・コネクタ、
３８・・・・・・バッテリー取り付は部。
３９・・・・・・チップ部品。
４７．６７・・・接続用パッド。
４６．５６．６６
・・・・・−・ペレット、
４８．６８・・・接着剤、
５５．６５・・・封止樹脂。
特許出願人 日本電気株式会社代理人 弁理
士 桑 井 清 −
第１図
第２図
第３図
第４図Fig. 1 is a perspective view of the first embodiment of the present invention, Fig. 2 is a perspective view of the first embodiment with a connector attached and made into a card shape, and Fig. 3 is a perspective view of the second embodiment of the invention. 4 is a sectional view taken along line A-Afi in FIG. 3. FIG. 5 is a perspective view of a conventional card module, and FIG. 6 is a sectional view taken along the line B--B in FIG. 11.31.41.51.61... Board, 12.32.52... Terminal, 13, 23, 33, 43... Transfer mold, 24... ...Connector, 38...Battery installation part. 39... Chip parts. 47.67... Connection pad. 46.56.66 ... Pellet, 48.68 ... Adhesive, 55.65 ... Sealing resin. Patent applicant Kiyoshi Kuwai, agent for NEC Corporation, patent attorney - Figure 1 Figure 2 Figure 3 Figure 4
Claims (1)
トを被う樹脂封止材を含むカード用モジュールにおいて
、上記樹脂封止材は少なくともペレットを被うトランス
ファモールド成形品であることを特徴とするカード用モ
ジュール。A card module including a substrate, a pellet mounted on the substrate, and a resin encapsulant covering the pellet, characterized in that the resin encapsulant is a transfer molded product covering at least the pellet. module for cards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62074907A JPS63239093A (en) | 1987-03-27 | 1987-03-27 | Card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62074907A JPS63239093A (en) | 1987-03-27 | 1987-03-27 | Card module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63239093A true JPS63239093A (en) | 1988-10-05 |
Family
ID=13560928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62074907A Pending JPS63239093A (en) | 1987-03-27 | 1987-03-27 | Card module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63239093A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296991A (en) * | 1987-05-29 | 1988-12-05 | 日立マクセル株式会社 | Memory cartridge |
| JPH0561900U (en) * | 1991-09-06 | 1993-08-13 | 株式会社トキメック | Contactless data carrier protector |
| US5717573A (en) * | 1994-08-05 | 1998-02-10 | International Business Machines Corporation | Interconnection card and methods for manufacturing and connecting the card |
| JP2013251414A (en) * | 2012-05-31 | 2013-12-12 | Mikuni Corp | Engine control unit |
-
1987
- 1987-03-27 JP JP62074907A patent/JPS63239093A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63296991A (en) * | 1987-05-29 | 1988-12-05 | 日立マクセル株式会社 | Memory cartridge |
| JPH0561900U (en) * | 1991-09-06 | 1993-08-13 | 株式会社トキメック | Contactless data carrier protector |
| US5717573A (en) * | 1994-08-05 | 1998-02-10 | International Business Machines Corporation | Interconnection card and methods for manufacturing and connecting the card |
| JP2013251414A (en) * | 2012-05-31 | 2013-12-12 | Mikuni Corp | Engine control unit |
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